AMD XC2VP20-6FF896C

Overview

XC2VP20-6FF896C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in an FF896 flip-chip BGA package. It delivers embedded processing, high-speed serial connectivity, and programmable logic for telecom backplane interfaces, network packet processors, and video-over-IP systems.

For engineers reviewing the XC2VP20-6FF896C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC 405 core support at 350 MHz, RocketIO transceiver compliance with Gigabit Ethernet and Fibre Channel, DCM-based clock deskew and phase shifting, and SelectIO-Ultra I/O with DCI termination - all validated for industrial-grade operation under -6 speed grade.

Technical Context

The XC2VP20-6FF896C implements a hybrid architecture combining hard IP (dual PowerPC 405 cores, eight RocketIO transceivers) with configurable FPGA fabric (CLBs, Block SelectRAM+, 18×18 multipliers). Its RocketIO transceivers operate at up to 3.125 Gb/s with 8B/10B encoding, on-chip 50Ω/75Ω termination, and channel bonding support for multi-lane protocols.

Each PowerPC 405 block includes 16 KB instruction and 16 KB data caches, MMU with 64-entry TLB, and OCM interface; both cores run concurrently at 350 MHz in -6 speed grade. The FPGA fabric uses 0.13 µm nine-layer copper process, 1.5 V core supply (VCCINT), and supports partial reconfiguration and bitstream encryption via Triple DES.

Key Specifications

Pinout & Package

XC2VP20-6FF896C is housed in a 31 mm × 31 mm FF896 flip-chip fine-pitch BGA package with 1.00 mm ball pitch, optimized for thermal performance and high I/O count. Pin definitions are documented across 302 pages in DS083 Module 4, covering dedicated configuration, JTAG, clock, PowerPC, RocketIO, and SelectIO-Ultra signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP20-6FF896C, XC2VP30-6FF896C offers 47% more logic for complex packet classification, while XC2VPX20-6FF896C replaces fixed-rate RocketIO with variable-rate RocketIO X - enabling protocol flexibility at the cost of 2% fewer I/Os and no backward compatibility with legacy 3.125 Gb/s-only designs.

Availability

XC2VP20-6FF896C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial vision systems, and broadcast video equipment requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP20-6FF896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered the FPGA architecture and introduced integrated processor+FPGA platforms.

The Virtex-II Pro family was designed to unify embedded processing, high-speed serial I/O, and flexible logic in a single device for bandwidth-constrained, latency-sensitive systems such as networking switches and baseband processors.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP20-6FF896C?

The XC2VP20-6FF896C supports dual PowerPC 405 cores running at 350 MHz under -6 speed grade and commercial temperature range. This frequency is guaranteed per DS083 Table 4 and applies when both cores are active and configured with default cache settings and OCM interfaces. Operation above 350 MHz requires adherence to XAPP755 guidelines for clock macro implementation.

Does XC2VP20-6FF896C support partial reconfiguration?

Yes, XC2VP20-6FF896C supports partial reconfiguration as specified in DS083 Module 1. This capability allows dynamic swapping of logic modules in runtime without resetting the entire device or halting PowerPC execution. Configuration is performed via Slave SelectMAP mode using dedicated configuration ports, and verified through readback of targeted CLB frames.

What I/O standards are supported by XC2VP20-6FF896C's SelectIO-Ultra blocks?

XC2VP20-6FF896C supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI-X, GTL) and 10 differential standards (LVDS, BLVDS, LVPECL, ULVDS, LDT). Each I/O bank has independent VCCO and programmable drive strength (2–24 mA), with Digitally Controlled Impedance (DCI) enabling on-die termination matching for all supported single-ended standards.

Can XC2VP20-6FF896C achieve 3.125 Gb/s transceiver operation in industrial temperature range?

Yes, XC2VP20-6FF896C achieves 3.125 Gb/s RocketIO transceiver operation across the full industrial temperature range (–40°C to +85°C) when rated at -6 speed grade. DS083 Table 4 confirms this performance level for flip-chip packages, and electrical validation includes jitter tolerance, BER <10⁻¹², and eye diagram compliance per Fibre Channel FC-PI-3 specification.

Is bitstream encryption supported on XC2VP20-6FF896C, and how is it implemented?

Yes, XC2VP20-6FF896C supports Triple DES bitstream encryption using on-chip decryptor hardware. Encryption keys are stored in non-volatile memory during programming; the device automatically decrypts configuration data during startup. This feature protects design IP from reverse engineering and unauthorized duplication, and is enabled via Xilinx ISE toolchain with secure key generation and loading workflow.