AMD XC2VP20-5FF1152C
- Part No.:
- XC2VP20-5FF1152C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC2VP20-5FF1152C.pdf
- Description:
- IC FPGA 564 I/O 1152FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,960
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2VP20-5FF1152C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.0 Gb/s max), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in an FF1152 flip-chip BGA package. It delivers embedded processing, high-speed serial connectivity, and programmable logic for telecom backplane interfaces and DSP-accelerated control systems.
For engineers reviewing the XC2VP20-5FF1152C datasheet, pinout, applications, or equivalent options, this page provides verified architecture-level specifications, confirmed I/O count and transceiver capability, package-mapped pin definitions, real-world use scenarios, and validated alternative options for legacy system sustainment and redesign.
Technical Context
The XC2VP20-5FF1152C implements a dual-processor SoC-FPGA architecture with two independent PowerPC 405 cores operating up to 300 MHz (–5 speed grade), each backed by 16 KB instruction and 16 KB data caches, MMU, and OCM interface. Its eight RocketIO transceivers support full-duplex operation at 2.0 Gb/s with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.
FPGA fabric includes 9,280 CLB slices, 290 dedicated 18×18 multipliers, 88 Block SelectRAM+ modules (18 Kb each), and twelve DCMs enabling precise clock deskew, multiplication/division, and ±180° phase shifting. Routing uses Active Interconnect Technology with hierarchical segmented resources and predictable delay independent of fanout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 20,880 - total configurable logic capacity for complex digital functions and state machines |
| PowerPC Blocks | 2 × PowerPC 405 - hard-core RISC processors with 32-bit GPRs, MMU, and cache for embedded software execution |
| RocketIO Transceivers | 8 × RocketIO - 2.0 Gb/s full-duplex SERDES with 8B/10B encoding, channel bonding, and internal loopback |
| User I/O Pads | 564 - configurable single-ended/differential I/O supporting LVDS, SSTL, HSTL, PCI-X, and DCI termination |
| Digital Clock Managers | 12 × DCM - fully digital clock synthesis, deskew, and fine-grained phase shift (1/256 period resolution) |
| Block RAM | 88 × 18 Kb SelectRAM+ - true dual-port memory blocks supporting up to 512 × 36-bit configurations |
| Multiplier Blocks | 290 × 18 × 18-bit - dedicated signed arithmetic units optimized for DSP filtering and MAC operations |
Pinout & Package
XC2VP20-5FF1152C is housed in a 35 mm × 35 mm FF1152 flip-chip fine-pitch BGA package with 1.0 mm ball pitch, designed for high I/O density and thermal performance. Pin definitions are documented across 302 pages in DS083 Module 4, including dedicated configuration pins (CCLK, DONE, PROG_B), JTAG boundary-scan signals (TCK/TDI/TDO/TMS), dual PowerPC debug interfaces, eight RocketIO transceiver banks (each with TXP/TXN/RXP/RXN pairs), and 564 user-configurable I/O banks with per-bank VCCO and VREF support.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during master/slave serial or SelectMAP programming modes |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading and device initialization completion |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| TCK/TMS/TDI/TDO | JTAG Test Access Port | IEEE 1149.1-compliant boundary-scan interface for testing, debugging, and ISP programming |
| TXP/TXN (per MGT) | Differential Transmitter Output | Current-mode differential pair supporting 2.0 Gb/s serial output with programmable swing (200–1600 mVpp) |
| RXP/RXN (per MGT) | Differential Receiver Input | On-chip 50 Ω termination enabled; supports receiver equalization and comma detection for protocol alignment |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Independent 32-bit RISC processors with Harvard architecture, 16 KB I-cache/16 KB D-cache, MMU, and OCM interface for real-time embedded control |
| RocketIO Transceivers | Eight 2.0 Gb/s full-duplex SERDES with monolithic CDR, 8B/10B encode/decode, and channel bonding for multi-lane protocols like XAUI |
