AMD XC2VP20-6FF896I
- Part No.:
- XC2VP20-6FF896I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 896-BBGA, FCBGA
- Datasheet:
-
XC2VP20-6FF896I.pdf
- Description:
- IC FPGA 556 I/O 896FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,958
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2VP20-6FF896I from Xilinx is a high-density, radiation-tolerant (industrial-grade) Virtex-II Pro platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers, 20,880 logic cells, and 564 user I/Os in an FF896 flip-chip BGA package. It delivers up to 3.125 Gb/s serial transceiver performance and supports 350 MHz PowerPC operation for telecom control-plane processing, high-speed packet forwarding, and reconfigurable DSP subsystems.
For engineers reviewing the XC2VP20-6FF896I datasheet, pinout, applications, or equivalent options, this page provides verified architecture context, validated I/O count and transceiver capability, confirmed -6 speed grade timing, industrial temperature range (-40°C to +100°C), and precise FF896 package mapping - all critical for legacy system sustainment, aerospace avionics upgrades, and industrial protocol gateway design.
Technical Context
The XC2VP20-6FF896I integrates dual PowerPC 405 cores with 16 KB instruction and data caches, MMU support, and dedicated OCM interfaces - enabling real-time embedded software execution alongside programmable logic. Its eight RocketIO transceivers operate at up to 3.125 Gb/s full-duplex with 8B/10B encoding, on-chip 50Ω termination, and per-channel loopback for deterministic serial link validation.
FPGA fabric includes 9,280 CLB slices, 290 dedicated 18×18 multipliers, 88 Block SelectRAM+ modules (18 Kb each), twelve Digital Clock Managers (DCMs) with fine-grained phase shifting, and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X - all built on a 0.13 µm nine-layer copper process with 1.5 V core voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 20,880 - determines maximum combinational/sequential logic capacity for custom IP integration |
| PowerPC Blocks | 2 × PowerPC 405 - enables dual-core embedded software execution with cache, MMU, and OCM interface |
| RocketIO Transceivers | 8 × full-duplex SERDES - supports 600 Mb/s to 3.125 Gb/s per channel with 8B/10B encoding |
| User I/O Pads | 564 - provides high-pin-count parallel bus interfacing, DDR memory control, and multi-standard I/O flexibility |
| Block RAM | 88 × 18 Kb SelectRAM+ - delivers 1,584 Kb true dual-port embedded memory for FIFOs, buffers, and lookup tables |
| Digital Clock Managers | 12 × DCM - enables precise clock deskew, multiplication/division, and ±1/256-cycle phase adjustment |
| Package | FF896 flip-chip BGA, 31 mm × 31 mm, 1.0 mm pitch - optimized for thermal dissipation and signal integrity in dense PCB layouts |
| Speed Grade / Temp Range | -6 industrial grade (–40°C to +100°C) - qualified for extended-temperature industrial and aerospace applications |
Pinout & Package
XC2VP20-6FF896I uses the FF896 flip-chip fine-pitch BGA package with 896 balls arranged in a 31 mm × 31 mm array at 1.0 mm pitch. This package supports 564 user I/Os plus dedicated configuration, clock, JTAG, and power pins. Pin definitions are fully documented in DS083 Module 4 (Pinout Information), with ball assignments grouped by function (I/O banks, VCCO, VCCAUX, VCCINT, GND, transceiver differential pairs, and processor-specific signals).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration clock input | Drives internal configuration state machine during master serial or SelectMAP programming |
| DONE | Configuration status output | Signals completion of bitstream loading and device readiness for user mode |
| M0–M2 | Mode select inputs | Determine configuration mode (slave serial, master serial, slave SelectMAP, etc.) at power-up |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enable IEEE 1149.1-compliant testing, debugging, and partial reconfiguration |
| DXP/DXN | RocketIO differential transceiver pair | One of eight high-speed serial lanes supporting 3.125 Gb/s full-duplex operation |
