AMD XC2VP100-5FF1704I

Overview

XC2VP100-5FF1704I from Xilinx is a high-density Virtex-II Pro Platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, up to 20 RocketIO multi-gigabit transceivers (MGTs), 99,216 logic cells, 1,164 user I/Os, and 12 Digital Clock Manager (DCM) modules. It targets high-throughput telecom infrastructure, wireless baseband processing, and high-speed networking systems requiring integrated processing, serial connectivity, and programmable logic.

For engineers reviewing the XC2VP100-5FF1704I datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (300 MHz PowerPC, 2.0 Gb/s RocketIO), FF1704 flip-chip BGA package (1704-pin, 1.0 mm pitch), industrial temperature rating (–40°C to +100°C), and absence of bonded-out MGTs in this specific package variant.

Technical Context

This device implements a hardened dual-PowerPC 405 subsystem with 16 KB instruction and data caches, MMU, and OCM interface, tightly coupled to FPGA fabric via CoreConnect bus. Its RocketIO transceivers support full-duplex operation at 2.0 Gb/s (per channel) with 8B/10B encoding, on-chip 50Ω termination, and channel bonding across up to 20 lanes.

The FPGA fabric includes 444 18×18-bit multipliers, 7,992 Kb of Block SelectRAM+ (18 Kb × 444), distributed RAM, SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X, plus digitally controlled impedance (DCI) for single-ended standards - all built on a 0.13 µm nine-layer copper process with 1.5 V core voltage.

Key Specifications

Pinout & Package

XC2VP100-5FF1704I uses the FF1704 flip-chip fine-pitch BGA package: 1704 solder balls, 42.5 mm × 42.5 mm body, 1.0 mm pitch, industrial temperature range (–40°C to +100°C). This package variant has no bonded-out RocketIO transceiver pins; all 1,164 user I/Os are allocated to SelectIO-Ultra banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA with embedded processor applications.

Compared with XC2VP100-5FF1704I, the -6FF1704I offers higher performance at the cost of increased power and reduced temperature range, while the XC2VP70-5FF1152I trades logic capacity and I/O count for smaller footprint and lower BOM cost - both require PCB redesign due to different packages and pinouts.

Availability

XC2VP100-5FF1704I is available at Aetrix Electronics and suitable for wireless infrastructure, defense electronics, and industrial video transport requiring stable component supply across extended lifecycle and obsolescence-sensitive programs.

Supply support for XC2VP100-5FF1704I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and tools for high-performance digital system design.

The Virtex-II Pro family was engineered to integrate embedded processors and high-speed serial transceivers into a single programmable platform, targeting telecom, aerospace, and high-end computing applications where ASIC flexibility and SoC integration were previously unattainable.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP100-5FF1704I?

The XC2VP100-5FF1704I has a -5 speed grade, guaranteeing reliable operation of both PowerPC 405 cores at up to 300 MHz under industrial temperature conditions (–40°C to +100°C). This rating is validated per DS083 v5.0 specifications and applies to sustained execution with full cache and MMU enabled. Higher frequencies require derating or use of faster speed grades like -6.

Does XC2VP100-5FF1704I include functional RocketIO transceivers in its FF1704 package?

No. Although the XC2VP100 die supports up to 20 RocketIO transceivers, the FF1704 package variant (XC2VP100-5FF1704I) does not bond out any RocketIO pins - all 1,164 user I/Os are allocated to SelectIO-Ultra banks. This configuration prioritizes maximum parallel I/O count over serial transceiver functionality, as confirmed in Table 3 of DS083.

What I/O standards are supported by XC2VP100-5FF1704I?

XC2VP100-5FF1704I supports 22 single-ended standards (including LVCMOS 1.5/1.8/2.5/3.3 V, PCI-X, GTL, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LDT, LVPECL) via its SelectIO-Ultra blocks. Each I/O bank has independent VCCO and supports programmable drive strength (2–24 mA) and on-chip digitally controlled impedance (DCI) termination.

How many Block SelectRAM+ resources does XC2VP100-5FF1704I provide?

XC2VP100-5FF1704I contains 444 Block SelectRAM+ modules, each delivering 18 Kb of true dual-port RAM, for a total of 7,992 Kb. These blocks are configurable from 16K × 1 to 512 × 36 bits, support three read-during-write modes, and can be cascaded to build larger memory structures - essential for buffering, FIFOs, and coefficient storage in DSP applications.

Is XC2VP100-5FF1704I recommended for new designs?

No. Per Xilinx DS083 v5.0 documentation, XC2VP100-5FF1704I is marked "Product Not Recommended For New Designs." It remains available for legacy support, repair, and obsolescence management, but Xilinx recommends Virtex-5 or newer families (e.g., Kintex-7, Virtex-7) for new development due to superior performance, power efficiency, and toolchain support.