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AMD XC2VP20-5FF896I

Part No.:
XC2VP20-5FF896I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
896-BBGA, FCBGA
Datasheet:
AetrixXC2VP20-5FF896I.pdf
Description:
IC FPGA 556 I/O 896FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,429

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Product details

Overview

XC2VP20-5FF896I from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.0–3.125 Gb/s), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in an FF896 flip-chip BGA package. It delivers embedded processing, high-speed serial interconnect, and programmable logic for telecom backplane, wireless baseband, and video processing systems.

For engineers reviewing the XC2VP20-5FF896I datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC 405 core support at 300 MHz (–5 speed grade), RocketIO transceiver compliance with Fibre Channel, Gigabit Ethernet, and XAUI, DCI-enabled I/O termination, and 1.5 V core voltage operation.

Technical Context

The XC2VP20-5FF896I implements a hardened architecture combining SRAM-based FPGA fabric with embedded processor subsystems and SERDES transceivers. Its dual PowerPC 405 cores operate at up to 300 MHz (–5 grade), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. The eight RocketIO transceivers support full-duplex operation from 600 Mb/s to 3.125 Gb/s with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

Logic resources include 9,280 CLB slices, 290 dedicated 18×18 multipliers, 88 Block SelectRAM+ modules (18 Kb each), and twelve DCMs enabling precise clock deskew, multiplication/division, and phase shifting. I/O supports 22 single-ended and 10 differential standards-including LVDS, SSTL, HSTL-with programmable drive strength (2–24 mA) and Digitally Controlled Impedance (DCI).

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells20,880 - total configurable logic capacity for complex digital logic implementation
PowerPC Cores2 × PowerPC 405 - embedded RISC processors with cache, MMU, and OCM interface
RocketIO Transceivers8 × RocketIO - full-duplex SERDES supporting 600 Mb/s to 3.125 Gb/s with 8B/10B encoding
User I/O Pins564 - configurable pins supporting LVDS, SSTL, HSTL, PCI-X, and DCI-terminated standards
Digital Clock Managers12 × DCM - fully digital clock synthesis, deskew, frequency multiplication/division, and phase shifting
Block RAM88 × 18 Kb SelectRAM+ - true dual-port memory blocks configurable from 16K×1 to 512×36
Core Voltage1.5 V VCCINT - low-voltage operation enabling higher density and reduced power per logic cell
Speed Grade–5 - specifies guaranteed timing performance including 300 MHz PowerPC operation and 3.125 Gb/s transceiver rate

Pinout & Package

XC2VP20-5FF896I is housed in an FF896 flip-chip fine-pitch BGA package with 1.0 mm pitch, 31 mm × 31 mm body size, and 896 solder balls. This package supports high I/O count, superior thermal dissipation, and signal integrity for high-speed transceiver and processor interfaces.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration Clock InputDrives internal configuration logic during master or slave serial/SelectMAP programming
DONEConfiguration Status OutputOpen-drain signal indicating successful bitstream loading and initialization completion
M0–M2Mode Selection InputsThree-pin bus defining configuration mode (e.g., Slave Serial, Master SelectMAP, Boundary Scan)
PROG_BProgram Initiate InputActive-low signal triggering device reconfiguration and clearing of configuration memory
TCK/TMS/TDI/TDOJTAG Test Access PortIEEE 1149.1-compliant boundary-scan interface for testing, debugging, and programming
DXP/DXNDifferential Clock Input PairAccepts external differential reference clock for DCMs and RocketIO CDR circuits
GTxP/GTxN
(e.g., GT12P/GT12N)
RocketIO Transceiver LaneDifferential transmit/receive pair supporting 600 Mb/s–3.125 Gb/s serial data with integrated termination
PPC405_0_*
PPC405_1_*
PowerPC Core Interface SignalsDedicated buses for instruction/data access, interrupt, debug, and OCM connection for each core

