AMD XC2VP20-5FGG676C

Overview

XC2VP20-5FGG676C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond packages), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in a 676-pin Fine-Pitch BGA (FGG676) package. It targets high-performance telecom backplane interfaces, embedded networking systems, and DSP-accelerated video processing where on-chip processing, serial interconnect, and reconfigurable logic coexist.

For engineers reviewing the XC2VP20-5FGG676C datasheet, pinout, applications, or equivalent options, key selection considerations include its -5 speed grade timing (300 MHz PowerPC, 2.5 Gb/s RocketIO), FGG676 wire-bond BGA mechanical compatibility, dual-processor support for asymmetric multiprocessing, and absence of RocketIO X transceivers (unlike XC2VPX20).

Technical Context

The XC2VP20-5FGG676C implements a hardened dual-PowerPC 405 subsystem with 16 KB instruction and 16 KB data caches, MMU, and OCM interface, coupled to a 0.13 µm SRAM-based FPGA fabric. Its eight RocketIO transceivers operate at up to 2.5 Gb/s per channel in this wire-bond package variant and support 8B/10B encoding, channel bonding, and programmable pre-emphasis.

Logic resources include 9,280 CLB slices, 290 dedicated 18×18 multipliers, 88 Block SelectRAM+ modules (18 Kb each), and twelve DCMs enabling precise clock deskew, multiplication/division, and fine-grained phase shifting. I/O supports 22 single-ended and 10 differential standards with Digitally Controlled Impedance (DCI) termination.

Key Specifications

Pinout & Package

XC2VP20-5FGG676C uses a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.0 mm pitch, wire-bond interconnect, and Pb-free construction. The package supports 564 user I/Os plus dedicated configuration, clock, JTAG, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA with embedded processor applications.

Compared with XC2VP20-5FGG676C, XC2VP30-5FGG676C offers 47% more logic and I/O for scalable system upgrades without PCB redesign, while XC2VP20-6FGG676C provides verified timing headroom for critical paths-neither is pin-compatible with RocketIO X or flip-chip variants.

Availability

XC2VP20-5FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging equipment, and defense electronics requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP20-5FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-end programmable logic platforms for demanding system-level integration.

The Virtex-II Pro product line was engineered to unify hard processor subsystems, high-speed serial I/O, and flexible logic in a single die-targeting applications where ASIC-level performance meets FPGA-level adaptability.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP20-5FGG676C?

The XC2VP20-5FGG676C PowerPC 405 cores are rated for 300 MHz operation at the -5 speed grade under commercial temperature conditions. This frequency is guaranteed by timing analysis and electrical testing per DS083 v5.0 specifications. The XC2VP20-5FGG676C achieves this with 1.5 V VCCINT and proper thermal management; exceeding 300 MHz requires use of the -6 or -7 speed grades.

Does XC2VP20-5FGG676C support RocketIO X transceivers?

No, XC2VP20-5FGG676C contains standard RocketIO transceivers supporting up to 2.5 Gb/s, not RocketIO X. RocketIO X (6.25 Gb/s) is exclusive to XC2VPX20 and XC2VPX70 devices. The XC2VP20-5FGG676C datasheet explicitly lists "RocketIO" - not "RocketIO X" - in Table 1 and Module 2, confirming its 2.5 Gb/s capability in the FGG676 package.

What I/O standards are supported by XC2VP20-5FGG676C with DCI enabled?

With Digitally Controlled Impedance (DCI) active, XC2VP20-5FGG676C supports on-die series or parallel termination for LVCMOS (1.5V/1.8V/2.5V/3.3V), SSTL (1.8V/2.5V), and HSTL (1.5V/1.8V) single-ended standards. DCI does not apply to differential I/Os like LVDS, which use separate on-chip differential termination. This capability eliminates external termination resistors for compliant trace impedances.

How many Block SelectRAM+ modules does XC2VP20-5FGG676C contain?

XC2VP20-5FGG676C contains 88 Block SelectRAM+ modules, each providing 18 Kb of true dual-port RAM. These blocks are configurable from 16K×1 to 512×36 and support three read-during-write modes. Total embedded block RAM capacity is 1,584 Kb (88 × 18 Kb), as confirmed in Table 1 of DS083 v5.0 and used for frame buffers, FIFOs, or lookup tables in XC2VP20-5FGG676C designs.

Is XC2VP20-5FGG676C compatible with the FGG676 package footprint of XC2VP30-5FGG676C?

Yes, XC2VP20-5FGG676C and XC2VP30-5FGG676C share identical FGG676 package dimensions, ball pitch (1.0 mm), and pinout - they are footprint-compatible. However, not all pins are functionally equivalent: XC2VP30-5FGG676C exposes additional I/Os and logic resources, so direct substitution requires verification of signal mapping and timing constraints in the target design using XC2VP20-5FGG676C.