AMD XC2VP100-6FFG1704I

Overview

XC2VP100-6FFG1704I from Xilinx is a high-density Virtex-II Pro Platform FPGA featuring dual PowerPC 405 RISC processor blocks, up to 20 RocketIO multi-gigabit transceivers (operating at 3.125 Gb/s), 99,216 logic cells, and 1,164 user I/Os in a 1704-pin flip-chip fine-pitch BGA package. It targets high-throughput telecom infrastructure, wireless baseband processing, and protocol-aware networking systems requiring embedded processing and serial interconnect.

For engineers reviewing the XC2VP100-6FFG1704I datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO transceiver count and speed grade (-6), PowerPC 405 clock frequency (350 MHz), DCI-enabled I/O support, and FF1704 package thermal/power delivery characteristics for industrial-grade operation.

Technical Context

This device integrates two independent PowerPC 405 cores with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - enabling real-time embedded software execution alongside programmable logic. Its RocketIO transceivers support full-duplex 3.125 Gb/s per channel with 8B/10B encoding, on-chip 50 Ω termination, and channel bonding across up to 20 lanes.

The FPGA fabric delivers 99,216 logic cells built from CLBs containing dual 4-input LUTs and flip-flops, 444 dedicated 18×18 multipliers, 7,992 Kb of Block SelectRAM+ memory, and twelve Digital Clock Managers (DCMs) with phase-shifting and frequency synthesis - all implemented in a 0.13 µm copper process with 1.5 V core voltage.

Key Specifications

Pinout & Package

XC2VP100-6FFG1704I uses the FF1704 flip-chip fine-pitch BGA package: 42.5 mm × 42.5 mm, 1.0 mm ball pitch, 1704 I/O balls. This package supports industrial temperature range (-40°C to +100°C) and features dedicated power/ground ball arrays for low-noise core and I/O supply distribution.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA with embedded processor applications.

Compared with XC2VP100-6FFG1704I, the -5 variant trades guaranteed 350 MHz CPU performance and 3.125 Gb/s transceiver operation for lower cost, while the -6FF1704C omits industrial temperature certification - making XC2VP100-6FFG1704I the sole option meeting both performance and ruggedized deployment requirements.

Availability

XC2VP100-6FFG1704I is available at Aetrix Electronics and suitable for telecom infrastructure, avionics data concentrators, and high-performance computing interconnects requiring stable component supply across extended lifecycle programs.

Supply support for XC2VP100-6FFG1704I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as the industry's first high-performance FPGA platform for system-on-chip integration.

The Virtex-II Pro family was designed to unify hard processor subsystems with configurable logic and high-speed serial I/O - targeting applications where ASIC-level performance meets FPGA-level flexibility, especially in communications and defense systems.

FAQ

What does the "I" suffix in XC2VP100-6FFG1704I indicate?

The "I" suffix denotes Industrial temperature grade (-40°C to +100°C), confirming that XC2VP100-6FFG1704I is fully characterized and guaranteed to operate across this extended thermal range. This includes validated timing closure, transceiver jitter performance, and PowerPC core stability - critical for outdoor telecom gear and aerospace deployments where ambient conditions exceed commercial limits.

Does XC2VP100-6FFG1704I support JTAG boundary-scan testing?

Yes, XC2VP100-6FFG1704I fully complies with IEEE 1149.1 and supports boundary-scan testing via its dedicated TCK/TMS/TDI/TDO pins. The device implements SAMPLE, EXTEST, INTEST, and HIGHZ instructions, enabling board-level interconnect verification, in-system programming, and real-time I/O pin state observation - essential for high-reliability manufacturing and field diagnostics.

Can XC2VP100-6FFG1704I be configured via SPI flash memory?

No - XC2VP100-6FFG1704I does not support native SPI flash configuration. It requires configuration through Master/Slave Serial mode or SelectMAP mode using parallel NOR flash or microcontroller-driven bitstream loading. External SPI flash must be interfaced via PowerPC firmware or FPGA logic; no hardware boot-from-SPI controller is embedded in the XC2VP100-6FFG1704I silicon.

How many RocketIO transceivers are active in XC2VP100-6FFG1704I?

XC2VP100-6FFG1704I is specified with 20 RocketIO transceivers, all operational in the FF1704 package. Unlike some variants (e.g., FF1148/FF1696 packages where transceivers are unbonded), the FF1704 package routes all 20 transceiver channels to external balls - confirmed in Table 3 of DS083 and supported by the -6 speed grade's 3.125 Gb/s per-channel rating.

Is XC2VP100-6FFG1704I still recommended for new designs?

No - XC2VP100-6FFG1704I is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). While fully functional and supported for legacy program continuity, Xilinx recommends migrating to 7-series or UltraScale FPGAs for new development due to superior density, power efficiency, and integrated transceiver capabilities. Aetrix Electronics maintains inventory for obsolescence mitigation and long-term support.