AMD XC2V8000-5FF1152I

Overview

XC2V8000-5FF1152I from Xilinx is an 8-million-system-gate Virtex-II platform FPGA in a 1152-pin flip-chip fine-pitch BGA package, operating over –40°C to +100°C industrial temperature range. It integrates 46,592 CLBs, 1,456 dedicated 18×18 multipliers, 168 Digital Clock Managers (DCMs), and supports up to 1,108 user I/Os with SelectIO-Ultra technology for LVDS, SSTL, HSTL, and PCI-X interfaces. It is deployed in high-bandwidth telecom line cards requiring deterministic clock management and embedded memory.

For engineers reviewing the XC2V8000-5FF1152I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (1,108), DCM count (168), core voltage (1.5 V), speed grade (-5), and flip-chip thermal performance in dense backplane designs.

Technical Context

The XC2V8000-5FF1152I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-aligned clocks from integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements, carry chains, and horizontal cascade logic; block SelectRAM provides 18-Kb dual-port RAM configurable from 16K×1 to 512×36, with associated 18×18 multipliers enabling efficient read-multiply-accumulate operations.

Key Specifications

Pinout & Package

XC2V8000-5FF1152I uses a 1152-ball flip-chip fine-pitch BGA (FF1152) with 1.00 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction optimized for high-power density applications. Pin definitions follow Xilinx DS031 Module 4, with dedicated banks for VCCINT (1.5 V), VCCAUX (3.3 V), and per-bank VCCO (1.5/1.8/2.5/3.3 V).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC2V8000-5FF1152I, the XC5VLX330T offers lower static power and mature toolchain support but sacrifices 60% logic capacity and 35% I/O count; the XCVU3P delivers superior throughput and integration but mandates complete architectural re-architecting.

Availability

XC2V8000-5FF1152I is available at Aetrix Electronics and suitable for telecom infrastructure, avionics data concentrators, and high-end test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2V8000-5FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as its flagship high-performance FPGA platform for demanding system-level applications.

The Virtex-II product line was engineered for wireline/wireless infrastructure and high-speed signal processing, emphasizing deterministic timing, large embedded memory, and robust I/O flexibility across industrial temperature ranges.

FAQ

What is the maximum guaranteed internal clock frequency for XC2V8000-5FF1152I?

The XC2V8000-5FF1152I speed grade -5 guarantees a maximum internal clock frequency of 420 MHz under industrial temperature conditions (–40°C to +100°C), as specified in DS031 Module 3. This rating applies to fully routed, timing-closed designs meeting setup/hold constraints. The actual achievable frequency depends on logic depth, routing congestion, and DCM configuration - typical production designs achieve 350–380 MHz sustained operation.

Does XC2V8000-5FF1152I support JTAG boundary-scan testing?

Yes, XC2V8000-5FF1152I fully complies with IEEE 1149.1 (JTAG) and supports EXTEST, INTEST, HIGHZ, SAMPLE, and BYPASS instructions. Its Test Access Port (TAP) includes TCK, TMS, TDI, TDO, and TRST pins, enabling board-level interconnect testing, in-system programming, and configuration verification. Boundary-scan capability is factory-tested and documented in DS031 Module 2.

What I/O standards are supported by XC2V8000-5FF1152I with Digitally Controlled Impedance (DCI)?

XC2V8000-5FF1152I supports DCI for LVDCI (1.5/1.8/2.5/3.3 V), HSTL Classes I–IV, SSTL Classes I/II (1.8/2.5/3.3 V), GTL/GTLP, and LVDS_25/LVDSEXT_25. DCI provides on-die series or split termination matching reference resistors, eliminating external components and improving signal integrity for point-to-point links. Configuration is done via IOSTANDARD attributes in Xilinx ISE tools.

Can XC2V8000-5FF1152I perform partial reconfiguration in the field?

Yes, XC2V8000-5FF1152I supports partial reconfiguration as defined in DS031 Module 1. It allows dynamic loading of logic modules into designated regions without resetting the entire device or disrupting active functions. This capability is used in telecom systems for protocol stack updates and in test equipment for waveform format switching - enabled via Xilinx's Partial Reconfiguration flow in ISE 10.x and later.

What is the role of the VCCAUX supply in XC2V8000-5FF1152I?

VCCAUX is a dedicated 3.3 V auxiliary supply powering internal configuration circuitry, JTAG TAP controller, DCMs, SelectRAM address decoders, and I/O bank control logic in XC2V8000-5FF1152I. It must be stable within ±5% and ramped monotonically during power-up. Unlike VCCO (which varies per I/O bank), VCCAUX is global and non-adjustable - failure to meet its specification causes configuration failure or intermittent DCM lock loss.