AMD XC2VP20-6FFG1152C

Overview

XC2VP20-6FFG1152C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It targets high-bandwidth embedded systems requiring on-chip processing, serial interconnect, and reconfigurable logic - such as telecom line cards and network packet processors.

For engineers reviewing the XC2VP20-6FFG1152C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-6 = 3.125 Gb/s), DCM count for clock domain management, I/O voltage flexibility (1.5V/2.5V/3.3V), and FF1152 package thermal/power delivery characteristics.

Technical Context

This device implements a hardened architecture combining SRAM-based FPGA fabric with embedded processor subsystems and serial transceivers. The dual PowerPC 405 cores operate up to 350 MHz (speed grade -6), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. The eight RocketIO transceivers support full-duplex operation at 3.125 Gb/s with 8B/10B encoding, channel bonding, and programmable pre-emphasis.

The FPGA fabric includes 9,280 CLB slices, 290 dedicated 18×18 multipliers, 88 Block SelectRAM+ modules (18 Kb each), and twelve DCMs enabling precise clock deskew, multiplication/division, and phase shifting. I/O subsystem supports 22 single-ended and 10 differential standards, including LVDS, SSTL, HSTL, and PCI-X, with Digitally Controlled Impedance (DCI) for on-die termination.

Key Specifications

Pinout & Package

XC2VP20-6FFG1152C uses the FF1152 flip-chip fine-pitch BGA package (35 mm × 35 mm, 1.0 mm pitch), optimized for high I/O count and thermal dissipation. This package supports 564 user I/Os plus dedicated configuration, clock, JTAG, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP20-6FFG1152C, XC2VP30-6FF896C trades I/O count for compactness and XC2VP40-6FF1148C sacrifices integrated transceivers for raw logic and pin count - making XC2VP20-6FFG1152C optimal for balanced serial+processing+I/O workloads in space-constrained telecom infrastructure.

Availability

XC2VP20-6FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, and medical imaging systems requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP20-6FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and system-on-chip integration for high-performance digital systems.

The Virtex-II Pro family was designed to unify hard processor cores, high-speed serial I/O, and configurable logic in a single die - targeting applications where ASIC-level performance meets FPGA-level flexibility, especially in networking and signal processing.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP20-6FFG1152C?

The XC2VP20-6FFG1152C speed grade -6 supports PowerPC 405 core operation up to 350 MHz in commercial temperature grade. This rating assumes proper PCB layout, power delivery, and thermal management. The XC2VP20-6FFG1152C datasheet specifies that exceeding 350 MHz in dual-processor configurations requires implementation of the clock macro described in XAPP755 to maintain timing closure and stability.

Does XC2VP20-6FFG1152C support partial reconfiguration?

Yes, XC2VP20-6FFG1152C fully supports partial reconfiguration via its configuration port, allowing dynamic replacement of logic modules without resetting the entire device. This capability preserves state in active PowerPC cores and ongoing RocketIO link operation. Implementation requires Xilinx ISE tools and adherence to modular design rules defined in UG070 and XAPP290 for the Virtex-II Pro family.

What I/O standards are supported by XC2VP20-6FFG1152C?

XC2VP20-6FFG1152C supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Each I/O bank is independently configurable, and Digitally Controlled Impedance (DCI) provides automatic on-die termination matching for most standards without external resistors.

Is XC2VP20-6FFG1152C pin-compatible with other Virtex-II Pro devices in the FF1152 package?

No, XC2VP20-6FFG1152C is not pin-compatible with other Virtex-II Pro devices in the FF1152 package. While all FF1152-packaged Virtex-II Pro devices share the same mechanical footprint and ball map, I/O function assignment, power pin distribution, and transceiver pinout vary significantly between models (e.g., XC2VP30 vs. XC2VP20). Pin compatibility must be verified per device using the official pinout tables in DS083 Module 4.

What is the role of the Digital Clock Manager (DCM) in XC2VP20-6FFG1152C?

The XC2VP20-6FFG1152C integrates twelve DCMs to manage clock distribution, synthesis, and timing integrity. Each DCM performs deskewing, frequency multiplication/division (e.g., 50 MHz → 200 MHz), and fine-grained phase shifting (1/256 period resolution). They stabilize clocks across large FPGA fabrics and synchronize disparate domains - such as PowerPC core clocks, RocketIO reference clocks, and I/O interface clocks - ensuring setup/hold compliance in high-speed designs.