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AMD XC2V80-4FGG256I
- Part No.:
- XC2V80-4FGG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2V80-4FGG256I.pdf
- Description:
- IC FPGA 120 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,451
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Product details
Overview
XC2V80-4FGG256I from Xilinx is a 80K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, operating over –40°C to +100°C industrial temperature range. It integrates 512 Configurable Logic Blocks (CLBs), 16 dedicated 18×18 multipliers, 8 Digital Clock Managers (DCMs), and supports up to 120 user I/Os with SelectIO-Ultra technology for LVDS, SSTL, HSTL, and PCI-compliant interfaces. It is used in high-speed telecom line-card control and DSP-accelerated video processing systems.
For engineers reviewing the XC2V80-4FGG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support, DCM timing parameters, CLB resource mapping, and industrial-grade thermal performance data - all specific to the XC2V80-4FGG256I variant.
Technical Context
The XC2V80-4FGG256I implements a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture includes four-slice CLBs, dual-port 18-Kb Block SelectRAM, Digitally Controlled Impedance (DCI) for on-die termination, and 16 global clock multiplexer buffers driven by up to 8 DCMs.
Each IOB supports single-ended (LVTTL, LVCMOS, SSTL, HSTL, PCI-X) and differential (LVDS, BLVDS, LVPECL) signaling, with DDR input/output registers clocked by phase-opposed DCM outputs. The device uses Active Interconnect Technology with 24 long lines per row/column and predictable routing delay independent of fanout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 80,000 - defines logic density for synthesis targeting and place-and-route capacity |
| Configurable Logic Blocks (CLBs) | 512 - each contains 4 slices with dual LUTs, flip-flops/latches, carry chains, and horizontal cascade |
| Block SelectRAM (18 Kb) | 8 blocks - provide dual-port RAM configurable from 16K×1 to 512×36 bits with read-during-write modes |
| Digital Clock Managers (DCMs) | 8 - deliver de-skewed clocks, ±1/256-period phase shift, and M/D frequency synthesis |
| User I/O Pins | 120 - supports 19 single-ended and 6 differential I/O standards including LVDS at 840 Mb/s |
| Multiplier Blocks (18×18) | 16 - enable pipelined MAC operations and efficient FIR filter implementation |
| Core Voltage (VCCINT) | 1.5 V ±3% - determines internal switching speed and dynamic power consumption |
Pinout & Package
XC2V80-4FGG256I uses the FGG256 package: a Pb-free, wire-bond, fine-pitch BGA with 1.00 mm pitch, 17 mm × 17 mm body size, and 256 balls arranged in a 16×16 array. Of these, 120 are user-configurable I/Os; 15 are dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD); and the remainder supply and ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives master serial or slave serial configuration; synchronous to bitstream loading |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful configuration completion |
| M0–M2 | Mode Selection Inputs | Set configuration mode (slave-serial, master-serial, SelectMAP, boundary-scan) at power-up |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts boot process |
| TCK/TDI/TDO/TMS | JTAG Test Access Port | IEEE 1149.1-compliant interface for boundary-scan testing and IEEE 1532 programming |
| VCCINT | Core Power Supply | 1.5 V supply for CLBs, DCMs, and internal routing; requires low-noise decoupling |
| VCCAUX | Auxiliary Power Supply | 3.3 V supply for DCMs, configuration logic, and JTAG circuitry; must be stable before VCCINT |
| VCCO | I/O Power Supply | Programmable per-bank voltage (1.5 V to 3.3 V) setting I/O standard compliance and drive strength |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series or split termination for HSTL/SSTL/LVDCI standards eliminates external resistors and improves signal integrity |
| DDR I/O Registers | Integrated input/output DDR registers per IOB enable precise timing alignment without external PHY logic |
| 18×18 Multiplier Blocks | Dedicated hardware multipliers reduce DSP logic utilization and improve MAC throughput in filter designs |
| Block SelectRAM Dual-Port RAM | 8 × 18-Kb dual-port RAM blocks support simultaneous read/write access for FIFOs and frame buffers |
| Digital Clock Manager (DCM) | 8 fully digital DCMs provide jitter-free clock multiplication, division, and sub-cycle phase adjustment for synchronous design |
Applications
| Telecom Line Card Control | Video Frame Processing |
|---|---|
Use Scenario: Real-time packet classification and header modification in OC-48/STM-16 line cards. IC Role / Device Role / Timing Role: Programmable logic fabric implementing custom packet parsers, TCAM emulation, and SERDES glue logic. Use Value: 120 I/Os support parallel bus interfaces to multiple PHYs and memory controllers; DCMs synchronize multi-clock domains across packet buffers and control processors. |
Use Scenario: HD video scaling and color-space conversion in broadcast encoders. IC Role / Device Role / Timing Role: Reconfigurable accelerator for pixel-level arithmetic, line buffering, and chroma subsampling. Use Value: 16 dedicated multipliers and 8 Block SelectRAMs enable parallel 2D FIR filtering and real-time frame buffering without external DRAM. |
| Industrial Motion Controller | PCI-Based Data Acquisition |
