AMD XC2VP20-5FG676I

Overview

XC2VP20-5FG676I from Xilinx is a Virtex-II Pro platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond FG676 package), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in a 676-pin Fine-Pitch BGA (FG676) package. It targets high-performance telecom, networking, and video processing systems requiring integrated processing, high-speed serial I/O, and programmable logic.

For engineers reviewing the XC2VP20-5FG676I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, transceiver timing limits, DCM phase-shift resolution, I/O standard support (LVDS, SSTL, HSTL, PCI-X), and validated alternative FPGAs for legacy system sustainment and migration planning.

Technical Context

The XC2VP20-5FG676I implements a dual-processor SoC-FPGA architecture with two independent PowerPC 405 cores running up to 300 MHz (–5 speed grade), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. Its eight RocketIO transceivers operate at 2.5 Gb/s in the FG676 wire-bond package and support 8B/10B encoding, channel bonding (2–20 channels), and programmable pre-emphasis.

Fabric resources include 9,280 CLB slices, 290 dedicated 18×18 multipliers, 88 Block SelectRAM+ modules (18 Kb each), and twelve DCMs offering ±1/256-cycle fine-grained phase shifting, integer/fractional frequency synthesis, and deskew compensation. I/O subsystem supports 22 single-ended and 10 differential standards with Digitally Controlled Impedance (DCI) termination.

Key Specifications

Pinout & Package

XC2VP20-5FG676I uses a 676-ball Fine-Pitch Ball Grid Array (FG676) package with 1.0 mm pitch, wire-bond interconnect, and industrial temperature range (–40°C to +100°C). Pin definitions are documented across 302 pages in DS083 Module 4, covering ball assignments, voltage domains (VCCINT = 1.5 V, VCCAUX = 2.5 V, VCCO = 1.5/1.8/2.5/3.3 V), and I/O bank groupings.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based SoC applications.

Compared with XC2VP20-5FG676I, XC2VP30-5FF672I provides scalable logic capacity in a thermally superior package but requires PCB redesign, while XC2VP7-5FF896I offers a lower-cost entry point with identical transceiver capabilities and higher I/O count-ideal for consolidating control and I/O functions without dual-processor overhead.

Availability

XC2VP20-5FG676I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control gateways, and broadcast video equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP20-5FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic and SoC-FPGA architectures, delivering high-performance, radiation-tolerant, and secure programmable devices for aerospace, defense, and communications markets since 1984.

The Virtex-II Pro family was designed to integrate hardened processor subsystems and multi-gigabit transceivers into high-density FPGA fabric, enabling complete system-on-chip implementations for bandwidth-intensive, real-time embedded applications.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP20-5FG676I?

The XC2VP20-5FG676I supports RocketIO transceivers operating up to 2.5 Gb/s in the FG676 wire-bond package, as confirmed in DS083 Table 4 for –5 speed grade devices. This limit applies to all eight transceiver channels and is constrained by package parasitics-not silicon capability-so higher speeds require flip-chip packages like FF672 or FF896.

Does XC2VP20-5FG676I support IEEE 1149.1 boundary-scan?

Yes, XC2VP20-5FG676I fully complies with IEEE 1149.1 (JTAG) and supports BYPASS, SAMPLE, PRELOAD, IDCODE, EXTEST, INTEST, and HIGHZ instructions. The TAP controller enables in-system programming, logic verification, and interconnect testing without requiring external test fixtures.

Can XC2VP20-5FG676I be configured via JTAG only, or are other methods required?

XC2VP20-5FG676I supports multiple configuration modes including JTAG (IEEE 1532), slave-serial, master-serial, and slave/master SelectMAP. JTAG alone is sufficient for programming and debugging, but production systems often combine it with SPI Flash or microcontroller-initiated SelectMAP for autonomous startup.

What I/O standards does XC2VP20-5FG676I support with on-chip termination?

XC2VP20-5FG676I supports Digitally Controlled Impedance (DCI) for single-ended standards including LVCMOS (1.5 V/1.8 V/2.5 V/3.3 V), SSTL-2, and HSTL Class I–IV. For differential standards, on-chip 50 Ω termination is available for LVDS, BLVDS, ULVDS, and LDT-eliminating external resistors and improving signal integrity.

Is XC2VP20-5FG676I recommended for new designs?

No-XC2VP20-5FG676I is marked "Product Not Recommended For New Designs" per DS083 v5.0 (June 2011). It remains available for legacy system repair, obsolescence mitigation, and long-life industrial deployments, but Xilinx recommends Virtex-5 or newer families for new development due to process, power, and toolchain advantages.