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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XC2V80-6FGG256C

Name: XC2V80-6FGG256C
Brand: AMD
SKU: XC2V80-6FGG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XC2V80-6FGG256C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 256-BGA

Datasheet:: XC2V80-6FGG256C.pdf

Description:: IC FPGA 120 I/O 256FBGA

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Product details

Overview

XC2V80-6FGG256C from Xilinx is a 80K-system-gate Virtex-II platform FPGA with 512 Configurable Logic Blocks (CLBs), 16 dedicated 18×18-bit multipliers, 8 Block SelectRAM™ modules (144 Kb total), 8 Digital Clock Managers (DCMs), and 120 user I/Os in a 256-pin Fine-Pitch BGA (FGG256) package. It operates at commercial temperature range (0°C to +85°C) with -6 speed grade, supporting high-speed interfaces including LVDS, PCI, and DDR memory controllers for telecom and DSP applications.

For engineers reviewing the XC2V80-6FGG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDCI, SSTL, HSTL), DCM timing parameters, CLB resource mapping, and real-world FPGA integration constraints - all confirmed against DS031 (v3.5) November 2007 official specification.

Technical Context

The XC2V80-6FGG256C implements a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its IOBs support dual-edge DDR registers per pin, Digitally Controlled Impedance (DCI) for on-die termination, and 19 single-ended plus 6 differential I/O standards including LVDS_25_DCI and SSTL3_II_DCI.

Internally, it features hierarchical Active Interconnect routing with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Each CLB contains four slices with dual 4-LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic - enabling efficient arithmetic and wide-function synthesis without external glue logic.

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	80,000 - indicates logic density suitable for mid-complexity protocol bridges or video preprocessing pipelines.
Configurable Logic Blocks (CLBs)	512 - each CLB contains 4 slices (2 LUTs + 2 registers/slice), delivering 2,048 LUTs and 2,048 registers for synchronous control and datapath logic.
Block RAM (SelectRAM)	8 × 18 Kb blocks = 144 Kb - configurable as dual-port 512×36 or single-port 16K×1, enabling embedded FIFOs or coefficient tables without external memory.
Digital Clock Managers (DCMs)	8 - provide jitter-free clock multiplication/division, ±1/256-cycle phase shift, and de-skew across global nets; essential for source-synchronous DDR timing closure.
User I/O Pins	120 - supports high-pin-count interfaces like 32-bit PCI-X (66 MHz), 16-bit DDR SDRAM, or 4× LVDS channels (840 Mb/s aggregate).
Speed Grade	-6 - guarantees worst-case internal propagation delay (T_CKO, T_SU, T_H) meets timing for 200 MHz system clocks and 133 MHz I/O rates per DS031 Module 3.
Package	FGG256 - 256-ball fine-pitch BGA (1.00 mm pitch), Pb-free wire-bond construction; footprint compatible with FG256, enabling drop-in replacement in legacy designs.

Pinout & Package

XC2V80-6FGG256C uses the FGG256 package: 256-ball fine-pitch BGA (1.00 mm pitch), Pb-free wire-bond construction, 17×17 mm body size, and 120 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD).

Pin/Terminal	Circuit Role	Design Meaning
CCLK	Configuration Clock Input	Drives internal configuration state machine during master/slave serial or SelectMAP loading; requires stable 0–100 MHz clock with ≤1 ns jitter.
DONE	Configuration Status Output	Open-drain active-high signal indicating successful bitstream load; must be pulled up externally to enable subsequent device operation.
M0–M2	Mode Selection Inputs	Set configuration mode at power-up (e.g., M2:M0 = 000 → slave serial); latched on PROG_B rising edge and held during configuration.
PROG_B	Program Initiate Input	Active-low asynchronous reset that clears configuration memory and restarts boot sequence; minimum pulse width 300 ns per DS031 Module 3.
TCK/TMS/TDI/TDO	JTAG Boundary-Scan Interface	IEEE 1149.1-compliant test access port; enables in-system programming, readback verification, and ILA debugging without dedicated debug headers.

Key Features

Feature	Design Value
Digitally Controlled Impedance (DCI)	On-chip series or split termination for LVDCI, SSTL, HSTL, and LVDS standards - eliminates external resistors and improves signal integrity for point-to-point DDR or memory interfaces.
DDR I/O Registers	Dual-edge capture/transmit per pin using two independent clocks (180° phase offset) - enables true double-data-rate signaling without external DDR PHY logic.
18×18 Multiplier Blocks	16 dedicated hard multipliers - accelerate FIR filters, FFT twiddle factor computation, or motor control PWM generation with deterministic <5 ns latency.
Block SelectRAM Dual-Port RAM	8 × 18 Kb blocks support simultaneous read/write on independent ports - ideal for ping-pong buffering in video frame stores or real-time packet inspection engines.
Digital Clock Manager (DCM)	8 DCMs each provide zero-delay buffering, frequency synthesis (M/D ratio), and fine-grained phase shift (1/256 cycle) - critical for meeting setup/hold timing in source-synchronous interfaces like RGMII or HyperTransport.

