AMD XC2VP20-5FFG1152I

Overview

XC2VP20-5FFG1152I from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It targets high-bandwidth telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP20-5FFG1152I datasheet, pinout, applications, or equivalent options, key selection criteria include dual-processor support, RocketIO transceiver count and speed grade (-5 = 3.125 Gb/s), DCM count for clock domain management, I/O voltage flexibility (1.5V/2.5V/3.3V), and industrial temperature rating (–40°C to +100°C).

Technical Context

The XC2VP20-5FFG1152I implements a hardened architecture combining FPGA fabric with embedded subsystems: two independent PowerPC 405 cores each with 16 KB instruction and data caches, MMU, and OCM interface; eight RocketIO transceivers supporting 600 Mb/s to 3.125 Gb/s full-duplex operation with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination; and twelve DCMs enabling precise clock deskew, multiplication/division, and phase shifting.

Its SelectIO-Ultra I/O system supports 22 single-ended and 10 differential standards-including LVDS, SSTL, HSTL, and PCI-X-with programmable drive strength (2–24 mA) and Digitally Controlled Impedance (DCI) for automatic on-die termination. The 0.13 µm nine-layer copper process uses 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and configurable I/O supply (VCCO) rails.

Key Specifications

Pinout & Package

XC2VP20-5FFG1152I uses the FF1152 flip-chip fine-pitch BGA package: 35 mm × 35 mm body, 1.0 mm ball pitch, 1152 I/O balls arranged in 34 × 34 array with corner power/ground arrays and dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B, TCK/TMS/TDI/TDO). Pin definitions are documented in DS083 Module 4 (302 pages), with I/O banks grouped by voltage (VCCO) and function (SelectIO-Ultra, RocketIO, DCM, PowerPC JTAG).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP20-5FFG1152I, XC2VP30-5FF896I trades I/O count for higher logic density and smaller footprint, while XC2VP40-5FF1148I sacrifices RocketIO integration to maximize parallel interface capability-both retain dual PowerPC cores and -5 speed grade for consistent processor and clocking performance.

Availability

XC2VP20-5FFG1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, defense radar signal processing, and medical imaging controller designs requiring stable component supply across extended product lifecycles.

Supply support for XC2VP20-5FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and IP-based platform solutions for high-performance digital systems.

The Virtex-II Pro family was designed to integrate hard processor cores and multi-gigabit transceivers into high-density FPGAs for system-level consolidation in networking, wireless infrastructure, and embedded computing.

FAQ

What does the "-5" suffix indicate in XC2VP20-5FFG1152I?

The "-5" denotes the speed grade, specifying guaranteed timing performance: RocketIO transceivers operate up to 3.125 Gb/s, PowerPC cores run at 300 MHz (industrial grade), and FPGA fabric meets timing closure for designs targeting this grade. It is distinct from -6 (2.5 Gb/s, 250 MHz) and -7 (3.125 Gb/s, 350 MHz commercial only) grades.

Does XC2VP20-5FFG1152I support JTAG debugging for both PowerPC cores?

Yes, XC2VP20-5FFG1152I provides full JTAG access to both PowerPC 405 cores via dedicated TCK/TMS/TDI/TDO pins and additional DXP/DXN trace ports. ChipScope Pro software enables real-time instruction trace, breakpoint setting, and register inspection for each core independently.

Can XC2VP20-5FFG1152I be configured via SPI flash memory?

No, XC2VP20-5FFG1152I does not support native SPI flash configuration. It requires configuration through slave-serial, master-serial, or SelectMAP modes using parallel NOR flash or microcontroller-driven parallel interface. System ACE CompactFlash is an alternative supported method.

Is the XC2VP20-5FFG1152I RoHS compliant?

Yes, XC2VP20-5FFG1152I is manufactured in Pb-free (RoHS-compliant) packaging. Xilinx confirms compliance for FF1152 flip-chip packages per JEDEC J-STD-609, with lead-free solder spheres and compatible assembly processes.

What is the maximum operating frequency of the Digital Clock Managers in XC2VP20-5FFG1152I?

The twelve DCMs in XC2VP20-5FFG1152I support input frequencies up to 200 MHz and generate output frequencies up to 400 MHz, with fine-grained phase shifting in 1/256-clock-period increments. Their performance is fully characterized for the -5 speed grade across the industrial temperature range.