Key Features

FeatureDesign Value
Dual PowerPC 405 CoresEnables asymmetric multiprocessing: one core for real-time control, second for protocol stack or DSP offload
Eight RocketIO TransceiversSupports multi-channel backplane links (e.g., XAUI ×4, Fibre Channel ×8) without external PHYs or clock recovery ICs
Digitally Controlled Impedance (DCI)Eliminates need for external series/parallel termination resistors on single-ended I/Os, reducing BOM and layout complexity
Twelve Digital Clock Managers (DCMs)Provides independent clock domain management for processor, fabric, and I/O-enabling synchronous system-level timing across heterogeneous blocks
SelectIO-Ultra I/O ArchitectureAllows mixed-voltage operation (1.5V/1.8V/2.5V/3.3V) on same device with programmable drive strength and slew rate control
SRAM-Based In-System ConfigurationEnables field-upgradable functionality via JTAG or SelectMAP, with optional Triple-DES bitstream encryption for IP protection

Applications

Telecom Backplane InterfaceWireless Baseband Processing

Use Scenario: High-density line card implementing 4× XAUI-to-PCI Express bridging in metro edge routers.

IC Role / Device Role / Timing Role: XC2VP20-5FF896I serves as protocol-aware bridge ASIC replacement, handling 10 Gb/s aggregate serial traffic, PCIe endpoint logic, and control plane processing.

Use Value: Integrates transceivers, processor, and logic in one package-reducing latency vs. discrete PHY+FPGA+CPU solutions and eliminating interposer routing.

Use Scenario: 3G Node-B baseband unit performing channel coding, modulation, and MIMO precoding before RF upconversion.

IC Role / Device Role / Timing Role: XC2VP20-5FF896I executes real-time DSP kernels in FPGA fabric while PowerPC cores manage LTE/UMTS stack, scheduler, and transport layer.

Use Value: 290× 18×18 multipliers and 88× 18 Kb RAM blocks enable parallel filter banks and FFT engines; dual PPC405 ensures deterministic control response.

Medical Imaging Data AcquisitionHigh-Resolution Broadcast Video Processing

Use Scenario: PET/CT scanner front-end acquiring synchronized analog detector signals at 125 MSPS across 256 channels.

IC Role / Device Role / Timing Role: XC2VP20-5FF896I performs time-of-flight correlation, histogram binning, and lossless compression using distributed RAM and CLBs, with PowerPC managing DICOM export.

Use Value: 564 user I/Os support parallel ADC interfacing; DCI enables matched-impedance LVDS capture at 840 Mb/s per lane without external termination.

Use Scenario: 4K UHD video switcher ingesting four SMPTE 2082-1 (12 Gb/s) inputs and performing frame-sync, color correction, and genlock.

IC Role / Device Role / Timing Role: XC2VP20-5FF896I terminates and retimes serial video streams via RocketIO, applies LUT-based 3D LUT correction in fabric, and coordinates timing with dual DCMs.

Use Value: On-chip 50 Ω differential termination and CDR eliminate external retimers; 12 DCMs provide independent pixel-clock domains for each input path.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC2VP20-6FF896IHigher speed grade (–6): supports 350 MHz PowerPC operation and 3.125 Gb/s RocketIO at industrial temperature rangeSuitable for extended-temperature industrial control or avionics where timing margin is criticalSelect when design requires guaranteed 350 MHz CPU operation or tighter setup/hold margins under worst-case voltage/temperature
XC2VP30-5FF896IHigher logic density (30,816 cells), same package, same speed grade, adds 4 more RocketIO transceivers (12 total)Better suited for systems requiring additional SERDES lanes or larger fabric for protocol accelerationChoose when migrating from XC2VP20-5FF896I to accommodate increased logic utilization or multi-protocol transceiver requirements

Compared with XC2VP20-5FF896I, the –6 variant offers improved timing headroom for demanding clock domains, while XC2VP30-5FF896I provides scalable transceiver count and logic capacity without changing PCB footprint-enabling upgrade paths within identical thermal and mechanical constraints.

