AMD XC2V8000-4FFG1152I

Overview

XC2V8000-4FFG1152I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 8 million system gates, 46,592 CLB slices, 1,456 dedicated 18×18 multipliers, and 168 Digital Clock Manager (DCM) modules. It features 1,108 user I/Os in a 1152-pin flip-chip fine-pitch BGA (FFG1152) package, supporting LVDS, SSTL, HSTL, PCI-X, and DDR interfaces for telecom and high-speed data acquisition systems.

For engineers reviewing the XC2V8000-4FFG1152I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support, DCM timing parameters, SelectRAM memory configurations, and industrial temperature-range validation - all critical for legacy requalification, long-life embedded control, and high-reliability signal processing designs.

Technical Context

The XC2V8000-4FFG1152I implements a 0.15 µm/0.12 µm 8-layer metal CMOS process with SRAM-based configuration, 1.5 V core voltage (VCCINT), and separate 3.3 V auxiliary (VCCAUX) and programmable I/O (VCCO) supplies. Its architecture integrates Configurable Logic Blocks (CLBs), 18-Kb dual-port Block SelectRAM, Digitally Controlled Impedance (DCI) I/O, and Active Interconnect routing with predictable delay independent of fanout.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements, carry chains, and horizontal cascading; each IOB supports single- or double-data-rate (DDR) registers with 19 single-ended and 6 differential I/O standards. The 168 DCMs provide fully digital clock de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution).

Key Specifications

Pinout & Package

XC2V8000-4FFG1152I uses the FF1152 flip-chip fine-pitch BGA package (1.00 mm pitch, 35 mm × 35 mm body size), optimized for thermal dissipation and high I/O count. Pin definitions follow Xilinx DS031 Module 4, with 1,108 user I/O pads plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V8000-4FFG1152I, the XCVU3P-2FFVA2104I delivers 3× higher serial bandwidth but abandons DCM-based deterministic clocking, while the XC6VLX760-3FFG1759C reduces I/O count and thermal robustness - making XC2V8000-4FFG1152I uniquely suited for legacy telecom and defense systems demanding proven industrial reliability and PCI-X/LVDS interoperability.

Availability

XC2V8000-4FFG1152I is available at Aetrix Electronics and suitable for telecom infrastructure, radar signal processing, high-speed test equipment, and industrial motion control applications requiring stable component supply across extended product lifecycles.

Supply support for XC2V8000-4FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.

The Virtex-II family was engineered for high-speed, high-density logic implementation in telecommunications, networking, and DSP applications - emphasizing deterministic timing, I/O flexibility, and system-level integration with PCI-X, DDR, and LVDS interfaces.

FAQ

What is the maximum operating junction temperature for XC2V8000-4FFG1152I?

The XC2V8000-4FFG1152I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is validated per Xilinx DS031 Module 3, ensuring reliable functionality in thermally demanding environments such as base station RF modules and industrial motor drives where ambient temperatures exceed commercial-grade limits. The XC2V8000-4FFG1152I's flip-chip packaging enhances thermal conductivity to sustain continuous operation at maximum junction temperature.

Does XC2V8000-4FFG1152I support DDR2 memory interfaces?

XC2V8000-4FFG1152I does not natively support DDR2 SDRAM interfaces. Its I/O standards include DDR SDRAM (single-data-rate DDR), but DDR2-specific timing, on-die termination, and command encoding are not implemented in the Virtex-II architecture. The XC2V8000-4FFG1152I supports SDR/DDR SDRAM, QDR SRAM, and RLDRAM, as documented in DS031 Module 1. For DDR2, later families like Virtex-4 or Spartan-3A are required. XC2V8000-4FFG1152I remains optimal for legacy DDR and QDR-based systems.

Can XC2V8000-4FFG1152I be configured via JTAG boundary scan?

Yes, XC2V8000-4FFG1152I supports IEEE 1149.1-compliant boundary-scan configuration through its dedicated TCK, TMS, TDI, and TDO pins. This mode enables in-system programming, configuration verification, and debug access without requiring additional configuration PROMs or microcontrollers. The XC2V8000-4FFG1152I also supports IEEE 1532 for standardized configuration data exchange. All boundary-scan operations are fully tested and factory-verified per DS031 Module 1.

What is the purpose of the HSWAP_EN pin on XC2V8000-4FFG1152I?

The HSWAP_EN pin on XC2V8000-4FFG1152I controls hot-swap I/O bank configuration during power-up. When pulled High, it enables weak pull-up/pull-down resistors on I/O pins before configuration, preventing floating states and bus contention in live-insertion systems. When pulled Low or left unconnected, internal weak pull-ups are disabled. This feature is critical for backplane applications where boards are inserted into powered chassis. The XC2V8000-4FFG1152I's behavior is defined in DS031 Module 2, Section "Configuration".

Is XC2V8000-4FFG1152I compatible with Xilinx ISE 14.7 software?

No, XC2V8000-4FFG1152I requires Xilinx ISE Design Suite versions 6.3 through 10.1, with full support ending at ISE 10.1. ISE 14.7 targets 7-series and newer devices and does not include Virtex-II device models, libraries, or place-and-route algorithms. Legacy projects must use archived ISE versions; no official migration path exists to Vivado. For ongoing maintenance, XC2V8000-4FFG1152I users should retain licensed ISE 10.1 installations and associated IP cores. XC2V8000-4FFG1152I is not supported in any version of Vivado.