| SelectIO-Ultra I/O | 564 user I/Os supporting 22 single-ended and 10 differential standards, including LVDS, SSTL, HSTL, and PCI-X, with XCITE DCI for on-chip impedance matching |
| Digital Clock Manager (DCM) | Twelve fully digital DCMs providing jitter-free clock multiplication/division, zero-delay buffering, and fine-grained phase adjustment (±180° in 1/256 steps) |
| Block SelectRAM+ Memory | 88 × 18 Kb true dual-port RAM blocks supporting synchronous read-during-write and cascadable depth/width configurations up to 16K × 1 or 512 × 36 |
| 18 × 18 Multiplier Blocks | 290 dedicated hardware multipliers enabling cycle-accurate DSP operations such as FIR filtering, FFT butterfly computation, and MAC accumulation |
Applications
| Telecom Backplane Interface | High-Speed Data Acquisition |
|---|---|
|
Use Scenario: Aggregating multiple 1 GbE or SONET OC-3 streams into a unified backplane using time-division multiplexing and packet switching. IC Role / Device Role / Timing Role: XC2VP20-5FF1152C acts as line-card controller with integrated RocketIO transceivers handling physical layer serialization/deserialization and PowerPC cores managing traffic scheduling and QoS policy enforcement. Use Value: Eliminates need for external PHYs and microcontrollers; reduces board area and interconnect latency while enabling field-upgradable protocol stacks via partial reconfiguration. |
Use Scenario: Real-time digitization and preprocessing of analog sensor data from radar or medical imaging front-ends at >100 MSPS sample rates. IC Role / Device Role / Timing Role: XC2VP20-5FF1152C serves as acquisition engine-RocketIO links transfer ADC samples to host FPGA or DSP, while CLBs implement decimation filters and PowerPC executes calibration algorithms. Use Value: Combines high-speed I/O bandwidth (LVDS input support), deterministic timing (DCM-controlled sampling clocks), and embedded processing to replace discrete ADC + FPGA + CPU architectures. |
| Industrial Protocol Gateway | Legacy System Emulation |
|
Use Scenario: Bridging Modbus RTU over RS-485 to EtherNet/IP or PROFINET in factory automation controllers requiring deterministic response under 1 ms. IC Role / Device Role / Timing Role: XC2VP20-5FF1152C hosts dual PowerPC cores-one running real-time OS for protocol stack, the other managing FPGA-based hardware accelerators for CRC, framing, and timestamping. Use Value: Achieves sub-millisecond cycle times via hardware offload of time-critical tasks, while maintaining software flexibility for field updates and multi-protocol support. |
Use Scenario: Replacing obsolete ASICs or gate arrays in avionics or defense systems where original silicon is no longer available or qualified. IC Role / Device Role / Timing Role: XC2VP20-5FF1152C replicates legacy logic functionality in FPGA fabric while embedding replacement control firmware in PowerPC block RAM and booting from external Flash. Use Value: Enables drop-in functional equivalence without PCB redesign; leverages built-in IEEE 1149.1 boundary-scan for verification against original netlists and timing closure reports. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP30-5FF896C | Higher logic density (30,816 cells), same dual PowerPC + 8 RocketIO, but in smaller FF896 package (31×31 mm) and lower I/O count (644 vs. 564) | Better suited for space-constrained designs needing more fabric resources but fewer I/Os | Select when additional CLBs or Block RAM are required without increasing board footprint beyond FF896 limits |
| XC2VP7-6FG456C | Single PowerPC core, 4 RocketIO transceivers, lower logic count (11,088 cells), wire-bond FG456 package (23×23 mm), industrial temperature grade available | Targeted at cost-sensitive, lower-bandwidth industrial control applications with extended temp requirements | Choose for legacy industrial upgrades where radiation tolerance, extended temperature range, or lower power consumption are prioritized over dual-core throughput |
Compared with XC2VP20-5FF1152C, XC2VP30-5FF896C offers greater logic capacity in a smaller footprint but trades I/O count and thermal headroom, while XC2VP7-6FG456C reduces complexity and cost at the expense of processing parallelism and serial bandwidth-making it suitable only for scaled-down implementations.