Availability

XC2VP20-5FF896I is available at Aetrix Electronics and suitable for telecom infrastructure, wireless base station, and medical imaging applications requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP20-5FF896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and embedded processor platforms.

The Virtex-II Pro family was designed to unify programmable logic, embedded processing, and high-speed serial I/O in a single device for system-on-chip integration in high-performance communications and signal processing.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP20-5FF896I?

The XC2VP20-5FF896I is rated for 300 MHz PowerPC 405 core operation under –5 speed grade conditions, validated across commercial temperature range (0°C to 85°C). This frequency assumes proper decoupling, 1.5 V VCCINT supply, and adherence to XAPP755 guidelines for dual-core timing closure. Higher frequencies require speed-grade upgrades like XC2VP20-6FF896I.

Does XC2VP20-5FF896I support 64B/66B encoding in its RocketIO transceivers?

No, XC2VP20-5FF896I contains standard RocketIO transceivers-not RocketIO X cores-and therefore supports only 8B/10B encoding. 64B/66B encoding is exclusive to XC2VPX20 and XC2VPX70 devices. Attempting to configure 64B/66B on XC2VP20-5FF896I will result in functional failure or undefined behavior.

Can XC2VP20-5FF896I be configured via JTAG boundary scan after power-up?

Yes, XC2VP20-5FF896I supports IEEE 1149.1-compliant boundary-scan configuration through TCK/TMS/TDI/TDO pins. It accepts configuration bitstreams in Boundary-Scan mode per IEEE 1532, enabling in-system programming and debugging without dedicated configuration pins. The DONE pin asserts upon successful JTAG configuration completion.

What I/O standards does XC2VP20-5FF896I support with on-chip termination?

XC2VP20-5FF896I supports on-chip termination for LVDS, LVDS Extended, ULVDS, and LDT differential standards, plus all single-ended standards via Digitally Controlled Impedance (DCI)-including LVCMOS (1.5V/1.8V/2.5V/3.3V), SSTL, HSTL, and PCI-X. DCI automatically calibrates termination resistance to match line impedance without external components.

Is XC2VP20-5FF896I pin-compatible with other Virtex-II Pro devices in FF896 packaging?

No, XC2VP20-5FF896I is not pin-compatible with other Virtex-II Pro devices in FF896 packages. While physical footprint and ball count match, I/O assignment, power pin distribution, and transceiver lane mapping differ across device densities. For example, XC2VP30-5FF896I allocates additional balls to extra RocketIO lanes and I/O banks, making direct substitution impossible without PCB redesign.

XC2VP20-5FF896I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II Pro
Package/Case:
896-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
2320
Number of Logic Elements/Cells:
20880
Total RAM Bits:
1622016
Number of I/O:
556
Number of Gates:
-
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
896-FCBGA (31x31)

XC2VP20-5FF896I FAQ

1.How can I place an order for XC2VP20-5FF896I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2VP20-5FF896I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2VP20-5FF896I reliable?

The price and inventory of XC2VP20-5FF896I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP20-5FF896I is usually 5 days.

3.What payment methods are accepted for XC2VP20-5FF896I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP20-5FF896I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2VP20-5FF896I?

XC2VP20-5FF896I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2VP20-5FF896I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2VP20-5FF896I?

For technical support, including XC2VP20-5FF896I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP20-5FF896I requirements.

6.How does Aetrix verify that XC2VP20-5FF896I is sourced from the original manufacturer or authorized distributors?

All XC2VP20-5FF896I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP20-5FF896I meets industry standards.

7.What is the process for return or replacement of XC2VP20-5FF896I?

All XC2VP20-5FF896I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP20-5FF896I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2VP20-5FF896I part is unused and in its original packaging.

Return procedure for XC2VP20-5FF896I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2VP20-5FF896I Tags

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