AMD XC2VP100-6FF1704I

Overview

XC2VP100-6FF1704I from Xilinx is a high-density Virtex-II Pro Platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, up to 20 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 99,216 logic cells, and 1,164 user I/Os in a 1704-pin flip-chip fine-pitch BGA package. It targets high-throughput telecom, networking, and video processing systems requiring integrated processing, serial connectivity, and programmable logic.

For engineers reviewing the XC2VP100-6FF1704I datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual PowerPC 405 core support, -6 speed grade timing (350 MHz PowerPC, 3.125 Gb/s transceivers), FF1704 package I/O count (1,164), and absence of bonded-out RocketIO transceivers in this specific configuration - critical for board layout and signal integrity planning.

Technical Context

The XC2VP100-6FF1704I implements a hardened architecture combining SRAM-based FPGA fabric with two IBM PowerPC 405 cores (32-bit Harvard, MMU, 16 KB instruction/data caches) and configurable RocketIO transceivers - though in this FF1704 package variant, RocketIO pins are not bonded out per Table 3, reallocating pins to SelectIO-Ultra I/O resources. Its clocking system includes twelve Digital Clock Managers (DCMs) supporting precise phase shifting, frequency synthesis, and deskew across 16 global clock nets.

Logic resources comprise 44,096 CLB slices, 444 18×18-bit multipliers, and 7,992 Kb of Block SelectRAM+ memory (12 × 18-Kb blocks), enabling large embedded memory structures and high-performance DSP functions. I/O subsystem supports 22 single-ended and 10 differential standards including LVDS (840 Mb/s), PCI-X, SSTL, and HSTL, with Digitally Controlled Impedance (DCI) for on-die termination calibration.

Key Specifications

Pinout & Package

XC2VP100-6FF1704I uses the FF1704 flip-chip fine-pitch BGA package: 42.5 mm × 42.5 mm, 1.0 mm pitch, 1704 balls. Per DS083 Table 3, this package variant has zero bonded-out RocketIO transceivers; all 1,164 user I/Os are allocated to SelectIO-Ultra banks. Pin definitions and full ball map are documented across 302 pages in Module 4 of DS083.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density embedded FPGA applications.

Compared with XC2VP100-6FF1517I, the XC2VP100-6FF1704I trades transceiver availability for maximum I/O count (1,164 vs. 964), making it optimal for parallel interface consolidation. Against XC4VLX100-11FF1513C, it retains hard PowerPC cores but lacks newer features like enhanced DCMs and lower-voltage operation - relevant for legacy system upgrades versus greenfield designs.

Availability

XC2VP100-6FF1704I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial imaging, and broadcast video equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2VP100-6FF1704I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive computing solutions used in aerospace, defense, and communications.

The Virtex-II Pro family was designed to integrate embedded processors and high-speed serial I/O into a single programmable platform, targeting systems demanding both real-time processing and flexible hardware acceleration.

FAQ

Does XC2VP100-6FF1704I include operational RocketIO transceivers?

No. Per Xilinx DS083 Table 3, the FF1704 package variant of XC2VP100 has zero bonded-out RocketIO transceivers. All 1,164 I/Os are allocated to SelectIO-Ultra banks. This configuration maximizes parallel interface capability at the expense of serial transceiver functionality - a deliberate trade-off for applications relying on parallel buses or external PHYs.

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP100-6FF1704I?

The -6 speed grade guarantees 350 MHz operation for each PowerPC 405 core under industrial temperature conditions (–40°C to +100°C). This is confirmed in DS083 Table 4. Operation above 350 MHz requires adherence to XAPP755 guidelines and is not rated for industrial-grade reliability.

Can XC2VP100-6FF1704I be configured via JTAG boundary scan?

Yes. XC2VP100-6FF1704I fully supports IEEE 1149.1 boundary-scan with dedicated TCK, TMS, TDI, and TDO pins. It enables configuration loading, readback of configuration memory and flip-flop states, and interconnect testing - all documented in Module 1 Section "Boundary Scan" of DS083.

What I/O standards are supported by XC2VP100-6FF1704I's SelectIO-Ultra blocks?

XC2VP100-6FF1704I supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI-X, GTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, HSTL, SSTL). On-chip Digitally Controlled Impedance (DCI) provides automatic termination calibration for single-ended I/Os.

Is XC2VP100-6FF1704I recommended for new designs?

No. Xilinx explicitly marks XC2VP100-6FF1704I as "Product Not Recommended For New Designs" in DS083. It remains available for legacy support and obsolescence management, but new projects should evaluate Virtex-4, Virtex-5, or modern AMD/Xilinx adaptive SoCs for improved performance, power efficiency, and long-term supply assurance.