Availability
XC2VP20-5FF1152C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, and high-speed data acquisition systems requiring stable component supply and long-term obsolescence management.
Supply support for XC2VP20-5FF1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture with SRAM-based configuration, hierarchical routing, and embedded hard IP.
The Virtex-II Pro family was engineered to integrate processor cores and high-speed transceivers into a single programmable platform, targeting applications demanding both software-defined control and hardware-accelerated signal processing in networking and aerospace systems.
FAQ
What is the maximum RocketIO transceiver speed supported by XC2VP20-5FF1152C?
The XC2VP20-5FF1152C supports RocketIO transceivers rated for up to 2.0 Gb/s full-duplex operation in the –5 speed grade, as specified in Table 4 of DS083. This applies to all eight transceiver channels and is compatible with Fibre Channel, Gigabit Ethernet, and XAUI protocols using 8B/10B encoding. The device does not include RocketIO X cores, which are exclusive to XC2VPX20/XC2VPX70 variants.
Does XC2VP20-5FF1152C support partial reconfiguration?
Yes, XC2VP20-5FF1152C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This allows dynamic modification of specific FPGA regions without disrupting active PowerPC execution or RocketIO link operation-enabling runtime adaptation of communication protocols or filter coefficients in deployed systems.
What I/O standards are supported by XC2VP20-5FF1152C?
XC2VP20-5FF1152C supports 22 single-ended standards-including LVTTL, LVCMOS (3.3V/2.5V/1.8V/1.5V), PCI/PCI-X, GTL, HSTL, and SSTL-and 10 differential standards such as LVDS, BLVDS, ULVDS, LDT, and LVPECL. Its XCITE Digitally Controlled Impedance (DCI) feature enables automatic on-chip termination for all supported single-ended I/Os.
Is XC2VP20-5FF1152C recommended for new designs?
No, XC2VP20-5FF1152C is marked "Product Not Recommended For New Designs" per DS083 v5.0 (June 2011). It remains available for legacy system support, repair, and obsolescence mitigation-but Xilinx recommends Virtex-5 or newer families for new development due to superior performance, power efficiency, and toolchain support.
What configuration modes does XC2VP20-5FF1152C support?
XC2VP20-5FF1152C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration bitstreams can be encrypted using on-chip DES/3DES decryptors, and readback capability enables verification of both configuration memory and register/latch states for debugging.
XC2VP20-5FF1152C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2320
- Number of Logic Elements/Cells:
- 20880
- Total RAM Bits:
- 1622016
- Number of I/O:
- 564
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC2VP20-5FF1152C FAQ
1.How can I place an order for XC2VP20-5FF1152C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP20-5FF1152C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP20-5FF1152C reliable?
The price and inventory of XC2VP20-5FF1152C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP20-5FF1152C is usually 5 days.
3.What payment methods are accepted for XC2VP20-5FF1152C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP20-5FF1152C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP20-5FF1152C?
XC2VP20-5FF1152C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP20-5FF1152C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP20-5FF1152C?
For technical support, including XC2VP20-5FF1152C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP20-5FF1152C requirements.
6.How does Aetrix verify that XC2VP20-5FF1152C is sourced from the original manufacturer or authorized distributors?
All XC2VP20-5FF1152C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP20-5FF1152C meets industry standards.
7.What is the process for return or replacement of XC2VP20-5FF1152C?
All XC2VP20-5FF1152C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP20-5FF1152C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP20-5FF1152C part is unused and in its original packaging.
Return procedure for XC2VP20-5FF1152C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2VP20-5FF1152C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
