AMD XC2VP20-6FF1152C

Overview

XC2VP20-6FF1152C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in an FF1152 flip-chip BGA package. It delivers embedded processing, high-speed serial connectivity, and programmable logic for telecom backplane interfaces, network packet processors, and video-over-IP systems.

For engineers reviewing the XC2VP20-6FF1152C datasheet, pinout, applications, or equivalent options, key selection criteria include dual-processor support, 3.125 Gb/s transceiver performance at -6 speed grade, DCM-based clock deskew and phase shifting, and compatibility with SelectIO-Ultra I/O standards including LVDS, SSTL, and HSTL.

Technical Context

The XC2VP20-6FF1152C implements a hardened architecture combining SRAM-based FPGA fabric with two embedded PowerPC 405 cores operating up to 350 MHz (at -6 grade), eight RocketIO transceivers supporting 600 Mb/s to 3.125 Gb/s per channel, and twelve DCMs enabling precise clock de-skew, integer/fractional frequency synthesis, and ±1/256-cycle phase adjustment.

Its IOBs support 22 single-ended and 10 differential I/O standards-including programmable LVCMOS drive strength (2–24 mA), on-chip digitally controlled impedance (DCI), and on-die LVDS termination-while the routing hierarchy uses Active Interconnect Technology with predictable delay independent of fanout and deep sub-micron noise immunity.

Key Specifications

Pinout & Package

XC2VP20-6FF1152C is housed in a 1152-ball flip-chip fine-pitch BGA (FF1152) with 1.0 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction optimized for high I/O count and power dissipation. Pin definitions are documented across 302 pages in DS083 Module 4, covering dedicated configuration, JTAG, clock, PowerPC debug, RocketIO differential pairs, and SelectIO-Ultra bank-specific voltage domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP20-6FF1152C, the -5 variant trades transceiver speed and CPU frequency for lower power and cost, while the XC2VP30-6FF1152C extends logic capacity and I/O count without altering transceiver or processor specifications-making both viable alternatives depending on whether performance headroom or resource scalability is the primary constraint.

Availability

XC2VP20-6FF1152C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, broadcast video, and defense electronics requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP20-6FF1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms targeting high-performance computing, networking, and embedded systems.

The Virtex-II Pro family was engineered to integrate hard processor subsystems and multi-gigabit transceivers into high-density SRAM-based FPGAs-enabling complete system-on-chip solutions for wireline communications, video processing, and real-time signal analysis without discrete ASICs or ASSPs.

FAQ

What is the maximum RocketIO transceiver data rate supported by XC2VP20-6FF1152C?

The XC2VP20-6FF1152C supports RocketIO transceivers operating at up to 3.125 Gb/s in full-duplex mode at the -6 speed grade. This rate complies with Gigabit Ethernet, Fibre Channel, and XAUI standards. The transceiver architecture includes monolithic clock recovery, 8B/10B encoding, and programmable pre-emphasis-enabling robust operation over FR4 backplanes without external CDR components. XC2VP20-6FF1152C does not include RocketIO X cores, which are exclusive to XC2VPX20/XC2VPX70 variants.

Does XC2VP20-6FF1152C include embedded processor cores, and what are their capabilities?

Yes, XC2VP20-6FF1152C integrates two embedded PowerPC 405 RISC processor blocks. Each core runs at up to 350 MHz (at -6 grade), features 16 KB instruction and 16 KB data caches, a memory management unit (MMU) with 64-entry TLB, hardware multiply/divide, and CoreConnect bus interface. These cores enable tightly coupled software-defined functionality alongside FPGA logic-such as protocol stack execution, real-time control, or system management-without requiring external microprocessors. XC2VP20-6FF1152C supports symmetric or asymmetric multiprocessing configurations.

What I/O standards and termination options are supported by XC2VP20-6FF1152C?

XC2VP20-6FF1152C supports 22 single-ended (e.g., LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI, HSTL, SSTL) and 10 differential (e.g., LVDS, BLVDS, ULVDS, LVPECL) I/O standards via its SelectIO-Ultra technology. Each I/O bank includes Digitally Controlled Impedance (DCI) circuitry for automatic on-die termination matching to transmission line impedance, eliminating external resistors. Programmable drive strength (2–24 mA) and slew rate control further optimize signal integrity for point-to-point or multidrop topologies.

How many Digital Clock Managers (DCMs) does XC2VP20-6FF1152C contain, and what functions do they provide?

XC2VP20-6FF1152C contains twelve Digital Clock Managers (DCMs). Each DCM provides fully digital, self-calibrating clock management including precise input-to-output de-skew (<±50 ps), integer/fractional frequency synthesis (e.g., 2×, 3.5×), coarse (90°/180°/270°) and fine-grained (1/256 cycle) phase shifting, and duty-cycle correction. These capabilities enable robust clock domain crossing, source-synchronous interface timing (e.g., DDR2), and jitter reduction in high-speed serial links-critical for deterministic system-level timing in XC2VP20-6FF1152C-based designs.

Is XC2VP20-6FF1152C suitable for new designs, and what is its lifecycle status?

No-XC2VP20-6FF1152C is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). While still available through authorized distributors and Aetrix Electronics for legacy system support and repair, it is superseded by Virtex-4, Virtex-5, and UltraScale families. Customers initiating new projects should evaluate AMD/Xilinx Kintex or Versal ACAP platforms for enhanced performance, power efficiency, and long-term supply assurance. XC2VP20-6FF1152C remains viable for sustaining engineering, obsolescence mitigation, and field repair of deployed systems.