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AMD XC2V80-5FG256I
- Part No.:
- XC2V80-5FG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2V80-5FG256I.pdf
- Description:
- IC FPGA 120 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,129
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Product details
Overview
XC2V80-5FG256I from Xilinx is a 80K-system-gate Virtex-II platform FPGA with 512 Configurable Logic Blocks (CLBs), 16 dedicated 18×18 multipliers, and 8 Digital Clock Managers (DCMs). It features 120 user I/Os in a 256-pin Fine-Pitch BGA (FG256) package, operates at industrial temperature (–40°C to +100°C), and supports LVDS, PCI-X, and DDR interfaces for high-speed telecom and DSP applications.
For engineers reviewing the XC2V80-5FG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its 1.5V core supply, DCI-enabled on-die termination for HSTL/SSTL/LVCMOS I/Os, dual-port 18-Kb Block SelectRAM resources, and DCM-based clock de-skew and phase-shifting capabilities.
Technical Context
The XC2V80-5FG256I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support single-ended (LVTTL, LVCMOS, PCI-X, SSTL, HSTL) and differential (LVDS, BLVDS, LVPECL) standards, with Digitally Controlled Impedance (DCI) for on-chip series or split termination.
Internally, it integrates 512 CLBs (each with two 4-LUTs and dual flip-flops), eight 18-Kb dual-port Block SelectRAM modules (totaling 144 Kb RAM), and eight DCMs offering precise clock multiplication, division, and ±1/256-cycle phase adjustment - all synchronized to a 1.5V VCCINT and 3.3V VCCAUX supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 80,000 - defines logic capacity for complex digital systems |
| Configurable Logic Blocks (CLBs) | 512 - each contains 8 LUTs and 8 registers for combinatorial + synchronous logic |
| User I/O Pins | 120 - available in FG256 package with support for 19 single-ended and 6 differential standards |
| Block RAM (SelectRAM) | 8 × 18-Kb dual-port blocks (144 Kb total) - enables embedded FIFOs, buffers, and memory-mapped peripherals |
| Digital Clock Managers (DCMs) | 8 - provide jitter-free clock synthesis, de-skew, and fine-grained phase shifting (±1/256 period) |
| Multiplier Blocks | 16 × 18-bit × 18-bit - accelerate DSP filtering, FFT, and arithmetic-intensive functions |
| Core Supply Voltage (VCCINT) | 1.5 V ± 3% - low-voltage operation reduces dynamic power and enables high-density routing |
Pinout & Package
XC2V80-5FG256I uses the FG256 (Fine-Pitch Ball Grid Array) package: 1.00 mm pitch, 17 mm × 17 mm body, 16 × 16 array, with 256 solder balls including 120 user I/Os, 15 dedicated configuration/control pins (e.g., CCLK, DONE, M0–M2, PROG_B), and power/ground balls distributed across the array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master/slave serial or SelectMAP modes |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading and device initialization |
| M0–M2 | Mode Selection Inputs | Set configuration mode (slave-serial, master-serial, slave SelectMAP, etc.) at power-up |
| PROG_B | Program Initiate Input | Active-low signal that resets configuration memory and initiates reconfiguration |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming, debugging, and verification |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series/split termination for HSTL, SSTL, LVCMOS, and LVDS - eliminates external resistors and improves signal integrity |
| DDR I/O Registers | Dual-edge capture/transmit per I/O pair using phase-opposed clocks from DCM - enables true 840 Mb/s source-synchronous data transfer |
| Block SelectRAM Flexibility | Configurable as 16K×1 to 512×36 dual-port RAM with three read-during-write modes - supports asynchronous FIFOs and ping-pong buffering |
| Global Clock Distribution | 16 global clock MUX buffers with glitch-free switching between two inputs - ensures robust clock domain crossing and low-skew timing |
| Triple-DES Bitstream Encryption | Optional on-chip decryption using one or two DES key sets - protects intellectual property in field-deployed configurations |
Applications
| Telecom Line Card Interface | Industrial Motion Control |
|---|---|
Use Scenario: High-speed serial data aggregation between framer ASICs and backplane interfaces in TDM/Packet-over-SONET systems. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and elastic buffer, synchronizing 622 Mbps OC-12 streams to local system clocks via DCM-based deskew. Use Value: 120 I/Os support parallel bus bridging; DCI-enabled HSTL I/Os interface directly to TI TSB12LV23 PHY without external termination. | Use Scenario: Real-time closed-loop servo control in CNC machines using encoder feedback and PWM motor drive signals. IC Role / Device Role / Timing Role: FPGA implements PID computation, quadrature decoding, and deterministic PWM generation with sub-10 ns jitter. Use Value: 8 DCMs allow independent clock domains for encoder sampling (20 MHz), control loop (100 kHz), and communications (1 Mbps RS-485). |
| Medical Imaging Data Acquisition | Defense Radar Signal Processing |
Use Scenario: Digitizing and preprocessing ultrasound echo data from 128-channel ADC arrays before transmission to host processor. IC Role / Device Role / Timing Role: FPGA performs channel gain correction, beamforming summation, and DDR SDRAM buffering using Block SelectRAM. Use Value: 16 dedicated multipliers accelerate real-time FIR filtering; 144 Kb embedded RAM eliminates external memory latency for frame buffering. | Use Scenario: Pulse-Doppler radar front-end processing including matched filtering, CFAR detection, and PRI modulation. IC Role / Device Role / Timing Role: FPGA serves as real-time signal processor with deterministic latency, leveraging CLB-based pipeline stages and DCM-synchronized ADC/DAC interfaces. Use Value: LVDS I/Os interface to 10-bit, 80 MSPS ADCs at 840 Mb/s; industrial-grade (-40°C to +100°C) rating ensures operation in airborne avionics environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V100-5FG256I | 100K gates, 640 CLBs, 200 I/Os, same FG256 footprint - higher density but identical speed grade and package | Supports larger logic designs requiring more LUTs/registers without PCB redesign | Select when design growth exceeds XC2V80-5FG256I capacity but I/O count and thermal envelope remain acceptable |
| XC3S200-4PQ208I | Spartan-3 family, 200K gates, 144 I/Os, PQ208 package (208-pin TQFP), 1.2V core - lower cost, no DCM, no DCI, no Block RAM parity | Targeted at cost-sensitive, non-critical timing applications without high-speed memory or clock management needs | Choose for simpler control logic where LVDS/PCI-X support and embedded RAM are not required |
Compared with XC2V80-5FG256I, XC2V100-5FG256I offers headroom for logic expansion within identical mechanical and thermal constraints, while XC3S200-4PQ208I trades advanced clocking, memory, and I/O features for lower unit cost and simpler power delivery - making it suitable only for less demanding applications.
