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AMD XC2V80-5FGG256C
- Part No.:
- XC2V80-5FGG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2V80-5FGG256C.pdf
- Description:
- IC FPGA 120 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC2V80-5FGG256C from Xilinx is a 80K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, operating at commercial temperature range (0°C to +85°C) with -5 speed grade. It integrates 512 Configurable Logic Blocks (CLBs), 16 dedicated 18×18 multipliers, 8 Block SelectRAM™ modules (144 Kbits total), 4 Digital Clock Managers (DCMs), and supports up to 120 user I/Os. It is used in high-speed communication interface logic, such as PCI-X 133 MHz bridge controllers and LVDS-based video data receivers.
For engineers reviewing the XC2V80-5FGG256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (120), DCM count (4), CLB density (512), supported differential standards (LVDS, BLVDS, LVPECL), and DCI-enabled single-ended termination for HSTL/SSTL interfaces.
Technical Context
The XC2V80-5FGG256C implements a hierarchical SRAM-based architecture with four major configurable resources: IOBs supporting DDR registers and Digitally Controlled Impedance (DCI); CLBs containing dual 4-input LUTs, flip-flops/latches, and carry chains; 18-Kb dual-port Block SelectRAM modules; and self-calibrating DCMs offering precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution). All routing uses Active Interconnect Technology with predictable delay independent of fanout.
It features 16 global clock MUX buffers, 24 long lines per row/column, and supports boundary-scan (IEEE 1149.1/1532) configuration via Slave/Master SelectMAP or JTAG. Core voltage is 1.5 V (VCCINT), auxiliary supply is 3.3 V (VCCAUX), and I/O voltage (VCCO) is programmable per bank (1.5 V–3.3 V) to match interface standards including LVTTL, LVCMOS, SSTL, HSTL, PCI-X, and LVDS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 80,000 - defines logic capacity for complex digital functions like protocol engines or DSP pipelines |
| Configurable Logic Blocks (CLBs) | 512 - each contains 4 slices with dual LUTs, flip-flops, and carry logic; enables large state machines or parallel arithmetic |
| Block SelectRAM™ (18 Kb) | 8 blocks (144 Kbits total) - dual-port RAM configurable from 16K×1 to 512×36; supports embedded FIFOs and frame buffers |
| Digital Clock Managers (DCMs) | 4 - provide jitter-free clock multiplication/division, phase alignment, and de-skew for synchronous I/O timing |
| User I/O Pins | 120 - supports high-pin-count interfaces such as 32-bit PCI-X, 16-bit DDR SDRAM, or 48-channel LVDS links |
| Speed Grade | -5 - guarantees maximum internal clock frequency of 420 MHz and I/O toggle rate up to 840 Mb/s |
| Package | FGG256 - 256-ball Fine-Pitch BGA (1.00 mm pitch), Pb-free, wire-bond construction; footprint-compatible with FG256 |
Pinout & Package
XC2V80-5FGG256C uses the FGG256 package: 256-ball Fine-Pitch BGA (1.00 mm pitch), Pb-free, wire-bond construction. Dimensions are 17 mm × 17 mm. The package supports 120 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master/Slave SelectMAP or JTAG programming |
| DONE | Configuration Status Output | Open-drain signal indicating successful configuration completion; must be pulled up externally |
| M0–M2 | Mode Selection Inputs | Set configuration mode (Slave Serial, Master Serial, Slave SelectMAP, etc.) at power-up |
| PROG_B | Program Initiate Input | Active-low signal that resets configuration memory and initiates reconfiguration sequence |
| TCK/TDI/TDO/TMS | JTAG Test Access Port | Support IEEE 1149.1 boundary scan and IEEE 1532 in-system configuration and verification |
| VCCINT | Core Power Supply | 1.5 V ±3% supply for CLBs, DCMs, and routing; requires low-noise decoupling near device |
| VCCAUX | Auxiliary Power Supply | 3.3 V ±5% supply for DCMs, SelectRAM, and configuration logic; shared across all I/O banks |
| VCCO_0–VCCO_n | I/O Bank Power Supply | Programmable per-bank voltage (1.5 V–3.3 V) setting I/O standard compliance and drive strength |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™-Ultra I/O Architecture | Supports 19 single-ended (LVTTL, SSTL, HSTL, PCI-X) and 6 differential (LVDS, BLVDS, LVPECL) standards with per-bank VCCO control |
| Digitally Controlled Impedance (DCI) | On-chip series or split termination resistors for HSTL/SSTL/LVDCI standards - eliminates external resistors and improves signal integrity |
| DDR I/O Registers | Dual-edge-clocked input/output registers per IOB enable true double-data-rate operation without external PHY logic |
| Integrated Logic Analyzer (ILA) | Embedded debug core allows real-time visibility into internal signals and memory contents during system operation |
| Triple-DES Bitstream Encryption | On-chip decryptor secures configuration bitstream using one or two DES keys - prevents IP theft and unauthorized cloning |
Applications
| PCI-X Bridge Controller | LVDS Video Receiver |
|---|---|
Use Scenario: Implementing a 32-bit, 133 MHz PCI-X slave interface between host processor and custom peripherals. IC Role / Device Role / Timing Role: Acts as protocol-conforming bridge logic with synchronized address/data capture, parity generation, and transaction arbitration. Use Value: Leverages 120 I/Os, PCI-X-compliant I/O buffers, and 4 DCMs to meet strict setup/hold timing and clock de-skew requirements across 32-bit bus. |
Use Scenario: Receiving 48-channel LVDS video streams from image sensors in industrial machine vision systems. IC Role / Device Role / Timing Role: Performs parallel-to-serial conversion, pixel clock recovery, and frame buffering using distributed RAM and block SelectRAM. Use Value: Uses native LVDS_33 I/O support and DDR input registers to sample 840 Mb/s differential data without external deserializers. |
| DDR SDRAM Memory Controller | Telecom Line Card Interface |