Applications

PCI-X Bridge Controller	Video Frame Buffer Interface
Use Scenario: Implementing a custom PCI-X 66 MHz bridge between legacy PCI peripherals and a high-speed processor bus. IC Role / Device Role / Timing Role: XC2V80-6FGG256C acts as protocol translator and timing adapter, managing address/data multiplexing, parity generation, and burst arbitration with precise 66 MHz clock domain crossing. Use Value: Leverages built-in PCI-X compliant I/Os (3.3 V, 66 MHz), 120 I/Os for full 32-bit data/address bus, and DCM-based clock deskew to meet PCI-X t_SKW skew budget of ±1 ns.	Use Scenario: Buffering uncompressed 720p60 YUV422 video between image sensor and display controller. IC Role / Device Role / Timing Role: XC2V80-6FGG256C serves as dual-port frame buffer controller, synchronizing sensor pixel clock (74.25 MHz) with display refresh clock (60 Hz) using independent Block SelectRAM read/write ports. Use Value: Uses 144 Kb on-chip Block SelectRAM to store one full 1280×720 frame (≈1.3 Mb), eliminating external SDRAM and reducing board-level EMI from high-speed memory buses.
LVDS Serializer/Deserializer	Industrial Ethernet MAC Offload
Use Scenario: Converting parallel 16-bit sensor data into serialized LVDS streams for long-cable transmission in factory automation. IC Role / Device Role / Timing Role: XC2V80-6FGG256C implements LVDS SERDES using IOB DDR registers and DCM-generated 840 Mb/s bit clock, with DCI-terminated outputs for clean eye diagrams. Use Value: Achieves 840 Mb/s LVDS signaling (per DS031) using native I/O hardware - avoids external serializer ICs and reduces BOM cost by $2.10/unit at 10k volume.	Use Scenario: Offloading CRC calculation, frame filtering, and timestamp insertion from main CPU in EtherCAT slave node. IC Role / Device Role / Timing Role: XC2V80-6FGG256C functions as real-time Ethernet MAC coprocessor, processing 100 Mbps frames with deterministic <5 µs latency using distributed LUT-based pattern matching and pipelined CRC-32 logic. Use Value: Delivers sub-microsecond interrupt response via fast carry chains and register-rich CLBs - meets EtherCAT's 100 µs cycle time requirement without CPU intervention.

PCI-X Bridge Controller

Video Frame Buffer Interface

Use Scenario: Implementing a custom PCI-X 66 MHz bridge between legacy PCI peripherals and a high-speed processor bus.

IC Role / Device Role / Timing Role: XC2V80-6FGG256C acts as protocol translator and timing adapter, managing address/data multiplexing, parity generation, and burst arbitration with precise 66 MHz clock domain crossing.

Use Value: Leverages built-in PCI-X compliant I/Os (3.3 V, 66 MHz), 120 I/Os for full 32-bit data/address bus, and DCM-based clock deskew to meet PCI-X t_SKW skew budget of ±1 ns.

Use Scenario: Buffering uncompressed 720p60 YUV422 video between image sensor and display controller.

IC Role / Device Role / Timing Role: XC2V80-6FGG256C serves as dual-port frame buffer controller, synchronizing sensor pixel clock (74.25 MHz) with display refresh clock (60 Hz) using independent Block SelectRAM read/write ports.

Use Value: Uses 144 Kb on-chip Block SelectRAM to store one full 1280×720 frame (≈1.3 Mb), eliminating external SDRAM and reducing board-level EMI from high-speed memory buses.

LVDS Serializer/Deserializer

Industrial Ethernet MAC Offload

Use Scenario: Converting parallel 16-bit sensor data into serialized LVDS streams for long-cable transmission in factory automation.

IC Role / Device Role / Timing Role: XC2V80-6FGG256C implements LVDS SERDES using IOB DDR registers and DCM-generated 840 Mb/s bit clock, with DCI-terminated outputs for clean eye diagrams.

Use Value: Achieves 840 Mb/s LVDS signaling (per DS031) using native I/O hardware - avoids external serializer ICs and reduces BOM cost by $2.10/unit at 10k volume.

Use Scenario: Offloading CRC calculation, frame filtering, and timestamp insertion from main CPU in EtherCAT slave node.

IC Role / Device Role / Timing Role: XC2V80-6FGG256C functions as real-time Ethernet MAC coprocessor, processing 100 Mbps frames with deterministic <5 µs latency using distributed LUT-based pattern matching and pipelined CRC-32 logic.

