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AMD XC2V80-6CSG144C

Part No.:
XC2V80-6CSG144C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
144-TFBGA, CSPBGA
Datasheet:
AetrixXC2V80-6CSG144C.pdf
Description:
IC FPGA 92 I/O 144CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,864

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Product details

Overview

XC2V80-6CSG144C from Xilinx is a Virtex-II platform FPGA with 80K system gates, 512 Configurable Logic Blocks (CLBs), 16 dedicated 18×18 multipliers, and 144 user I/O pins in a 144-ball chip-scale BGA (CSG144) package. It features dual-port 18-Kb Block SelectRAM, Digitally Controlled Impedance (DCI) I/O, and four Digital Clock Managers (DCMs) for precise clock de-skew and phase shifting - deployed in high-speed telecom and DSP interface designs.

For engineers reviewing the XC2V80-6CSG144C datasheet, pinout, applications, or equivalent options, key selection criteria include its 1.5 V core supply, support for LVDS/PCI/LVCMOS I/O standards, DCM-based clock synthesis up to 420 MHz internal operation, and compatibility with Xilinx Foundation and Alliance development tools for VHDL/Verilog synthesis of medium-complexity logic systems.

Technical Context

The XC2V80-6CSG144C implements a SRAM-based, reprogrammable architecture built on a 0.15 µm / 0.12 µm 8-layer metal CMOS process. Its logic fabric comprises 512 CLBs (each with four slices), 16 multiplier blocks, and four 18-Kb Block SelectRAM modules - all interconnected via Active Interconnect Technology routing with predictable delay independent of fanout.

Each IOB supports single-ended (LVTTL, LVCMOS, PCI, SSTL, HSTL) and differential (LVDS, BLVDS, LVPECL) signaling, with programmable drive strength (2–24 mA) and on-chip DCI termination. Four DCMs provide fully digital clock management including frequency synthesis (M/D ratio), ±180° coarse phase shift, and 1/256-cycle fine-grained adjustment - enabling synchronous DDR I/O and low-jitter system timing.

Key Specifications

ParameterValue and Actual Design Meaning
System Gates80,000 - defines logic capacity for medium-complexity ASIC replacement or IP-core integration
Configurable Logic Blocks (CLBs)512 - each contains four slices with dual LUTs, flip-flops/latches, carry chains, and horizontal cascade
Block RAM (SelectRAM)4 × 18 Kb dual-port - supports 16K×1 to 512×36 configurations with read-during-write capability
Digital Clock Managers (DCMs)4 - deliver jitter-free clock multiplication/division, de-skew, and 90/180/270° phase shifts
User I/O Pins144 - supports 19 single-ended and 6 differential I/O standards including LVDS and PCI-X
Core Supply Voltage (VCCINT)1.5 V - enables low-power operation while maintaining 420 MHz internal clock speed
Package TypeCSG144 - 0.80 mm pitch chip-scale BGA, Pb-free, 12×12 mm footprint

Pinout & Package

XC2V80-6CSG144C uses a 144-ball chip-scale BGA (CSG144) package with 0.80 mm pitch and 12×12 mm body size. The package supports wire-bond interconnect and is RoHS-compliant (Pb-free). Pin definitions follow Xilinx's standard Virtex-II ball-out mapping for CSG144, including dedicated configuration (PROG_B, INIT_B, CCLK, DONE), JTAG (TCK/TMS/TDI/TDO), and dual-purpose I/O banks with bank-specific VCCO and VREF assignments.

Pin/TerminalCircuit RoleDesign Meaning
PROG_BConfiguration InitiationActive-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence
CCLKConfiguration ClockInput clock for master serial or SelectMAP configuration modes; drives internal configuration state machine
DONEConfiguration StatusOpen-drain output indicating successful completion of configuration; must be pulled high externally
TCK/TMS/TDI/TDOJTAG Boundary ScanIEEE 1149.1-compliant test access port for programming, debugging, and verification
VCCINTCore Power Supply1.5 V supply for internal logic; requires low-noise regulation and local decoupling
VCCAUXAuxiliary Power Supply3.3 V supply for configuration circuitry, DCMs, and I/O reference circuits
VCCO (Bank 0–3)I/O Output VoltageBank-specific 1.5/1.8/2.5/3.3 V supply determining I/O voltage level and compatible standards