Use Scenario: Managing burst-mode read/write access to 16-bit DDR SDRAM in baseband processing units. IC Role / Device Role / Timing Role: Generates precise command/address strobes, data masks, and DQS-aligned write data using DCM-synchronized outputs. Use Value: Achieves sub-nanosecond timing closure via DCM phase-shifting and on-die termination (DCI) for stable 200 MHz DDR operation. |
Use Scenario: Aggregating multiple T1/E1/J1 framer outputs and mapping them to a backplane interface in telecom line cards. IC Role / Device Role / Timing Role: Provides elastic store buffering, HDLC framing, and clock domain crossing between asynchronous framers and synchronous backplane. Use Value: Uses 8 Block SelectRAM modules for deep packet buffering and 16 global clock MUX buffers to distribute jitter-clean clocks across multiple domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V100-5FG256C | Higher density (100K gates), 640 CLBs, 10 DCMs, 172 I/Os - same FGG256/FG256 footprint but not pin-compatible due to increased I/O count | Supports larger designs requiring more logic or clock domains; unsuitable for space-constrained layouts needing exact 120-I/O fit | Select only if design scalability beyond XC2V80 is required and PCB layout accommodates additional I/O routing |
| XC3S200-4PQ208C | Spartan-3 family; 200K gates, 480 CLBs, 4 DCMs, 141 I/Os in 208-pin PQFP - different architecture, no DCI, lower performance (333 MHz max) | Better cost-per-gate for non-critical timing applications; lacks PCI-X/LVDS-840Mb/s support and on-chip termination | Choose for cost-sensitive, lower-bandwidth control-plane logic where DCI and high-speed I/O are unnecessary |
Compared with XC2V80-5FGG256C, XC2V100-5FG256C offers higher gate count and DCM count but requires board-level I/O re-routing, while XC3S200-4PQ208C trades performance and advanced I/O features for lower unit cost and simpler thermal management in non-timing-critical roles.
Availability
XC2V80-5FGG256C is available at Aetrix Electronics and suitable for PCI-X bridge controllers, LVDS video receivers, DDR SDRAM controllers, telecom line card interfaces, and industrial embedded logic requiring stable component supply across extended production cycles.
Supply support for XC2V80-5FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-first platform FPGAs enabling high-performance, customizable digital systems.
The Virtex-II product line was designed for high-density, high-speed applications in telecommunications, networking, video processing, and DSP - delivering integrated clock management, memory, and I/O to replace ASICs in evolving protocols.
FAQ
What is the maximum operating frequency of the XC2V80-5FGG256C?
The XC2V80-5FGG256C has a -5 speed grade, guaranteeing a maximum internal clock frequency of 420 MHz and I/O toggle rates up to 840 Mb/s. This is validated under commercial temperature conditions (0°C to +85°C) and specified in Module 3 of DS031. Actual achievable frequency depends on design placement, routing, and timing constraints applied during implementation.
Does the XC2V80-5FGG256C support DDR SDRAM interfaces?
Yes, the XC2V80-5FGG256C supports DDR SDRAM interfaces through its SelectIO™-Ultra I/O architecture, which includes dedicated DDR input and output registers per IOB, programmable I/O standards (SSTL2_I/II), and DCMs for precise clock phase alignment. It meets JEDEC-compliant timing for 200 MHz DDR operation when properly configured with DCI termination.
Is the XC2V80-5FGG256C pin-compatible with other Virtex-II devices in the FGG256 package?
No - while all Virtex-II devices in the FGG256 package share the same physical footprint and ball pitch, pin assignments differ across densities. For example, XC2V80-5FGG256C provides 120 user I/Os, whereas XC2V100-5FGG256C offers 172. Pin compatibility is only guaranteed within identical device/package combinations, not across densities.
What configuration modes does the XC2V80-5FGG256C support?
The XC2V80-5FGG256C supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). Configuration is initiated via PROG_B, controlled by M0–M2 mode pins, and clocked by CCLK. Bitstream encryption using Triple-DES is optional and enabled via configuration settings.
Can the XC2V80-5FGG256C operate with 5V-tolerant I/Os?
No - the XC2V80-5FGG256C IOBs are not 5V-tolerant. As outputs, they are incompatible with 5V standards. As inputs, they can interface with 5V signals only when external current-limiting resistors are used to prevent damage; this is documented in Xilinx Tech Topic "5V Tolerant I/Os" and requires careful voltage translation design.
XC2V80-5FGG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 128
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 147456
- Number of I/O:
- 120
- Number of Gates:
- 80000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2V80-5FGG256C FAQ
1.How can I place an order for XC2V80-5FGG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V80-5FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V80-5FGG256C reliable?
The price and inventory of XC2V80-5FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V80-5FGG256C is usually 5 days.
3.What payment methods are accepted for XC2V80-5FGG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V80-5FGG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V80-5FGG256C?
XC2V80-5FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V80-5FGG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V80-5FGG256C?
For technical support, including XC2V80-5FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V80-5FGG256C requirements.
6.How does Aetrix verify that XC2V80-5FGG256C is sourced from the original manufacturer or authorized distributors?
All XC2V80-5FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V80-5FGG256C meets industry standards.
7.What is the process for return or replacement of XC2V80-5FGG256C?
All XC2V80-5FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2V80-5FGG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V80-5FGG256C part is unused and in its original packaging.
Return procedure for XC2V80-5FGG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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