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AMD XC2VP20-6FF1152I
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- Part No.:
- XC2VP20-6FF1152I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC2VP20-6FF1152I.pdf
- Description:
- IC FPGA 564 I/O 1152FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,537
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Product details
Overview
XC2VP20-6FF1152I from Xilinx is a high-density, radiation-tolerant (industrial-grade) platform FPGA integrating two PowerPC 405 RISC processor cores, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in an FF1152 flip-chip BGA package. It targets telecom backplane interfaces, embedded networking control planes, and high-throughput DSP subsystems requiring integrated processing and serial connectivity.
For engineers reviewing the XC2VP20-6FF1152I datasheet, pinout, applications, or equivalent options, key selection criteria include dual-processor coherency support, 3.125 Gb/s transceiver compliance with XAUI/Fibre Channel, DCM-based clock deskew for synchronous I/O, and industrial temperature operation (–40°C to +100°C).
Technical Context
The XC2VP20-6FF1152I implements a hardened Virtex-II Pro architecture with dual PowerPC 405 cores operating up to 350 MHz (–6 speed grade), each featuring 16 KB instruction and 16 KB data caches, MMU, and CoreConnect bus interface. Its eight RocketIO transceivers support full-duplex 3.125 Gb/s operation with 8B/10B encoding, on-chip 50 Ω termination, and per-channel loopback modes.
Logic fabric includes 9,280 CLB slices, 290 dedicated 18×18 multipliers, 88 Block SelectRAM+ modules (18 Kb each), and hierarchical Active Interconnect routing with 24 long lines per row/column. Clocking uses twelve DCMs for phase shifting (1/256 period resolution), frequency synthesis, and deskew across 16 global clock nets.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 20,880 - supports complex embedded control + signal processing logic in single device |
| PowerPC Cores | 2 × 350 MHz - enables symmetric multiprocessing or asymmetric host/peripheral partitioning |
| RocketIO Transceivers | 8 × 3.125 Gb/s - provides XAUI-compliant 10 GbE backplane links without external PHYs |
| User I/O Pads | 564 - accommodates wide parallel buses (e.g., DDR2 SDRAM, PCI-X) and multiple differential standards |
| Digital Clock Managers | 12 × DCM - delivers precise clock deskew, jitter reduction, and fractional frequency synthesis for mixed-clock domains |
| Block RAM | 88 × 18 Kb - supplies 1,584 KB true dual-port memory for packet buffering and coefficient storage |
| Multipliers | 290 × 18×18 - accelerates FIR filtering, FFT twiddle factor computation, and matrix operations |
| Operating Temperature | –40°C to +100°C - qualified for industrial and extended-temperature embedded systems |
Pinout & Package
XC2VP20-6FF1152I is housed in a 1152-ball flip-chip fine-pitch BGA (FF1152) with 1.0 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction optimized for high-power density and signal integrity. Pin definitions are documented across 302 pages of Module 4 (Pinout Information) in DS083 v5.0, covering all FF1152 ball assignments including I/O banks, power/ground, configuration, JTAG, and transceiver-specific pins (RXN/RXP, TXN/TXP, REFCLK).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master serial mode; must be clean, low-jitter source |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading; used for system reset synchronization |
| M0–M2 | Mode Selection Inputs | Set configuration mode (e.g., slave serial, master SelectMAP); latched at PROG_B deassertion |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Support IEEE 1149.1 test access; enables in-system programming and debug visibility |
| RXN/RXP | Differential Receiver Input Pair | Accepts AC-coupled LVDS signals up to 3.125 Gb/s; internally terminated to 50 Ω |
| TXN/TXP | Differential Transmitter Output Pair | Drives 200–1600 mVpp differential swing; supports pre-emphasis for channel loss compensation |
| VCCINT | Core Power Supply | 1.5 V ±3% supply for logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power Supply | 2.5 V ±3% supply for DCMs, SelectIO, and configuration circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables real-time OS partitioning: one core for protocol stack, second for application layer or safety monitoring |
| RocketIO Transceivers | Eliminates external SERDES and clock recovery ICs, reducing BOM count and board area in 10G backplanes |
| Digitally Controlled Impedance (DCI) | Automatically matches output impedance to transmission line (e.g., 50 Ω or 75 Ω), removing need for external series resistors |
| SelectIO-Ultra I/O | Supports simultaneous LVDS, SSTL-2, HSTL, and PCI-X signaling on adjacent banks-critical for heterogeneous memory interfacing |
| Twelve DCMs | Allows independent clock domain management for processor, transceivers, and fabric logic-essential for timing closure in multi-clock designs |
| Triple-DES Bitstream Encryption | Prevents IP theft by securing configuration bitstream against readback or cloning attacks |
Applications
| Telecom Line Card Control | Industrial Ethernet Switch Fabric |
|---|---|
Use Scenario: Managing 16-port Gigabit Ethernet line cards with embedded traffic shaping and OAM processing. IC Role / Device Role / Timing Role: XC2VP20-6FF1152I serves as the central control plane processor and packet classifier, using its PowerPC cores for TCP/IP stack execution and RocketIO transceivers for inter-card XAUI links. Use Value: Integrates control CPU, SERDES, and switching logic in one device-reducing latency between MAC and control logic and eliminating discrete PHYs. | Use Scenario: Implementing deterministic time-sensitive networking (TSN) bridges in factory automation systems. IC Role / Device Role / Timing Role: XC2VP20-6FF1152I acts as the TSN scheduler and frame pre-processor, leveraging DCMs for sub-ns clock alignment across ports and Block RAM for time-aware buffer management. Use Value: Achieves <1 µs port-to-port latency variation via hardware-synchronized clocks and on-chip memory-meeting IEC/IEEE 60802 requirements. |
