AMD XC2VP20-5FF896I
- Part No.:
- XC2VP20-5FF896I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 896-BBGA, FCBGA
- Datasheet:
-
XC2VP20-5FF896I.pdf
- Description:
- IC FPGA 556 I/O 896FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,429
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2VP20-5FF896I from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.0–3.125 Gb/s), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in an FF896 flip-chip BGA package. It delivers embedded processing, high-speed serial interconnect, and programmable logic for telecom backplane, wireless baseband, and video processing systems.
For engineers reviewing the XC2VP20-5FF896I datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC 405 core support at 300 MHz (–5 speed grade), RocketIO transceiver compliance with Fibre Channel, Gigabit Ethernet, and XAUI, DCI-enabled I/O termination, and 1.5 V core voltage operation.
Technical Context
The XC2VP20-5FF896I implements a hardened architecture combining SRAM-based FPGA fabric with embedded processor subsystems and SERDES transceivers. Its dual PowerPC 405 cores operate at up to 300 MHz (–5 grade), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. The eight RocketIO transceivers support full-duplex operation from 600 Mb/s to 3.125 Gb/s with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.
Logic resources include 9,280 CLB slices, 290 dedicated 18×18 multipliers, 88 Block SelectRAM+ modules (18 Kb each), and twelve DCMs enabling precise clock deskew, multiplication/division, and phase shifting. I/O supports 22 single-ended and 10 differential standards-including LVDS, SSTL, HSTL-with programmable drive strength (2–24 mA) and Digitally Controlled Impedance (DCI).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 20,880 - total configurable logic capacity for complex digital logic implementation |
| PowerPC Cores | 2 × PowerPC 405 - embedded RISC processors with cache, MMU, and OCM interface |
| RocketIO Transceivers | 8 × RocketIO - full-duplex SERDES supporting 600 Mb/s to 3.125 Gb/s with 8B/10B encoding |
| User I/O Pins | 564 - configurable pins supporting LVDS, SSTL, HSTL, PCI-X, and DCI-terminated standards |
| Digital Clock Managers | 12 × DCM - fully digital clock synthesis, deskew, frequency multiplication/division, and phase shifting |
| Block RAM | 88 × 18 Kb SelectRAM+ - true dual-port memory blocks configurable from 16K×1 to 512×36 |
| Core Voltage | 1.5 V VCCINT - low-voltage operation enabling higher density and reduced power per logic cell |
| Speed Grade | –5 - specifies guaranteed timing performance including 300 MHz PowerPC operation and 3.125 Gb/s transceiver rate |
Pinout & Package
XC2VP20-5FF896I is housed in an FF896 flip-chip fine-pitch BGA package with 1.0 mm pitch, 31 mm × 31 mm body size, and 896 solder balls. This package supports high I/O count, superior thermal dissipation, and signal integrity for high-speed transceiver and processor interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during master or slave serial/SelectMAP programming |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading and initialization completion |
| M0–M2 | Mode Selection Inputs | Three-pin bus defining configuration mode (e.g., Slave Serial, Master SelectMAP, Boundary Scan) |
| PROG_B | Program Initiate Input | Active-low signal triggering device reconfiguration and clearing of configuration memory |
| TCK/TMS/TDI/TDO | JTAG Test Access Port | IEEE 1149.1-compliant boundary-scan interface for testing, debugging, and programming |
| DXP/DXN | Differential Clock Input Pair | Accepts external differential reference clock for DCMs and RocketIO CDR circuits |
| GTxP/GTxN (e.g., GT12P/GT12N) | RocketIO Transceiver Lane | Differential transmit/receive pair supporting 600 Mb/s–3.125 Gb/s serial data with integrated termination |
| PPC405_0_* PPC405_1_* | PowerPC Core Interface Signals | Dedicated buses for instruction/data access, interrupt, debug, and OCM connection for each core |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables asymmetric multiprocessing: one core for real-time control, second for protocol stack or DSP offload |
