AMD XC2VP100-6FF1704C

Overview

XC2VP100-6FF1704C from Xilinx is a high-density Virtex-II Pro platform FPGA with dual PowerPC 405 RISC processor blocks, 99,216 logic cells, 20 RocketIO multi-gigabit transceivers (operating at up to 3.125 Gb/s), and 1,164 user I/Os in a 1704-pin flip-chip BGA package. It delivers integrated processing, high-speed serial connectivity, and programmable logic for telecom backplane, wireless baseband, and video processing systems.

For engineers reviewing the XC2VP100-6FF1704C datasheet, pinout, applications, or equivalent options, key selection considerations include confirmed -6 speed grade timing (350 MHz PowerPC, 3.125 Gb/s transceivers), FF1704 package I/O count (1,164), RocketIO channel count (20), dual-processor support, and absence of bonded-out transceivers in alternate packages like FF1148.

Technical Context

This device implements a hardened architecture combining two IBM PowerPC 405 cores (32-bit Harvard, MMU, 16 KB I/D caches), 20 RocketIO transceivers with 8B/10B encoding and channel bonding, and FPGA fabric built on 0.13 µm copper process with 1.5 V core supply. It supports full-duplex serial links compliant with Gigabit Ethernet, Fibre Channel, and XAUI standards.

The FPGA fabric includes 444 18×18 multipliers, 7,992 Kb Block SelectRAM+ (18 Kb × 444), twelve Digital Clock Managers (DCMs) with phase shifting and frequency synthesis, and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X with digitally controlled impedance (DCI). All resources are interconnected via Active Interconnect routing with predictable delay.

Key Specifications

Pinout & Package

XC2VP100-6FF1704C uses the FF1704 flip-chip fine-pitch BGA package: 42.5 mm × 42.5 mm, 1.0 mm ball pitch, 1704 I/O balls. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCINT (1.5 V), VCCAUX (2.5 V), VCCO (1.2–3.3 V configurable), differential pairs, clock inputs, configuration pins (CCLK, DONE, M0–M2, PROG_B), JTAG (TCK/TMS/TDI/TDO), and PowerPC debug interfaces.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA with embedded processor applications.

Compared with XC2VP100-6FF1704C, XC2VP70-6FF896C offers reduced logic and I/O at lower cost and smaller footprint but sacrifices scalability for future feature expansion; XC4VLX160-11FF1513C provides greater capacity and bandwidth with modern process advantages but mandates toolchain and IP migration.

Availability

XC2VP100-6FF1704C is available at Aetrix Electronics and suitable for telecom infrastructure, wireless base station development, and broadcast video equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP100-6FF1704C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as the industry's first high-performance FPGA platform for system-on-chip integration.

The Virtex-II Pro family was designed to unify programmable logic, embedded processors, and high-speed serial I/O in a single device-targeting applications demanding both hardware acceleration and software-defined control, such as networking and signal processing.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP100-6FF1704C?

The XC2VP100-6FF1704C speed grade -6 guarantees sustained 350 MHz operation of both PowerPC 405 cores under commercial temperature conditions. This is confirmed in DS083 Table 4 and applies when CPMC405CLOCK runs within specified voltage and thermal limits. The XC2VP100-6FF1704C does not support the -7 grade's 400 MHz mode without additional macro implementation per XAPP755.

Does XC2VP100-6FF1704C include RocketIO transceivers bonded out in the FF1704 package?

Yes, XC2VP100-6FF1704C includes all 20 RocketIO transceivers bonded out in the FF1704 package, as verified in DS083 Table 3. Unlike FF1148 or FF1696 variants where transceivers are unbonded, the FF1704 configuration allocates dedicated balls for RXN/TXN and RXP/TXP pairs across multiple banks, enabling full 20-channel operation.

What I/O standards are supported by XC2VP100-6FF1704C with on-chip termination?

XC2VP100-6FF1704C supports on-chip termination for LVDS, LVDS Extended, ULVDS, and LDT differential standards, plus single-ended standards including LVCMOS (1.5 V/1.8 V/2.5 V/3.3 V), SSTL (1.8 V/2.5 V), HSTL (1.5 V/1.8 V), and PCI-X via its XCITE Digitally Controlled Impedance (DCI) technology, eliminating external resistors for these interfaces.

How many 18 Kb Block SelectRAM+ modules does XC2VP100-6FF1704C contain?

XC2VP100-6FF1704C contains 444 Block SelectRAM+ modules, each providing 18 Kb of true dual-port RAM. This totals 7,992 Kb of embedded memory, configurable from 16K×1 to 512×36, and is explicitly listed in DS083 Table 1 under "Block SelectRAM+" for the XC2VP100 device row.

Is XC2VP100-6FF1704C recommended for new designs?

No, XC2VP100-6FF1704C is marked "Product Not Recommended For New Designs" per DS083 cover page and Module 1. It remains available for legacy support and obsolescence management, but Xilinx recommends Virtex-4 or later families for new projects due to enhanced performance, power efficiency, and extended lifecycle availability.