Key Features

FeatureDesign Value
Digitally Controlled Impedance (DCI)On-chip series or split termination resistors automatically calibrated to match transmission line impedance - eliminates external resistors for SSTL/HSTL/LVDS interfaces
DDR I/O RegistersDual-edge capture and launch registers per IOB enable true double-data-rate signaling without external FIFOs or clock doublers
18×18 Multiplier BlocksDedicated hardware multipliers optimized for DSP filter structures and MAC operations - bypassing LUT-based arithmetic for deterministic latency
Block SelectRAM Flexibility18-Kb dual-port RAM blocks configurable as 16K×1, 2K×9, 1K×18, or 512×36 - supporting FIFOs, frame buffers, and coefficient storage in embedded systems
DCM Phase ResolutionFine-grained phase shift in increments of 1/256 of input clock period - enables sub-nanosecond timing alignment for source-synchronous interfaces

Applications

PCI Express Endpoint InterfaceSDR/DDR SDRAM Controller

Use Scenario: Implementing a PCIe endpoint in an industrial data acquisition card requiring low-latency host communication and DMA engine control.

IC Role / Device Role / Timing Role: XC2V80-6CSG144C serves as the protocol bridge and packet processor, managing TLP encoding/decoding, configuration space access, and BAR mapping using its 144 I/Os and DCM-synchronized clocks.

Use Value: Leverages native PCI-X 133 MHz compliance at 3.3 V and programmable I/O drive strength to meet PCIe Gen1 electrical specs without external level shifters or terminators.

Use Scenario: Building a video frame buffer subsystem for broadcast-grade SD/HD video processing with real-time pixel streaming.

IC Role / Device Role / Timing Role: XC2V80-6CSG144C implements a dual-port SDRAM controller with burst-length optimization, refresh arbitration, and address/command multiplexing using CLB logic and Block SelectRAM for command queueing.

Use Value: Uses four DCMs to generate precisely phase-aligned clocks for SDRAM CLK, DQS, and internal pipeline stages - achieving stable 133 MHz SDR or 266 MHz DDR operation.

LvDS Serializer/DeserializerDSP Acceleration Core

Use Scenario: High-speed sensor data aggregation in radar signal conditioning where analog front-end outputs require serialized transport over backplane links.

IC Role / Device Role / Timing Role: XC2V80-6CSG144C acts as a parallel-to-serial converter with LVDS output drivers, using DDR registers and DCM-generated bit clocks to achieve 840 Mb/s per lane.

Use Value: Integrates LVDS_33 I/O standard support with DCI termination and 18×18 multipliers to implement channel equalization and pre-emphasis in real time.

Use Scenario: Offloading FFT and FIR filtering from a host ARM processor in a software-defined radio baseband unit.

IC Role / Device Role / Timing Role: XC2V80-6CSG144C executes pipelined FFT engines and coefficient-matched filters using distributed LUT RAM and dedicated multipliers - synchronized by DCM-derived sample clocks.

Use Value: Delivers 100+ million MAC operations/sec using hard multipliers and carry-chain arithmetic - reducing host CPU load and enabling real-time spectral analysis.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC2V100-6FG256CHigher density (100K gates), 256-pin FG256 package, 172 user I/Os, same speed grade (-6) and Virtex-II architectureSupports larger logic partitions and additional I/O banks - suitable when XC2V80-6CSG144C resources are insufficient for full design integrationSelect if design requires >512 CLBs or >144 I/Os while retaining identical toolchain and DCM/SelectRAM feature set
XC3S200-4PQ208CSpartan-3 generation, 200K system gates, 208-pin PQFP, 1.2 V core, no DCM (only DLL), no DCI, lower I/O count (117)Targeted at cost-sensitive, non-timing-critical control logic - lacks LVDS/PCI-X support and advanced clock managementChoose only for simpler, lower-performance applications where XC2V80-6CSG144C's high-speed interface and clocking capabilities are unnecessary

Compared with XC2V100-6FG256C, XC2V80-6CSG144C offers smaller footprint and lower power but fewer I/Os and logic resources; compared with XC3S200-4PQ208C, it delivers superior clock precision, I/O flexibility, and signal integrity - making it essential for timing-critical telecom and memory interface designs.

