AMD XC2VP20-6FFG1152I

Overview

XC2VP20-6FFG1152I from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It targets high-bandwidth telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP20-6FFG1152I datasheet, pinout, applications, or equivalent options, key selection criteria include dual-processor support, -6 speed grade timing margin, FF1152 package I/O count, and RocketIO transceiver compliance with Gigabit Ethernet and Fibre Channel protocols.

Technical Context

The XC2VP20-6FFG1152I implements a hardened architecture combining SRAM-based FPGA fabric with two embedded PowerPC 405 cores operating up to 350 MHz (Industrial grade) and eight RocketIO transceivers supporting 600 Mb/s to 3.125 Gb/s full-duplex operation. Its clocking subsystem includes twelve DCMs for phase-shifting, frequency synthesis, and deskew across 16 global clock nets.

I/O resources comprise SelectIO-Ultra blocks supporting 22 single-ended and 10 differential standards-including LVDS at 840 Mb/s-with Digitally Controlled Impedance (DCI) termination and programmable drive strength (2–24 mA). Configuration uses IEEE 1532-compliant boundary-scan or SelectMAP modes with optional DES bitstream encryption.

Key Specifications

Pinout & Package

XC2VP20-6FFG1152I uses the FF1152 flip-chip fine-pitch BGA package (35 mm × 35 mm, 1.0 mm pitch), optimized for thermal performance and signal integrity in high-speed systems. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCINT (1.5 V), VCCAUX (2.5 V), VCCO (1.5/1.8/2.5/3.3 V), and transceiver power domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP20-6FFG1152I, the -5 variant trades timing margin for lower cost and power, while the XC2VP30-6FFG1152I extends logic and I/O headroom without changing package or thermal profile-making both viable for derivative designs within the same PCB footprint.

Availability

XC2VP20-6FFG1152I is available at Aetrix Electronics and suitable for telecom line cards, medical imaging backplanes, industrial video encoders, and defense radar signal processors requiring stable component supply across extended product lifecycles.

Supply support for XC2VP20-6FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-performance FPGAs for demanding system-level applications.

The Virtex-II Pro product line was engineered to integrate hard processor cores and multi-gigabit transceivers into FPGA fabric-targeting embedded networking, wireless infrastructure, and high-end digital signal processing systems.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP20-6FFG1152I?

The XC2VP20-6FFG1152I PowerPC 405 cores are rated for 350 MHz operation in Industrial temperature grade (-40°C to +100°C) at -6 speed grade. This is confirmed in DS083 Table 4, which specifies 350 MHz for -6 Industrial dual-processor devices. Operation above this frequency requires implementation of the clock macro described in XAPP755.

Does XC2VP20-6FFG1152I support 10 Gigabit Ethernet XAUI interfaces?

Yes, XC2VP20-6FFG1152I supports 10GbE XAUI through its eight RocketIO transceivers, each capable of 3.125 Gb/s operation. DS083 Module 2 explicitly lists XAUI compatibility for RocketIO transceivers, and the -6 speed grade guarantees timing closure at this data rate in the FF1152 package.

What I/O standards are supported by XC2VP20-6FFG1152I with on-chip termination?

XC2VP20-6FFG1152I supports on-chip termination for LVDS, Extended LVDS, ULVDS, and LDT differential standards, plus all single-ended standards (LVTTL, LVCMOS, SSTL, HSTL, GTL) via Digitally Controlled Impedance (DCI). This eliminates external termination resistors and improves signal integrity in high-speed interfaces.

Can XC2VP20-6FFG1152I be configured via JTAG boundary-scan?

Yes, XC2VP20-6FFG1152I fully supports IEEE 1149.1 and 1532-compliant boundary-scan configuration. The TCK, TMS, TDI, and TDO pins enable in-system programming, debug access, and readback of configuration memory and internal register states without requiring dedicated configuration pins.

Is XC2VP20-6FFG1152I pin-compatible with other Virtex-II Pro devices in the FF1152 package?

No-XC2VP20-6FFG1152I is not pin-compatible with other Virtex-II Pro devices in the FF1152 package. While package dimensions and pitch match, pin functions (especially RocketIO pairs, DCM inputs, and I/O bank assignments) differ across device densities. DS083 Table 3 confirms distinct I/O counts and transceiver allocations per device/package combination.