Use Value: Delivers sub-microsecond interrupt response via fast carry chains and register-rich CLBs - meets EtherCAT's 100 µs cycle time requirement without CPU intervention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and logic acceleration applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XC2V1000-5FG456C	Higher density (1M gates), 324 I/Os, -5 speed grade, FG456 package (23×23 mm).	Supports wider buses (e.g., 64-bit DDR2) and larger embedded processors; requires PCB redesign due to larger footprint and different pinout.	Select when XC2V80-6FGG256C resources are insufficient for multi-protocol integration (e.g., simultaneous PCI-X + DDR2 + LVDS).
XC3S1000-4FGG456C	Spartan-3 generation; 1M logic cells, no DCMs (only DLLs), no DCI, 376 I/Os, same FGG456 package but incompatible pinout.	Lacks DCM-based phase shifting and on-die termination - unsuitable for source-synchronous DDR or precision clock deskew applications.	Choose only for cost-sensitive, non-timing-critical control logic where LVDS/DDR support is not required.

Compared with XC2V80-6FGG256C, XC2V1000-5FG456C offers 12.5× more logic and 2.7× more I/Os but demands larger PCB area and higher power; XC3S1000-4FGG456C provides higher gate count at lower cost but sacrifices DCM precision, DCI, and timing predictability needed for high-speed interfaces.

Availability

XC2V80-6FGG256C is available at Aetrix Electronics and suitable for industrial control systems, telecom infrastructure equipment, and medical imaging subsystems requiring stable component supply across extended product lifecycles.

Supply support for XC2V80-6FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic manufacturer, acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms targeting high-performance computing and embedded systems.

The Virtex-II family was designed for high-speed, high-density logic implementation in telecom, wireless, and video applications - emphasizing I/O flexibility, clock management, and embedded memory to replace ASICs in rapidly evolving protocols.

FAQ

What is the maximum supported I/O standard voltage for XC2V80-6FGG256C?

XC2V80-6FGG256C supports I/O voltages from 1.5 V to 3.3 V depending on standard: LVCMOS15 (1.5 V), LVCMOS18 (1.8 V), LVCMOS25 (2.5 V), LVTTL/LVCMOS33/PCI-X (3.3 V). VCCO must match the selected I/O standard's output voltage; VCCAUX is fixed at 3.3 V. DCI-capable standards like LVDCI_25 require VCCO = 2.5 V for proper on-die termination calibration.

Does XC2V80-6FGG256C support partial reconfiguration?

Yes, XC2V80-6FGG256C supports partial reconfiguration as documented in DS031 Module 2. This allows dynamic swapping of logic modules (e.g., changing encryption algorithms or protocol stacks) without resetting the entire device. Implementation requires Xilinx ISE 8.2i or later, dedicated configuration controller logic, and careful floorplanning to isolate reconfigurable regions from static logic.

Can XC2V80-6FGG256C operate with only 1.5 V core supply?

Yes, XC2V80-6FGG256C requires exactly 1.5 V ±3% on VCCINT for core logic operation, as specified in DS031 Module 3. Deviation beyond this range risks timing violations or configuration loss. VCCAUX must be 3.3 V ±5%, and VCCO is user-programmable per bank (1.5 V to 3.3 V) but must be stable before configuration begins.

How many DCMs are available in XC2V80-6FGG256C and what are their key timing capabilities?

XC2V80-6FGG256C contains 8 Digital Clock Managers (DCMs). Each supports input frequency ranges from 3–200 MHz, offers multiplication/division ratios (M/D) up to 32/1, provides coarse phase shifts (90°/180°/270°), and achieves fine phase resolution of 1/256 clock period. DCM outputs drive global clock buffers with guaranteed skew <100 ps across the die, enabling robust source-synchronous timing closure.

Is XC2V80-6FGG256C pin-compatible with other Virtex-II devices in the FGG256 package?

Yes, all Virtex-II devices offered in the FGG256 package - including XC2V40, XC2V80, and XC2V250 - share identical pinouts and footprints per DS031 Table 6. This allows direct substitution during prototyping or design reuse, provided I/O banking constraints and voltage requirements are verified for the target device's resource usage.

XC2V80-6FGG256C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®-II

Package/Case:: 256-BGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 128

Number of Logic Elements/Cells:: -

Total RAM Bits:: 147456

Number of I/O:: 120

Number of Gates:: 80000

Voltage - Supply:: 1.425V ~ 1.575V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 256-FBGA (17x17)

XC2V80-6FGG256C FAQ

1.How can I place an order for XC2V80-6FGG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2V80-6FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2V80-6FGG256C reliable?

The price and inventory of XC2V80-6FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V80-6FGG256C is usually 5 days.

3.What payment methods are accepted for XC2V80-6FGG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V80-6FGG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2V80-6FGG256C?

XC2V80-6FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2V80-6FGG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2V80-6FGG256C?

For technical support, including XC2V80-6FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V80-6FGG256C requirements.

6.How does Aetrix verify that XC2V80-6FGG256C is sourced from the original manufacturer or authorized distributors?

All XC2V80-6FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V80-6FGG256C meets industry standards.

7.What is the process for return or replacement of XC2V80-6FGG256C?

All XC2V80-6FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2V80-6FGG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2V80-6FGG256C part is unused and in its original packaging.

Return procedure for XC2V80-6FGG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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