AMD XC2VP20-5FF1152I
- Part No.:
- XC2VP20-5FF1152I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC2VP20-5FF1152I.pdf
- Description:
- IC FPGA 564 I/O 1152FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,800
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Product details
Overview
XC2VP20-5FF1152I from Xilinx is a high-density, radiation-tolerant (industrial-grade) Virtex-II Pro platform FPGA integrating two 300 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.0 Gb/s), 20,880 logic cells, 88 18×18 multipliers, and 8 Digital Clock Managers - deployed in telecom backplane interfaces requiring deterministic latency and embedded processing.
For engineers reviewing the XC2VP20-5FF1152I datasheet, pinout, applications, or equivalent options, key selection criteria include dual-processor coherency support, 2.0 Gb/s transceiver compliance with Fibre Channel and Gigabit Ethernet, DCM-based clock deskew for synchronous I/O, and FF1152 flip-chip BGA package compatibility with industrial thermal cycling requirements.
Technical Context
This device implements a hardened dual-PowerPC 405 subsystem with 16 KB instruction and 16 KB data caches, MMU, and CoreConnect bus interface - enabling real-time OS execution alongside programmable logic. Its eight RocketIO transceivers operate at 2.0 Gb/s in -5 speed grade, supporting 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.
The FPGA fabric includes 9,280 CLB slices, 1,584 Kb distributed RAM, 564 Kb block SelectRAM+ (18 Kb × 31 blocks), and twelve global clock networks driven by DCMs offering ±120 ps phase shift resolution and jitter < 150 ps peak-to-peak - critical for source-synchronous DDR memory interfaces and serial link alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 20,880 - supports complex protocol stacks and hardware-accelerated DSP pipelines |
| PowerPC Blocks | 2 × 300 MHz - enables symmetric multiprocessing or dedicated control + signal processing partitioning |
| RocketIO Transceivers | 8 × 2.0 Gb/s - meets Fibre Channel FC-AL and Gigabit Ethernet PHY layer timing budgets |
| Block RAM | 564 Kb (31 × 18 Kb) - implements large FIFOs for packet buffering between transceivers and processors |
| Digital Clock Managers | 8 × DCM - provides independent clock domain synthesis for processor, transceiver, and fabric domains |
| I/O Pads | 564 user I/Os - supports high-pin-count parallel buses (e.g., PCI-X 66 MHz, DDR SDRAM) |
| Process Technology | 0.13 µm copper CMOS - ensures stable operation across -40°C to +100°C industrial temperature range |
Pinout & Package
XC2VP20-5FF1152I uses the FF1152 flip-chip fine-pitch BGA package (35 mm × 35 mm, 1.0 mm pitch), optimized for thermal dissipation and high I/O count in industrial environments. Pin definitions are documented across 302 pages in DS083 Module 4, with dedicated banks for VCCAUX (2.5 V), VCCO (1.5/1.8/2.5/3.3 V configurable), and differential transceiver pairs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives master-mode bitstream loading; requires 0–50 MHz LVCMOS clock with 40%–60% duty cycle |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful configuration completion |
| M0–M2 | Mode Selection Inputs | Set configuration mode (e.g., Master SelectMAP, Slave Serial) at power-up |
| DXP/DXN | RocketIO Differential TX Pair | LVDS-compatible 2.0 Gb/s serial output; requires AC coupling and 100 Ω differential termination |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming, debugging, and silicon validation |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables concurrent real-time control (e.g., link management) and packet processing without external CPU |
| RocketIO Transceivers | Eliminates external SERDES ICs and reduces board area by integrating 8 full-duplex 2.0 Gb/s channels |
| Digital Clock Manager (DCM) | Provides zero-delay clock distribution and sub-ns phase alignment for DDR I/O timing closure |
| SelectIO-Ultra I/O | Supports 22 single-ended and 10 differential standards (LVDS, SSTL, HSTL) with programmable drive strength |
| On-Chip Memory Hierarchy | Combines 1,584 Kb distributed RAM and 564 Kb block RAM to minimize off-chip memory bandwidth bottlenecks |
Applications
| Telecom Backplane Interface | Industrial Video Processing |
|---|---|
Use Scenario: High-availability optical transport equipment handling OC-48/STM-16 line rates with redundant control planes. IC Role / Device Role / Timing Role: XC2VP20-5FF1152I serves as line-card controller, managing SONET framer, FEC, and cross-connect switching via its dual PowerPC cores and RocketIO transceivers. Use Value: Integrated transceivers eliminate external PHY chips, reducing BOM cost and improving signal integrity over 15 cm backplane traces. | Use Scenario: Real-time HD video analytics system capturing four 1080p60 streams for object detection and metadata tagging. IC Role / Device Role / Timing Role: XC2VP20-5FF1152I implements pixel-level filtering in fabric while running Linux on one PowerPC core and vision algorithms on the other. Use Value: 564 Kb on-chip RAM buffers uncompressed frame data, avoiding DDR latency penalties during motion estimation. |
| Medical Imaging Controller | Military Data Link Terminal |
