AMD XC2V80-4FG256I

Overview

XC2V80-4FG256I from Xilinx is a 80K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FG256) package, rated for industrial temperature range (–40°C to +100°C), with 120 user I/Os, 512 CLB slices, and 16 dedicated 18×18 multipliers - deployed in high-speed communication line cards requiring reconfigurable logic for protocol adaptation and data path acceleration.

For engineers reviewing the XC2V80-4FG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM-based clock management, and real-world deployment context for telecom and embedded vision systems.

Technical Context

The XC2V80-4FG256I implements a SRAM-based, 0.15 µm/0.12 µm 8-layer metal FPGA architecture with four primary logic resources: Configurable Logic Blocks (CLBs), Block SelectRAM (18 Kb dual-port RAM), 18×18 multipliers, and Digital Clock Managers (DCMs). It features Digitally Controlled Impedance (DCI) for on-die termination across LVCMOS, SSTL, and HSTL standards.

Its routing uses Active Interconnect Technology with 24 long lines per row/column, hierarchical switch matrices, and predictable delay independent of fanout. Configuration supports Slave/Master SelectMAP and IEEE 1532 boundary-scan, with optional Triple-DES bitstream encryption and readback capability for debug.

Key Specifications

Pinout & Package

XC2V80-4FG256I uses the FG256 (Fine-Pitch BGA, 1.00 mm pitch, 17 mm × 17 mm) package with 256 balls arranged in a 16×16 array. It includes 120 user I/Os, 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD), and power/ground balls distributed for signal integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC2V100-4FG256I and XC2V80-5FG256I, the XC2V80-4FG256I offers optimal balance of logic capacity, I/O count, and timing margin for mid-scale telecom and vision applications - avoiding overdesign while ensuring industrial-temperature reliability and proven toolchain support in Xilinx Foundation/Alliance flows.

Availability

XC2V80-4FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial imaging, and test equipment requiring stable component supply, long-lifecycle support, and traceable sourcing for production programs.

Supply support for XC2V80-4FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.

The Virtex-II family was designed for high-density, high-speed applications in telecommunications, networking, video, and DSP - delivering IP-core integration, robust clock management, and advanced I/O flexibility in a single platform.

FAQ

What is the maximum operating temperature range for XC2V80-4FG256I?

The XC2V80-4FG256I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating is confirmed by the "I" suffix in the part number and validated in DS031 Module 1, Section "Virtex-II Ordering Examples". The device maintains full timing compliance and I/O standard support across this range when powered with specified VCCINT (1.5 V ±3%), VCCAUX (3.3 V ±5%), and per-bank VCCO voltages.

Does XC2V80-4FG256I support LVDS signaling, and what are the electrical requirements?

Yes, XC2V80-4FG256I supports LVDS signaling with dedicated current-mode drivers. Per DS031 Module 2, Table 2, it supports LVDS_25 and LVDS_33 standards requiring VCCO = 2.5 V or 3.3 V respectively, with output differential voltage (VOD) of 0.25–0.40 V. Termination must be 100 Ω differential across the pair; DCI does not apply to LVDS, so external termination is required.

How many Digital Clock Managers (DCMs) are available in XC2V80-4FG256I?

The XC2V80-4FG256I contains four Digital Clock Managers (DCMs), as specified in Table 1 ("Virtex-II Family Members") of DS031 Module 1. Each DCM provides fully digital clock de-skew, multiplication/division (M/D ratio), coarse/fine phase shifting, and jitter filtering - enabling robust clock domain crossing and high-precision timing control in complex designs.

Can XC2V80-4FG256I be configured via JTAG, and what standards does it comply with?

Yes, XC2V80-4FG256I supports IEEE 1149.1 (JTAG) boundary-scan configuration and debugging. As stated in DS031 Module 1, Section "Boundary Scan", it implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions. Configuration via JTAG follows IEEE 1532, allowing in-system programming and readback of configuration memory and internal states.

What is the total block RAM capacity of XC2V80-4FG256I, and how is it organized?

The XC2V80-4FG256I integrates eight 18-Kb Block SelectRAM modules, totaling 144 Kbits of dedicated dual-port RAM. As documented in DS031 Module 1, Table 1 and Module 2, Section "Block SelectRAM Memory", each block is independently configurable from 16K×1 to 512×36 bits, supports three read-during-write modes, and can be cascaded to build larger memory structures without consuming CLB resources.