| PLB_CLK | Processor Local Bus clock | Synchronizes PowerPC 405 core, PLB peripherals, and OCM memory access |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 cores | Enables asymmetric multiprocessing: one core for real-time control, second for protocol stack or diagnostics |
| Eight RocketIO transceivers | Provides native 3.125 Gb/s serial connectivity without external PHYs - reduces BOM and board area for backplane interfaces |
| SelectIO-Ultra I/O | Supports 22 single-ended and 10 differential standards (LVDS, SSTL, HSTL, PCI-X) with programmable drive strength and on-chip DCI termination |
| Twelve DCMs | Allows independent clock domain management for processor, transceivers, and logic fabric - eliminates external clock ICs |
| 18 × 18-bit multipliers | Accelerates FIR filters, FFTs, and motor control algorithms with dedicated hardware, bypassing LUT-based arithmetic |
| SRAM-based configuration | Enables unlimited reprogramming, partial reconfiguration, and bitstream encryption via triple-DES for IP protection |
Applications
| Telecom Line Card Control | Industrial Protocol Gateway |
|---|---|
Use Scenario: Managing SONET/SDH framing, TDM switching, and alarm reporting in carrier-grade line cards. IC Role / Device Role / Timing Role: XC2VP20-6FF896I serves as the central control plane processor and packet classifier, integrating PowerPC firmware with FPGA-accelerated HDLC and CRC engines. Use Value: Dual PowerPC cores handle real-time OS tasks while FPGA fabric processes 2.5 Gbps line-rate traffic - eliminating need for separate ASIC or network processor. | Use Scenario: Bridging Modbus TCP, PROFINET, and EtherCAT in factory automation controllers. IC Role / Device Role / Timing Role: XC2VP20-6FF896I implements soft Ethernet MACs, protocol stacks, and deterministic I/O scanning using embedded PowerPC and FPGA logic. Use Value: On-chip 564 I/Os and SelectIO-Ultra support mixed-voltage fieldbus interfaces; industrial temp grade ensures reliability in uncontrolled cabinet environments. |
| Aerospace Avionics Interface | Reconfigurable Signal Intelligence |
Use Scenario: ARINC 429/664 (AFDX) endpoint in flight control computers requiring DO-254 compliance. IC Role / Device Role / Timing Role: XC2VP20-6FF896I executes certified RTOS on PowerPC while FPGA implements time-triggered AFDX endpoints and health monitoring logic. Use Value: -40°C to +100°C rating and radiation-hardened-by-design (RHBD) layout meet airborne environmental requirements without derating. | Use Scenario: Real-time spectrum analysis and adaptive filtering in SIGINT receivers operating across 100 MHz–3 GHz bands. IC Role / Device Role / Timing Role: XC2VP20-6FF896I hosts FFT accelerators, digital downconverters, and demodulators in FPGA fabric, with PowerPC managing metadata and RF front-end calibration. Use Value: 290 dedicated multipliers and 1,584 Kb block RAM enable >1M-point FFTs at 100 MS/s sample rate - surpassing fixed-function DSP throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP20-5FF896I | Lower -5 speed grade: max PowerPC frequency 300 MHz, RocketIO max 2.0 Gb/s | Suitable for cost-sensitive industrial gateways where 350 MHz CPU or 3.125 Gb/s serial links are not required | Select when thermal budget or timing margin allows relaxed performance; identical pinout and logic resources |
| XC2VP30-6FF896I | Higher density: 30,816 logic cells, 644 I/Os, same -6 speed grade and FF896 package | Required for designs needing additional logic for complex packet inspection, encryption, or multi-protocol convergence | Choose when XC2VP20-6FF896I resource utilization exceeds 85% - same footprint enables drop-in upgrade |
Compared with XC2VP20-6FF896I, the XC2VP20-5FF896I trades 350→300 MHz CPU and 3.125→2.0 Gb/s transceivers for lower power and cost, while the XC2VP30-6FF896I adds 48% more logic and 80 more I/Os within the same thermal and mechanical envelope - making it ideal for scalable platform designs.
