AMD XC2V8000-5FFG1152C

Overview

XC2V8000-5FFG1152C from Xilinx is a high-density Virtex-II platform FPGA with 8 million system gates, 46,592 configurable logic blocks (CLBs), 1,456 dedicated 18×18 multipliers, and 168 Digital Clock Manager (DCM) modules. It features 1,108 user I/Os in a 1152-pin flip-chip fine-pitch BGA package, supporting LVDS, PCI-X, DDR, and HSTL interfaces for telecom, networking, and video processing systems.

For engineers reviewing the XC2V8000-5FFG1152C datasheet, pinout, applications, or equivalent options, this device delivers deterministic timing, on-chip digitally controlled impedance (DCI), dual-port Block SelectRAM up to 3 Mb, and IEEE 1149.1 boundary-scan compliance - critical for high-speed synchronous design validation and production testability.

Technical Context

The XC2V8000-5FFG1152C implements Xilinx's IP-Immersion architecture with a 0.15 µm/0.12 µm 8-layer metal CMOS process, enabling 420 MHz internal clock speeds and 840+ Mb/s I/O performance. Its routing uses fourth-generation Active Interconnect Technology with predictable delay independent of fanout.

Each IOB supports single-ended (LVTTL, LVCMOS, SSTL, HSTL, GTL) and differential (LVDS, BLVDS, LDT, LVPECL) standards, with programmable sink current (2–24 mA) and on-chip DCI termination. The 168 DCMs provide precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period resolution).

Key Specifications

Pinout & Package

XC2V8000-5FFG1152C is housed in a 1152-ball flip-chip fine-pitch BGA (FF1152) package with 1.00 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction optimized for high I/O count and signal integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V6000-5FF1152C, XC2V8000-5FFG1152C offers 33% more logic, 37% more multipliers, and 17% more I/Os - critical for scaling packet processing pipelines or adding redundant safety logic. Against XCVU9P-2FLGA2104I, it lacks transceivers and hardened IP but provides proven reliability in long-lifecycle telecom deployments where obsolescence risk is managed via Aetrix continuity programs.

Availability

XC2V8000-5FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and broadcast video equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2V8000-5FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family for high-performance programmable logic solutions in communications and computing.

The Virtex-II product line was engineered for demanding applications requiring high-speed I/O, deterministic timing, and large-scale logic integration - particularly in telecom line cards, network switches, and video processing platforms.

FAQ

What is the maximum operating junction temperature for XC2V8000-5FFG1152C?

The XC2V8000-5FFG1152C is rated for commercial temperature range (0°C to +85°C). Its maximum operating junction temperature is +100°C under specified thermal conditions, as defined in DS031 Module 3. This rating assumes proper PCB thermal design with adequate copper pour and airflow per Xilinx AN119 guidelines.

Does XC2V8000-5FFG1152C support partial reconfiguration?

Yes, XC2V8000-5FFG1152C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This capability allows dynamic modification of specific logic regions without resetting the entire device, enabling adaptive hardware functions in protocols like DOCSIS or wireless baseband processing.

What configuration modes are supported by XC2V8000-5FFG1152C?

XC2V8000-5FFG1152C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and boundary-scan (IEEE 1532). These modes enable flexible integration with microcontrollers, flash memory, JTAG debuggers, and automated test equipment during development and production.

Is XC2V8000-5FFG1152C RoHS compliant?

XC2V8000-5FFG1152C is not RoHS compliant in its original production form. Xilinx offered Pb-free variants under different part numbering (e.g., suffix "G" for green packaging), but the -5FFG1152C variant uses leaded solder spheres. For RoHS requirements, consult Aetrix for verified legacy-compliant alternatives or migration paths.

Can XC2V8000-5FFG1152C interface directly with DDR2 SDRAM?

XC2V8000-5FFG1152C does not include hardened DDR2 PHY logic, but its SelectIO-Ultra I/Os support SSTL_18_I/II standards and programmable delays, enabling reliable DDR2 interface implementation via user-defined logic and DCM-controlled clocking - validated in Xilinx XAPP466 reference design.