AMD XC2V80-5FGG256I

Overview

XC2V80-5FGG256I from Xilinx is a 80K-system-gate Virtex-II platform FPGA with 512 Configurable Logic Blocks (CLBs), 16 dedicated 18×18 multipliers, 8 Block SelectRAM™ modules (144 Kbits total), and 4 Digital Clock Managers (DCMs). It features 120 user I/Os in a 256-pin Fine-Pitch BGA (FGG256) package, rated for industrial temperature (–40°C to +100°C), and supports high-speed interfaces including LVDS, PCI-X, and DDR memory controllers - deployed in telecom line cards and DSP-based video processing systems.

For engineers reviewing the XC2V80-5FGG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDCI, SSTL, HSTL), DCM timing parameters, CLB slice count, and industrial-grade thermal validation - all specific to the FGG256 wire-bond BGA variant with speed grade -5 and temperature grade I.

Technical Context

The XC2V80-5FGG256I implements a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its IOBs support dual-edge DDR registers per pin, Digitally Controlled Impedance (DCI) for on-die termination, and 19 single-ended plus 6 differential I/O standards - including LVDS_33, SSTL3_II, and HSTL_I_DCI.

Internally, it integrates 512 CLBs (each with two 4-LUTs and dual flip-flops), 16 multiplier blocks, 8 DCMs offering ±1/256-cycle phase shift and M/D frequency synthesis, and hierarchical Active Interconnect routing with 24 long lines per row/column - enabling predictable timing closure up to 420 MHz internal clock speed and 840 Mb/s I/O data rates.

Key Specifications

Pinout & Package

XC2V80-5FGG256I uses a 256-ball Fine-Pitch Ball Grid Array (FGG256) package with 1.00 mm pitch, Pb-free finish, and wire-bond interconnect. The package supports 120 user I/Os plus 15 dedicated configuration and boundary-scan pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O interface applications.

Compared with XC2V80-5FGG256I, XC2V1000-5FG456I offers scalable I/O and memory for complex protocols, while XC3S1000-4FGG456C trades industrial reliability and advanced I/O for lower unit cost - making the XC2V80-5FGG256I optimal for space-constrained, thermally demanding, high-integrity FPGA deployments.

Availability

XC2V80-5FGG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motor control, broadcast video processing, and PCI-X embedded computing requiring stable component supply across extended lifecycle programs.

Supply support for XC2V80-5FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering FPGA and adaptive computing solutions provider, acquired by AMD in 2022. It developed industry-standard tools, IP cores, and silicon architectures for programmable logic design.

The Virtex-II family was engineered for high-performance, system-level integration in telecom, wireless, and video applications - delivering platform-level features like DCI, DCMs, and SelectIO-Ultra to replace ASICs in rapidly evolving standards-based systems.

FAQ

What is the maximum operating junction temperature for XC2V80-5FGG256I?

The XC2V80-5FGG256I is rated for industrial temperature operation with a maximum junction temperature of +100°C. This specification is validated per DS031 Module 1 and applies to continuous operation under worst-case voltage, frequency, and thermal conditions defined in the device's thermal derating curves.

Does XC2V80-5FGG256I support LVDS signaling, and what are the electrical requirements?

Yes, XC2V80-5FGG256I supports LVDS_33 and LVDS_25 signaling per DS031 Module 2. It requires VCCO = 3.3 V or 2.5 V respectively, no input reference voltage (VREF), and delivers output differential voltage (VOD) between 0.25 V and 0.40 V - compliant with ANSI TIA/EIA-644.

How many Digital Clock Managers (DCMs) are available in XC2V80-5FGG256I?

The XC2V80-5FGG256I contains exactly 4 Digital Clock Managers (DCMs), as confirmed in Table 1 of DS031 Module 1. Each DCM provides fully digital clock deskew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 cycle resolution) for internal and I/O clock domains.

Is XC2V80-5FGG256I compatible with Pb-free solder reflow profiles?

Yes, XC2V80-5FGG256I uses a Pb-free FGG256 package and is qualified for JEDEC J-STD-020C reflow profiles, including peak temperatures up to 260°C. Xilinx documentation confirms compatibility with standard lead-free assembly processes without derating.

What configuration modes does XC2V80-5FGG256I support?

XC2V80-5FGG256I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is controlled by M0–M2 pins at power-up, and all modes are fully documented in DS031 Module 1 Section "Configuration".