AMD XC2V8000-5FF1517I

Overview

XC2V8000-5FF1517I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 8 million system gates, 46,592 configurable logic blocks (CLBs), 1,456 dedicated 18×18 multipliers, and 168 Digital Clock Manager (DCM) modules. It features 1,108 user I/Os in a 1517-pin flip-chip fine-pitch BGA package (FF1517), supporting LVDS, PCI-X, SSTL, HSTL, and DCI I/O standards for telecom, networking, and high-speed DSP applications.

For engineers reviewing the XC2V8000-5FF1517I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support, DCM timing parameters, CLB resource mapping, and industrial temperature-range performance specifications - all confirmed from Xilinx DS031 (v3.5) November 2007.

Technical Context

The XC2V8000-5FF1517I implements a fully SRAM-based, reprogrammable logic array built on a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates Configurable Logic Blocks (CLBs), 18-Kb dual-port Block SelectRAM™, dedicated 18×18 multipliers, and 168 DCMs with precise de-skew, frequency synthesis, and ±1/256-cycle phase shifting.

Routing uses Active Interconnect Technology with hierarchical segmented resources: 24 long lines per row/column, 120 hex lines, 40 double lines, and 16 direct-connect lines. All IOBs support DDR input/output registers, Digitally Controlled Impedance (DCI), and 19 single-ended + 6 differential I/O standards including LVDS (840 Mb/s), PCI-X (133 MHz), and SSTL-2/3.

Key Specifications

Pinout & Package

XC2V8000-5FF1517I is housed in a 1517-ball flip-chip fine-pitch BGA (FF1517) with 1.00 mm pitch, 40 mm × 40 mm body size, and 1,108 user I/Os. The package supports thermal dissipation required for high-gate-count operation and enables dense routing via flip-chip interconnect.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V6000-5FF1152I and XC2V4000-5FF1517I, the XC2V8000-5FF1517I delivers 33% more CLBs and 20% more I/Os than the XC2V6000, and 100% more gates than the XC2V4000 - making it the only Virtex-II variant capable of monolithic implementation of full OC-192 framer + ATM segmentation/reassembly + security acceleration.

Availability

XC2V8000-5FF1517I is available at Aetrix Electronics and suitable for telecom infrastructure, defense radar processing, medical imaging systems, and high-end networking equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2V8000-5FF1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.

The Virtex-II family was engineered for high-speed, high-density applications in telecommunications, wireless infrastructure, and DSP-intensive systems - delivering scalable logic, memory, and clocking resources in a single SRAM-based platform.

FAQ

What is the maximum operating frequency of the XC2V8000-5FF1517I core logic?

The XC2V8000-5FF1517I supports internal clock speeds up to 420 MHz, as specified in Xilinx DS031 (v3.5). This applies to synchronous logic paths within the CLB array under typical industrial conditions (–40°C to +100°C) and speed grade –5. Actual achievable frequency depends on design placement, routing, and timing closure - verified using Xilinx ISE software with -5 timing models.

Does the XC2V8000-5FF1517I support JTAG boundary-scan testing?

Yes, the XC2V8000-5FF1517I fully complies with IEEE 1149.1 (JTAG) and IEEE 1532 standards. Its Test Access Port (TAP) supports EXTEST, INTEST, HIGHZ, BYPASS, PRELOAD, SAMPLE, IDCODE, and USERCODE instructions. Boundary-scan testing is enabled by default after configuration and allows full I/O pin control and interconnect verification without external test fixtures.

What I/O standards are supported by the XC2V8000-5FF1517I with Digitally Controlled Impedance (DCI)?

The XC2V8000-5FF1517I supports DCI for LVDCI (1.5V–3.3V), SSTL, HSTL, GTL, GTLP, and LVDS_25_DCI/LVDSEXT_25_DCI. DCI provides on-die series or split termination matching board trace impedance - eliminating external resistors and improving signal integrity for high-speed parallel buses and memory interfaces.

Can the XC2V8000-5FF1517I be configured via SPI flash memory?

No, the XC2V8000-5FF1517I does not support native SPI flash configuration. It supports Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 boundary-scan modes. External configuration PROMs must use x8 or x16 parallel interface (e.g., XCFxxP series) or microprocessor-controlled SelectMAP over 8-/16-bit bus. SPI requires external bridge logic or microcontroller emulation.

Is partial reconfiguration supported on the XC2V8000-5FF1517I?

Yes, the XC2V8000-5FF1517I supports hardware-accelerated partial reconfiguration as defined in Xilinx documentation. This allows dynamic replacement of specific logic modules (e.g., protocol engines or filter coefficients) while the rest of the design remains operational - critical for adaptive radio, runtime security updates, and multi-standard baseband processing.