| Medical Imaging Data Acquisition | Avionics Sensor Fusion Hub |
Use Scenario: Aggregating high-speed ADC streams (e.g., 16× 125 MSPS) from ultrasound front-ends into coherent beamformed data. IC Role / Device Role / Timing Role: XC2VP20-6FF1152I performs real-time digital down-conversion and channel calibration using dedicated multipliers and distributed RAM, while PowerPC handles DICOM export. Use Value: 290 multipliers enable parallel FIR filtering across all channels; industrial temp rating ensures reliability in MRI cabinet environments. | Use Scenario: Fusing inertial measurement unit (IMU), GPS, and radar inputs in airborne mission computers under EMI-heavy conditions. IC Role / Device Role / Timing Role: XC2VP20-6FF1152I functions as the deterministic sensor hub, using RocketIO for high-integrity MIL-STD-1553B-over-fiber links and DCI for stable LVDS ADC interfacing. Use Value: On-chip 50 Ω termination and radiation-hardened design meet DO-254 DAL-A requirements for flight-critical data aggregation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP20-5FF1152I | Lower speed grade (300 MHz PowerPC, 2.0 Gb/s RocketIO) and reduced DCM performance | Suitable for cost-sensitive industrial controllers where 350 MHz processing or 3.125 Gb/s links are unnecessary | Select when thermal budget or bill-of-materials cost outweighs peak bandwidth needs |
| XC2VP30-6FF1152I | Higher logic density (30,816 cells), more I/O (644), and identical transceiver/processor specs | Required for designs needing larger embedded software footprint or additional peripheral interfaces (e.g., dual PCI-X buses) | Choose when XC2VP20-6FF1152I resource utilization exceeds 85% in place-and-route |
Compared with XC2VP20-6FF1152I, the -5 variant trades speed for lower power and cost in thermally constrained settings, while the XC2VP30-6FF1152I extends scalability for future-proofed designs-neither offers pin-compatible replacement without layout revision due to differing I/O bank allocations and power pin counts.
Availability
XC2VP20-6FF1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XC2VP20-6FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex-II Pro family-including XC2VP20-6FF1152I-was engineered for high-performance embedded systems demanding integrated processing, high-speed serial I/O, and reconfigurable logic in a single die.
FAQ
What is the maximum operating frequency of the PowerPC 405 cores in XC2VP20-6FF1152I?
The XC2VP20-6FF1152I supports PowerPC 405 cores running at up to 350 MHz under industrial temperature conditions (–40°C to +100°C) and –6 speed grade. This frequency assumes proper PCB layout, power delivery, and thermal management per XAPP755 guidelines for dual-core timing closure. The XC2VP20-6FF1152I datasheet specifies this limit in Table 4 of DS083 v5.0.
Does XC2VP20-6FF1152I support JTAG boundary-scan testing?
Yes, XC2VP20-6FF1152I fully complies with IEEE 1149.1 and supports boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. It implements BYPASS, SAMPLE, PRELOAD, EXTEST, INTEST, and HIGHZ instructions, enabling board-level interconnect verification and in-system programming. The XC2VP20-6FF1152I also supports IEEE 1532 for configuration data loading through JTAG.
Can XC2VP20-6FF1152I be configured using Master SelectMAP mode?
Yes, XC2VP20-6FF1152I supports Master SelectMAP configuration mode, allowing it to drive an external PROM or flash memory and autonomously load its bitstream at power-up. This mode uses CCLK as output and configures M[2:0] pins to select the 8-bit-wide parallel interface. The XC2VP20-6FF1152I documentation confirms this capability in the Configuration section of DS083 v5.0.
What I/O standards are supported by XC2VP20-6FF1152I's SelectIO-Ultra blocks?
XC2VP20-6FF1152I supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Its XCITE Digitally Controlled Impedance feature automatically calibrates output impedance to match transmission lines, eliminating external termination resistors for most standards.
Is XC2VP20-6FF1152I suitable for new designs?
No-XC2VP20-6FF1152I is marked "Product Not Recommended For New Designs" in Xilinx DS083 v5.0. While fully functional and supported for existing production, Xilinx recommends Virtex-5 or newer families for new projects due to superior performance, lower power, and ongoing toolchain support. Aetrix Electronics maintains inventory and lifecycle coordination for legacy XC2VP20-6FF1152I deployments.
XC2VP20-6FF1152I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2320
- Number of Logic Elements/Cells:
- 20880
- Total RAM Bits:
- 1622016
- Number of I/O:
- 564
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC2VP20-6FF1152I FAQ
1.How can I place an order for XC2VP20-6FF1152I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP20-6FF1152I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP20-6FF1152I reliable?
The price and inventory of XC2VP20-6FF1152I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP20-6FF1152I is usually 5 days.
3.What payment methods are accepted for XC2VP20-6FF1152I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP20-6FF1152I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP20-6FF1152I?
XC2VP20-6FF1152I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP20-6FF1152I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP20-6FF1152I?
For technical support, including XC2VP20-6FF1152I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP20-6FF1152I requirements.
6.How does Aetrix verify that XC2VP20-6FF1152I is sourced from the original manufacturer or authorized distributors?
All XC2VP20-6FF1152I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP20-6FF1152I meets industry standards.
7.What is the process for return or replacement of XC2VP20-6FF1152I?
All XC2VP20-6FF1152I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP20-6FF1152I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP20-6FF1152I part is unused and in its original packaging.
Return procedure for XC2VP20-6FF1152I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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