Use Scenario: Portable MRI scanner requiring deterministic image reconstruction latency and EMI-hardened I/O. IC Role / Device Role / Timing Role: XC2VP20-5FF1152I acts as sensor interface hub, synchronizing ADC sampling clocks via DCM outputs and formatting DICOM packets in PowerPC firmware. Use Value: Industrial-grade (-40°C to +100°C) operation and on-chip DCI impedance matching ensure reliable signal capture in mobile field deployments. | Use Scenario: Tactical radio terminal implementing TTP/C time-triggered protocol over fiber-optic links. IC Role / Device Role / Timing Role: XC2VP20-5FF1152I executes time-critical scheduling logic in PowerPC cores while RocketIO transceivers handle encrypted 2.0 Gb/s payload transmission. Use Value: Hardware-accelerated 8B/10B encoding and channel bonding guarantee sub-microsecond jitter for deterministic network synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP30-5FF896I | 30,816 logic cells, 8 RocketIO transceivers, 644 user I/Os, FF896 package (31×31 mm) | Higher logic density supports larger protocol stacks but fewer I/Os than XC2VP20-5FF1152I | Select when additional fabric resources are needed without increasing board footprint beyond 31 mm² |
| XC2VP40-5FF1148I | No RocketIO transceivers, 43,632 logic cells, 804 user I/Os, FF1148 package (35×35 mm) | Optimized for I/O-intensive parallel bus interfacing (e.g., PCI-X, DDR2) rather than serial connectivity | Choose when transceiver functionality is unnecessary and maximum parallel I/O count is prioritized |
Compared with XC2VP20-5FF1152I, XC2VP30-5FF896I trades I/O count for higher logic capacity in a smaller package, while XC2VP40-5FF1148I sacrifices transceivers to maximize parallel interface pins - making XC2VP20-5FF1152I the optimal balance of embedded processing, serial I/O, and industrial packaging for backplane and imaging systems.
Availability
XC2VP20-5FF1152I is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging, industrial automation, and defense electronics requiring stable component supply across extended lifecycle commitments.
Supply support for XC2VP20-5FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered SRAM-based FPGAs and platform devices with integrated processors and high-speed transceivers for reconfigurable computing.
The Virtex-II Pro family was designed specifically for high-reliability embedded systems needing tightly coupled software-defined logic and hardware-accelerated I/O - targeting telecom, aerospace, and industrial control markets.
FAQ
What is the maximum operating frequency of the PowerPC 405 cores in XC2VP20-5FF1152I?
The XC2VP20-5FF1152I supports 300 MHz PowerPC 405 cores in the -5 speed grade under industrial temperature conditions (-40°C to +100°C). This frequency is guaranteed per DS083 Table 4 and applies to both cores simultaneously when using proper voltage regulation and thermal management per XAPP755 guidelines.
Does XC2VP20-5FF1152I support JTAG boundary-scan testing?
Yes, XC2VP20-5FF1152I fully complies with IEEE 1149.1 and supports boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements SAMPLE, EXTEST, and INTEST instructions, enabling PCB interconnect verification and in-system programming without requiring external debug probes.
What transceiver protocols are supported by the RocketIO blocks in XC2VP20-5FF1152I?
The XC2VP20-5FF1152I RocketIO transceivers support Fibre Channel, Gigabit Ethernet, 10G Fibre Channel, InfiniBand, and XAUI protocols at up to 2.0 Gb/s per channel. Protocol compliance is achieved through integrated 8B/10B encoding, channel bonding, and programmable pre-emphasis - all confirmed in DS083 Module 2.
Can XC2VP20-5FF1152I be configured in Master SelectMAP mode?
Yes, XC2VP20-5FF1152I supports Master SelectMAP configuration using the CCLK pin to drive an external PROM or flash memory. In this mode, the FPGA generates the configuration clock and reads the bitstream sequentially - enabling fast, autonomous startup without host processor intervention.
Is XC2VP20-5FF1152I pin-compatible with other Virtex-II Pro devices in FF1152 packaging?
No, XC2VP20-5FF1152I is not pin-compatible with other Virtex-II Pro devices in FF1152 packages. While physical pad layout matches the FF1152 footprint, I/O bank assignments, voltage requirements, and transceiver pin mappings differ across device densities - requiring unique PCB layouts per part number as specified in DS083 Table 3.
XC2VP20-5FF1152I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2320
- Number of Logic Elements/Cells:
- 20880
- Total RAM Bits:
- 1622016
- Number of I/O:
- 564
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC2VP20-5FF1152I FAQ
1.How can I place an order for XC2VP20-5FF1152I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP20-5FF1152I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP20-5FF1152I reliable?
The price and inventory of XC2VP20-5FF1152I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP20-5FF1152I is usually 5 days.
3.What payment methods are accepted for XC2VP20-5FF1152I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP20-5FF1152I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP20-5FF1152I?
XC2VP20-5FF1152I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP20-5FF1152I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP20-5FF1152I?
For technical support, including XC2VP20-5FF1152I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP20-5FF1152I requirements.
6.How does Aetrix verify that XC2VP20-5FF1152I is sourced from the original manufacturer or authorized distributors?
All XC2VP20-5FF1152I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP20-5FF1152I meets industry standards.
7.What is the process for return or replacement of XC2VP20-5FF1152I?
All XC2VP20-5FF1152I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP20-5FF1152I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP20-5FF1152I part is unused and in its original packaging.
Return procedure for XC2VP20-5FF1152I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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