Availability
XC2V80-5FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and defense electronics requiring stable component supply across extended lifecycle programs.
Supply support for XC2V80-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022; it developed the first commercial FPGA and continues to lead in adaptive computing architectures.
The Virtex-II family was designed for high-performance, system-level integration in wireline/wireless infrastructure, video processing, and DSP applications - emphasizing clock precision, memory bandwidth, and I/O flexibility over cost-optimized logic density.
FAQ
What is the maximum operating junction temperature for XC2V80-5FG256I?
The XC2V80-5FG256I is rated for industrial temperature range: –40°C to +100°C junction temperature. This specification is defined in DS031 Module 3, Electrical Characteristics, and applies under specified VCCINT = 1.5V ±3%, VCCAUX = 3.3V ±5%, and VCCO = 1.5V/1.8V/2.5V/3.3V depending on I/O standard. Thermal derating is required above 85°C ambient with appropriate PCB copper area and airflow.
Does XC2V80-5FG256I support JTAG boundary-scan testing?
Yes, XC2V80-5FG256I fully supports IEEE 1149.1 boundary-scan with dedicated TCK, TMS, TDI, TDO, and TRST pins. The Test Access Port (TAP) implements EXTEST, INTEST, HIGHZ, SAMPLE, PRELOAD, IDCODE, and USERCODE instructions. Configuration memory, CLB flip-flops, and Block SelectRAM contents can be read back via JTAG for verification and debug - a capability confirmed in DS031 Module 2, Configuration section.
What I/O standards with on-chip termination are supported by XC2V80-5FG256I?
XC2V80-5FG256I supports Digitally Controlled Impedance (DCI) for 22 I/O standards including LVDCI_33/LVDCI_25/LVDCI_18, HSTL_I_DCI/HSTL_II_DCI, SSTL18_II_DCI/SSTL2_II_DCI, GTL_DCI/GTLP_DCI, and LVDS_25_DCI. DCI provides programmable series or split termination matching 40–75 Ω, eliminating external resistors and improving signal integrity for point-to-point and multidrop topologies.
Can XC2V80-5FG256I be configured via SPI flash memory?
No, XC2V80-5FG256I does not support native SPI flash configuration. It supports Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 (JTAG) modes only. External SPI flash must be interfaced through user logic implemented in the FPGA fabric, or a microcontroller must manage configuration via SelectMAP or JTAG. This limitation is documented in DS031 Module 1, Configuration section.
How many Block SelectRAM modules does XC2V80-5FG256I contain?
XC2V80-5FG256I contains eight 18-Kb Block SelectRAM modules, totaling 144 Kb of dual-port SRAM. Each block is independently configurable from 16K×1 to 512×36, supports three read-during-write modes, and connects to four switch matrices for flexible routing. This capacity is fixed per device and confirmed in Table 1 of DS031 Module 1, General Description.
XC2V80-5FG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 128
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 147456
- Number of I/O:
- 120
- Number of Gates:
- 80000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2V80-5FG256I FAQ
1.How can I place an order for XC2V80-5FG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V80-5FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V80-5FG256I reliable?
The price and inventory of XC2V80-5FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V80-5FG256I is usually 5 days.
3.What payment methods are accepted for XC2V80-5FG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V80-5FG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V80-5FG256I?
XC2V80-5FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V80-5FG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V80-5FG256I?
For technical support, including XC2V80-5FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V80-5FG256I requirements.
6.How does Aetrix verify that XC2V80-5FG256I is sourced from the original manufacturer or authorized distributors?
All XC2V80-5FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V80-5FG256I meets industry standards.
7.What is the process for return or replacement of XC2V80-5FG256I?
All XC2V80-5FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V80-5FG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V80-5FG256I part is unused and in its original packaging.
Return procedure for XC2V80-5FG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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