Use Scenario: Closed-loop servo control with multi-axis interpolation and encoder feedback processing. IC Role / Device Role / Timing Role: Deterministic logic engine executing position loop algorithms and generating PWM waveforms with sub-microsecond jitter. Use Value: 8 DCMs allow independent, phase-aligned clocks for encoder sampling, PWM generation, and host interface timing - critical for <1 µs jitter tolerance. |
Use Scenario: High-throughput analog-to-digital acquisition system with PCI bus mastering and DMA. IC Role / Device Role / Timing Role: PCI interface controller and real-time data formatter bridging ADCs to host memory via 33/66 MHz PCI bus. Use Value: PCI-compliant I/Os (3.3 V, 66 MHz) and 120 user pins enable full 32-bit/66 MHz PCI interface plus local memory and trigger logic in one device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V100-4FGG256I | 100K gates, 640 CLBs, 20 multipliers, 10 DCMs, 172 I/Os - higher density and I/O count in same package | Supports larger state machines and wider datapaths; suitable when XC2V80-4FGG256I resources are insufficient | Select if design requires >512 CLBs or >120 I/Os while retaining FGG256 footprint and industrial temp rating |
| XC2V80-5FGG256I | Same logic resources but -5 speed grade - guarantees 20% faster internal timing (e.g., 400 MHz vs 333 MHz CLB toggle rate) | Enables higher clock frequencies in timing-critical paths; required for designs exceeding -4 grade timing closure | Choose when XC2V80-4FGG256I fails static timing analysis at target frequency; no PCB change needed |
Compared with XC2V80-4FGG256I, XC2V100-4FGG256I offers more logic and I/O in identical packaging for scalability, while XC2V80-5FGG256I provides guaranteed higher-speed operation without layout modification - both preserve pin compatibility and industrial temperature support.
Availability
XC2V80-4FGG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and broadcast video equipment requiring stable component supply across extended lifecycle and industrial temperature operation.
Supply support for XC2V80-4FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.
The Virtex-II family was designed for high-density, high-speed applications in telecommunications, networking, and DSP - delivering platform-level integration of logic, memory, arithmetic, and clock management in a single chip.
FAQ
What is the maximum operating junction temperature for XC2V80-4FGG256I?
The XC2V80-4FGG256I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is guaranteed under specified VCCINT, VCCAUX, and VCCO supply conditions and thermal derating curves defined in DS031 Module 3. Thermal design must ensure case temperature remains within limits using appropriate heatsinking or airflow for sustained 100°C operation.
Does XC2V80-4FGG256I support LVDS I/O at 840 Mb/s?
Yes, XC2V80-4FGG256I supports LVDS I/O at up to 840 Mb/s as specified in the Virtex-II SelectIO-Ultra documentation. This performance requires proper PCB layout (controlled impedance, matched trace lengths), correct VCCO = 2.5 V or 3.3 V per bank, and use of dedicated LVDS_25 or LVDS_33 IOSTANDARD attributes in the implementation toolchain.
How many Block SelectRAM modules does XC2V80-4FGG256I contain?
XC2V80-4FGG256I contains 8 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. These blocks support configurations from 16K×1 to 512×36 bits, with three read-during-write modes and cascading capability for larger memory structures - confirmed in Table 1 of DS031 Module 1.
Is XC2V80-4FGG256I pin-compatible with other Virtex-II devices in FGG256 packaging?
Yes, all Virtex-II devices offered in FG256/FGG256 packages - including XC2V40, XC2V80, and XC2V250 - share identical pinouts and footprint. This allows direct substitution within the same package family when logic resource requirements change, provided power delivery and thermal design accommodate the new device's current draw.
What configuration modes are supported by XC2V80-4FGG256I?
XC2V80-4FGG256I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is controlled by M0–M2 pins at power-up, and configuration data can be encrypted using on-chip DES/3DES decryptors as documented in DS031 Module 2.
XC2V80-4FGG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 128
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 147456
- Number of I/O:
- 120
- Number of Gates:
- 80000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2V80-4FGG256I FAQ
1.How can I place an order for XC2V80-4FGG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V80-4FGG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V80-4FGG256I reliable?
The price and inventory of XC2V80-4FGG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V80-4FGG256I is usually 5 days.
3.What payment methods are accepted for XC2V80-4FGG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V80-4FGG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V80-4FGG256I?
XC2V80-4FGG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V80-4FGG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V80-4FGG256I?
For technical support, including XC2V80-4FGG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V80-4FGG256I requirements.
6.How does Aetrix verify that XC2V80-4FGG256I is sourced from the original manufacturer or authorized distributors?
All XC2V80-4FGG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V80-4FGG256I meets industry standards.
7.What is the process for return or replacement of XC2V80-4FGG256I?
All XC2V80-4FGG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V80-4FGG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V80-4FGG256I part is unused and in its original packaging.
Return procedure for XC2V80-4FGG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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