| Eight RocketIO Transceivers | Supports multi-channel backplane links (e.g., XAUI ×4, Fibre Channel ×8) without external PHYs or clock recovery ICs |
| Digitally Controlled Impedance (DCI) | Eliminates need for external series/parallel termination resistors on single-ended I/Os, reducing BOM and layout complexity |
| Twelve Digital Clock Managers (DCMs) | Provides independent clock domain management for processor, fabric, and I/O-enabling synchronous system-level timing across heterogeneous blocks |
| SelectIO-Ultra I/O Architecture | Allows mixed-voltage operation (1.5V/1.8V/2.5V/3.3V) on same device with programmable drive strength and slew rate control |
| SRAM-Based In-System Configuration | Enables field-upgradable functionality via JTAG or SelectMAP, with optional Triple-DES bitstream encryption for IP protection |
Applications
| Telecom Backplane Interface | Wireless Baseband Processing |
|---|---|
Use Scenario: High-density line card implementing 4× XAUI-to-PCI Express bridging in metro edge routers. IC Role / Device Role / Timing Role: XC2VP20-5FF896I serves as protocol-aware bridge ASIC replacement, handling 10 Gb/s aggregate serial traffic, PCIe endpoint logic, and control plane processing. Use Value: Integrates transceivers, processor, and logic in one package-reducing latency vs. discrete PHY+FPGA+CPU solutions and eliminating interposer routing. | Use Scenario: 3G Node-B baseband unit performing channel coding, modulation, and MIMO precoding before RF upconversion. IC Role / Device Role / Timing Role: XC2VP20-5FF896I executes real-time DSP kernels in FPGA fabric while PowerPC cores manage LTE/UMTS stack, scheduler, and transport layer. Use Value: 290× 18×18 multipliers and 88× 18 Kb RAM blocks enable parallel filter banks and FFT engines; dual PPC405 ensures deterministic control response. |
| Medical Imaging Data Acquisition | High-Resolution Broadcast Video Processing |
Use Scenario: PET/CT scanner front-end acquiring synchronized analog detector signals at 125 MSPS across 256 channels. IC Role / Device Role / Timing Role: XC2VP20-5FF896I performs time-of-flight correlation, histogram binning, and lossless compression using distributed RAM and CLBs, with PowerPC managing DICOM export. Use Value: 564 user I/Os support parallel ADC interfacing; DCI enables matched-impedance LVDS capture at 840 Mb/s per lane without external termination. | Use Scenario: 4K UHD video switcher ingesting four SMPTE 2082-1 (12 Gb/s) inputs and performing frame-sync, color correction, and genlock. IC Role / Device Role / Timing Role: XC2VP20-5FF896I terminates and retimes serial video streams via RocketIO, applies LUT-based 3D LUT correction in fabric, and coordinates timing with dual DCMs. Use Value: On-chip 50 Ω differential termination and CDR eliminate external retimers; 12 DCMs provide independent pixel-clock domains for each input path. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP20-6FF896I | Higher speed grade (–6): supports 350 MHz PowerPC operation and 3.125 Gb/s RocketIO at industrial temperature range | Suitable for extended-temperature industrial control or avionics where timing margin is critical | Select when design requires guaranteed 350 MHz CPU operation or tighter setup/hold margins under worst-case voltage/temperature |
| XC2VP30-5FF896I | Higher logic density (30,816 cells), same package, same speed grade, adds 4 more RocketIO transceivers (12 total) | Better suited for systems requiring additional SERDES lanes or larger fabric for protocol acceleration | Choose when migrating from XC2VP20-5FF896I to accommodate increased logic utilization or multi-protocol transceiver requirements |
Compared with XC2VP20-5FF896I, the –6 variant offers improved timing headroom for demanding clock domains, while XC2VP30-5FF896I provides scalable transceiver count and logic capacity without changing PCB footprint-enabling upgrade paths within identical thermal and mechanical constraints.