Availability
XC2VP20-6FF896I is available at Aetrix Electronics and suitable for telecom infrastructure upgrades, aerospace avionics sustainment, industrial protocol gateways, and reconfigurable signal processing systems requiring stable component supply across extended product lifecycles.
Supply support for XC2VP20-6FF896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered FPGA technology and defined the platform FPGA category with integrated processors and high-speed transceivers.
The Virtex-II Pro family - including XC2VP20-6FF896I - was engineered for high-reliability embedded systems demanding concurrent software execution, hardware acceleration, and multi-gigabit serial I/O in a single device.
FAQ
What is the maximum operating frequency of the PowerPC 405 cores in XC2VP20-6FF896I?
The XC2VP20-6FF896I supports a maximum PowerPC 405 core frequency of 350 MHz under industrial temperature conditions (–40°C to +100°C) at the -6 speed grade. This is confirmed in DS083 Table 4 and applies to both cores simultaneously when proper decoupling and thermal management are implemented per XAPP755 guidelines.
Does XC2VP20-6FF896I include on-chip memory for the PowerPC processors?
Yes, XC2VP20-6FF896I integrates dedicated on-chip memory controllers for the PowerPC 405 blocks, supporting direct connection to Block SelectRAM+ resources as OCM (On-Chip Memory). Each core can access up to 256 KB of low-latency OCM, enabling deterministic real-time execution without external memory latency.
Can XC2VP20-6FF896I be configured via JTAG, and what standards does it support?
Yes, XC2VP20-6FF896I supports IEEE 1149.1 boundary-scan via its TCK/TMS/TDI/TDO pins and complies with IEEE 1532 for in-system configuration. JTAG enables configuration bitstream loading, readback, debug access to PowerPC registers, and FPGA logic analyzer triggering - all without requiring dedicated configuration pins.
What transceiver protocols are supported by the RocketIO blocks in XC2VP20-6FF896I?
The eight RocketIO transceivers in XC2VP20-6FF896I support Fibre Channel, Gigabit Ethernet, 10G Fibre Channel, XAUI, InfiniBand, and Aurora protocols - all enabled through 8B/10B encoding, channel bonding, and programmable pre-emphasis. These capabilities are explicitly listed in DS083 Module 2 for non-X devices like XC2VP20.
Is XC2VP20-6FF896I pin-compatible with other Virtex-II Pro devices in FF896 packaging?
No - XC2VP20-6FF896I is not pin-compatible with higher-density Virtex-II Pro devices (e.g., XC2VP30-6FF896I) despite sharing the FF896 package. Ball assignments differ significantly due to varying I/O counts (564 vs. 644) and transceiver pinout allocation; migration requires PCB redesign even within the same package footprint.
XC2VP20-6FF896I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 896-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2320
- Number of Logic Elements/Cells:
- 20880
- Total RAM Bits:
- 1622016
- Number of I/O:
- 556
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 896-FCBGA (31x31)
XC2VP20-6FF896I FAQ
1.How can I place an order for XC2VP20-6FF896I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP20-6FF896I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP20-6FF896I reliable?
The price and inventory of XC2VP20-6FF896I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP20-6FF896I is usually 5 days.
3.What payment methods are accepted for XC2VP20-6FF896I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP20-6FF896I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP20-6FF896I?
XC2VP20-6FF896I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP20-6FF896I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP20-6FF896I?
For technical support, including XC2VP20-6FF896I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP20-6FF896I requirements.
6.How does Aetrix verify that XC2VP20-6FF896I is sourced from the original manufacturer or authorized distributors?
All XC2VP20-6FF896I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP20-6FF896I meets industry standards.
7.What is the process for return or replacement of XC2VP20-6FF896I?
All XC2VP20-6FF896I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP20-6FF896I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP20-6FF896I part is unused and in its original packaging.
Return procedure for XC2VP20-6FF896I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2VP20-6FF896I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
