AMD XC2VP20-5FGG676I

Overview

XC2VP20-5FGG676I from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond packages), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in a 676-pin Fine-Pitch BGA (FGG676) package. It targets high-bandwidth embedded systems requiring on-chip processing, serial interconnect, and reconfigurable logic - such as telecom line cards and video processing subsystems.

For engineers reviewing the XC2VP20-5FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual PowerPC 405 core support, 2.5 Gb/s RocketIO transceiver performance in FGG676 packaging, -5 speed grade timing compliance, industrial temperature rating (–40°C to +100°C), and compatibility with Xilinx ISE 14.7 and earlier toolchains.

Technical Context

The XC2VP20-5FGG676I implements a hardened architecture combining SRAM-based FPGA fabric with embedded processor subsystems and serial transceivers. Its two PowerPC 405 cores operate up to 300 MHz at -5 speed grade, each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. The eight RocketIO transceivers are full-duplex SERDES supporting 600 Mb/s to 2.5 Gb/s per channel in wire-bond packages like FGG676.

Digital Clock Manager (DCM) modules provide precise clock deskew, integer/fractional frequency synthesis, and fine-grained phase shifting (1/256 period resolution). SelectIO-Ultra I/O supports 22 single-ended and 10 differential standards including LVDS, SSTL, HSTL, and PCI-X, with Digitally Controlled Impedance (DCI) for on-die termination.

Key Specifications

Pinout & Package

XC2VP20-5FGG676I uses a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.0 mm pitch, wire-bond construction, and Pb-free finish. Pin definitions follow Xilinx DS083 Module 4, covering configuration, JTAG, power, ground, I/O banks, dedicated clock inputs, DCM feedback, RocketIO transceiver pairs (TXP/TXN/RXP/RXN), and PowerPC debug signals (JTAG, BDM).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP20-5FGG676I, XC2VP30-5FGG676I offers scalable logic capacity without changing package or transceiver performance, while XC2VP20-5FF896I trades footprint and thermal profile for higher I/O count and CPU frequency - neither is drop-in replaceable due to pinout and thermal constraints.

Availability

XC2VP20-5FGG676I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, defense electronics, and broadcast video equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2VP20-5FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA technology and developed industry-standard tools and IP ecosystems.

The Virtex-II Pro family was designed to integrate hard processor subsystems and high-speed serial transceivers into reconfigurable logic - targeting system-on-chip consolidation in networking, wireless infrastructure, and high-performance computing.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP20-5FGG676I?

The XC2VP20-5FGG676I supports PowerPC 405 core operation up to 300 MHz under industrial temperature conditions (–40°C to +100°C) at the -5 speed grade. This frequency is guaranteed by timing analysis in Xilinx ISE 14.7 and verified through factory testing per DS083 specifications. Higher frequencies require derating or use of faster speed grades like -6 or -7, which are not offered in industrial temperature variants for this device.

Does XC2VP20-5FGG676I support 8B/10B encoding in its RocketIO transceivers?

Yes, XC2VP20-5FGG676I includes RocketIO transceivers with integrated 8B/10B encoder and decoder blocks per channel, as documented in DS083 Module 2. This enables native compliance with Gigabit Ethernet, Fibre Channel, and other standards requiring link-level encoding. The encoding is configurable per transceiver channel and can be bypassed for custom protocols.

What configuration modes are supported by XC2VP20-5FGG676I?

XC2VP20-5FGG676I supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. These are selected via M0–M2 pins at power-up. Master Serial mode uses internal oscillator to drive CCLK; SelectMAP allows high-speed parallel loading via microprocessor bus; Boundary-Scan enables in-system programming and verification.

Is XC2VP20-5FGG676I pin-compatible with other Virtex-II Pro devices in the FGG676 package?

No, XC2VP20-5FGG676I is not pin-compatible with other Virtex-II Pro devices in the FGG676 package. While all share the same 676-ball footprint, ball functions differ across densities (e.g., XC2VP4, XC2VP7, XC2VP30) due to varying I/O bank allocations, RocketIO placement, and power/ground pin assignments. Pin mapping must be verified against DS083 Module 4 for each specific device.

What is the role of Digitally Controlled Impedance (DCI) in XC2VP20-5FGG676I I/Os?

Digitally Controlled Impedance (DCI) in XC2VP20-5FGG676I automatically calibrates series or parallel on-die termination to match transmission line impedance (typically 50 Ω or 75 Ω) using an external 50 Ω reference resistor. This eliminates discrete termination components, improves signal integrity for high-speed interfaces like DDR and LVDS, and adapts dynamically to voltage/temperature drift - all controlled via configuration bitstream settings.