Availability
XC2VP20-5FF896I is available at Aetrix Electronics and suitable for telecom infrastructure, wireless base station, and medical imaging applications requiring stable component supply and long-term lifecycle support.
Supply support for XC2VP20-5FF896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and embedded processor platforms.
The Virtex-II Pro family was designed to unify programmable logic, embedded processing, and high-speed serial I/O in a single device for system-on-chip integration in high-performance communications and signal processing.
FAQ
What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP20-5FF896I?
The XC2VP20-5FF896I is rated for 300 MHz PowerPC 405 core operation under –5 speed grade conditions, validated across commercial temperature range (0°C to 85°C). This frequency assumes proper decoupling, 1.5 V VCCINT supply, and adherence to XAPP755 guidelines for dual-core timing closure. Higher frequencies require speed-grade upgrades like XC2VP20-6FF896I.
Does XC2VP20-5FF896I support 64B/66B encoding in its RocketIO transceivers?
No, XC2VP20-5FF896I contains standard RocketIO transceivers-not RocketIO X cores-and therefore supports only 8B/10B encoding. 64B/66B encoding is exclusive to XC2VPX20 and XC2VPX70 devices. Attempting to configure 64B/66B on XC2VP20-5FF896I will result in functional failure or undefined behavior.
Can XC2VP20-5FF896I be configured via JTAG boundary scan after power-up?
Yes, XC2VP20-5FF896I supports IEEE 1149.1-compliant boundary-scan configuration through TCK/TMS/TDI/TDO pins. It accepts configuration bitstreams in Boundary-Scan mode per IEEE 1532, enabling in-system programming and debugging without dedicated configuration pins. The DONE pin asserts upon successful JTAG configuration completion.
What I/O standards does XC2VP20-5FF896I support with on-chip termination?
XC2VP20-5FF896I supports on-chip termination for LVDS, LVDS Extended, ULVDS, and LDT differential standards, plus all single-ended standards via Digitally Controlled Impedance (DCI)-including LVCMOS (1.5V/1.8V/2.5V/3.3V), SSTL, HSTL, and PCI-X. DCI automatically calibrates termination resistance to match line impedance without external components.
Is XC2VP20-5FF896I pin-compatible with other Virtex-II Pro devices in FF896 packaging?
No, XC2VP20-5FF896I is not pin-compatible with other Virtex-II Pro devices in FF896 packages. While physical footprint and ball count match, I/O assignment, power pin distribution, and transceiver lane mapping differ across device densities. For example, XC2VP30-5FF896I allocates additional balls to extra RocketIO lanes and I/O banks, making direct substitution impossible without PCB redesign.
XC2VP20-5FF896I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 896-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2320
- Number of Logic Elements/Cells:
- 20880
- Total RAM Bits:
- 1622016
- Number of I/O:
- 556
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 896-FCBGA (31x31)
XC2VP20-5FF896I FAQ
1.How can I place an order for XC2VP20-5FF896I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP20-5FF896I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP20-5FF896I reliable?
The price and inventory of XC2VP20-5FF896I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP20-5FF896I is usually 5 days.
3.What payment methods are accepted for XC2VP20-5FF896I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP20-5FF896I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP20-5FF896I?
XC2VP20-5FF896I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP20-5FF896I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP20-5FF896I?
For technical support, including XC2VP20-5FF896I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP20-5FF896I requirements.
6.How does Aetrix verify that XC2VP20-5FF896I is sourced from the original manufacturer or authorized distributors?
All XC2VP20-5FF896I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP20-5FF896I meets industry standards.
7.What is the process for return or replacement of XC2VP20-5FF896I?
All XC2VP20-5FF896I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP20-5FF896I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP20-5FF896I part is unused and in its original packaging.
Return procedure for XC2VP20-5FF896I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2VP20-5FF896I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
