AMD XC2VP20-6FFG896C

Overview

XC2VP20-6FFG896C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in an 896-pin flip-chip fine-pitch BGA package. It targets high-bandwidth telecom backplane interfaces, embedded networking systems, and DSP-accelerated video processing where integrated processing + serial I/O + programmable logic coexist on a single die.

For engineers reviewing the XC2VP20-6FFG896C datasheet, pinout, applications, or equivalent options, key selection criteria include dual-processor clocking constraints at -6 speed grade, RocketIO transceiver baud rate limits (3.125 Gb/s max), DCM phase-shift resolution (1/256 period), and FF896 package I/O mapping with no bonded-out MGT pins beyond the eight configured channels.

Technical Context

The XC2VP20-6FFG896C implements a hardened dual-PowerPC 405 subsystem operating up to 350 MHz in -6 speed grade, each with 16 KB instruction and data caches, MMU, and OCM interface. Its eight RocketIO transceivers support full-duplex SERDES at 600 Mb/s–3.125 Gb/s with 8B/10B encoding, channel bonding (2–20 channels), and per-channel loopback modes.

FPGA fabric includes 9,280 CLB slices, 88 18×18-bit multipliers, 1,584 Kb block SelectRAM+ (18 Kb × 88), and twelve DCMs enabling precise deskew, integer/fractional frequency synthesis, and coarse/fine phase shifting. Routing uses Active Interconnect Technology with hierarchical segmented resources and predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2VP20-6FFG896C is housed in an 896-ball flip-chip fine-pitch BGA (FF896) package with 1.0 mm pitch, 31 mm × 31 mm body size, and thermal-enhanced construction optimized for high I/O count and power dissipation. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCINT (1.5 V), VCCAUX (2.5 V), VCCO (1.5/1.8/2.5/3.3 V), and MGT reference clocks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP20-6FFG896C, XC2VP30-6FF896C offers 47% more logic and 14% more I/O in identical packaging for scalability, while XC2VP20-7FF896C trades temperature rating for higher guaranteed clock frequencies-neither is pin-compatible due to distinct speed-grade binning and thermal validation.

Availability

XC2VP20-6FFG896C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial gateways, and video processing systems requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP20-6FFG896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA architecture with SRAM-based reconfigurable logic, embedded processors, and high-speed transceivers for adaptive computing platforms.

The Virtex-II Pro family was designed to unify programmable logic, embedded RISC processing, and multi-gigabit serial I/O in a single device for high-performance communications and signal processing applications.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP20-6FFG896C?

The XC2VP20-6FFG896C supports PowerPC 405 cores up to 350 MHz in -6 speed grade under commercial temperature conditions. This limit assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-processor clock macro implementation. Operation above 350 MHz requires -7 speed grade devices and is not supported for XC2VP20-6FFG896C.

Does XC2VP20-6FFG896C support 64B/66B encoding in its RocketIO transceivers?

No, XC2VP20-6FFG896C implements standard RocketIO transceivers-not RocketIO X-and therefore supports only 8B/10B encoding. 64B/66B encoding is exclusive to XC2VPX20 and XC2VPX70 devices per DS083 Module 2. Attempting to configure 64B/66B on XC2VP20-6FFG896C will result in functional failure.

Can XC2VP20-6FFG896C be used in industrial temperature applications?

XC2VP20-6FFG896C is specified for commercial temperature range (0°C to 85°C). The -6 speed grade is not qualified for industrial temperature (-40°C to 100°C); only -5 speed grade variants meet industrial requirements. Using XC2VP20-6FFG896C outside its rated temperature range may cause timing violations or configuration loss.

How many Digital Clock Managers (DCMs) are available in XC2VP20-6FFG896C?

XC2VP20-6FFG896C contains twelve Digital Clock Managers (DCMs), each capable of clock deskew, frequency synthesis (integer or fractional), and coarse/fine phase shifting. These DCMs are distributed across the die and accessible via global clock networks, enabling independent clock domain management for processor, transceiver, and fabric logic subsystems.

Is XC2VP20-6FFG896C pin-compatible with XC2VP20-6FF896C?

Yes, XC2VP20-6FFG896C and XC2VP20-6FF896C share identical FF896 package pinout, ball map, and mechanical dimensions. The "G" suffix denotes green (lead-free) compliance per Xilinx's Pb-free initiative, with no electrical or functional differences. Migration between them requires only solder paste and reflow profile adjustments for RoHS compliance.