Availability

XC2V80-6CSG144C is available at Aetrix Electronics and suitable for industrial control systems, telecom infrastructure equipment, and embedded video processing applications requiring stable component supply across extended production lifecycles.

Supply support for XC2V80-6CSG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design toolchains for high-performance digital systems.

The Virtex-II product line was engineered for high-speed, high-density logic implementation in telecommunications, networking, and DSP applications - emphasizing clock management, memory integration, and multi-standard I/O interoperability.

FAQ

What is the maximum operating frequency of the XC2V80-6CSG144C internal logic?

The XC2V80-6CSG144C supports up to 420 MHz internal clock speed per Advance Data specifications in DS031. This performance is achievable under optimal placement and routing conditions using the -6 speed grade, which guarantees timing closure for critical paths including CLB-to-CLB and register-to-register logic. Actual system frequency depends on design complexity, resource utilization, and clock domain structure - verified during static timing analysis in Xilinx ISE.

Does the XC2V80-6CSG144C support LVDS I/O at 840 Mb/s?

Yes, the XC2V80-6CSG144C supports LVDS I/O at up to 840 Mb/s as specified in DS031 Module 1. This capability relies on dedicated current-mode LVDS drivers, matched termination via DCI, and DDR-capable IOB registers. Achieving 840 Mb/s requires proper PCB layout (controlled impedance, length matching), correct VCCO = 2.5 V or 3.3 V assignment per bank, and DCM-synchronized sampling clocks - validated using Xilinx's IBIS models and timing constraints.

How many Block SelectRAM modules does the XC2V80-6CSG144C contain?

The XC2V80-6CSG144C contains four 18-Kb Block SelectRAM modules, as confirmed in Table 1 of DS031-1. Each module operates as dual-port RAM with independent read/write ports, configurable depth/width (e.g., 16K×1 to 512×36), and three read-during-write modes. These blocks are physically distributed across the die and connect to four switch matrices - enabling concurrent access for data buffering, coefficient storage, or FIFO implementation within XC2V80-6CSG144C designs.

Is the XC2V80-6CSG144C pin-compatible with other Virtex-II devices in the CSG144 package?

Yes, all Virtex-II devices offered in the CSG144 package - including XC2V40, XC2V80, and XC2V250 - share identical pinouts and footprint. This allows hardware reuse across density points, provided I/O banking constraints and VCCO/VREF assignments are maintained. However, unused pins on lower-density variants remain unconnected; XC2V80-6CSG144C utilizes all 144 balls for I/O, configuration, and power, with no reserved or NC pins beyond the 15 mandatory control signals defined in DS031.

What configuration modes does the XC2V80-6CSG144C support?

The XC2V80-6CSG144C supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). Configuration is initiated via PROG_B, clocked by CCLK, and verified by DONE assertion. Bitstream encryption using Triple-DES is optional. All modes use SRAM-based in-system reprogrammability - enabling field updates, partial reconfiguration, and readback of configuration memory and flip-flop states for debug, all supported natively in XC2V80-6CSG144C.

XC2V80-6CSG144C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II
Package/Case:
144-TFBGA, CSPBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
128
Number of Logic Elements/Cells:
-
Total RAM Bits:
147456
Number of I/O:
92
Number of Gates:
80000
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
144-LCSBGA (12x12)

XC2V80-6CSG144C FAQ

1.How can I place an order for XC2V80-6CSG144C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2V80-6CSG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2V80-6CSG144C reliable?

The price and inventory of XC2V80-6CSG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V80-6CSG144C is usually 5 days.

3.What payment methods are accepted for XC2V80-6CSG144C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V80-6CSG144C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2V80-6CSG144C?

XC2V80-6CSG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2V80-6CSG144C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2V80-6CSG144C?

For technical support, including XC2V80-6CSG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V80-6CSG144C requirements.

6.How does Aetrix verify that XC2V80-6CSG144C is sourced from the original manufacturer or authorized distributors?

All XC2V80-6CSG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V80-6CSG144C meets industry standards.

7.What is the process for return or replacement of XC2V80-6CSG144C?

All XC2V80-6CSG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC2V80-6CSG144C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2V80-6CSG144C part is unused and in its original packaging.

Return procedure for XC2V80-6CSG144C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2V80-6CSG144C Tags

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