AMD XC2VP20-6FG676C

Overview

XC2VP20-6FG676C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond FG676 package), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in a 676-pin fine-pitch wire-bond BGA. It targets high-bandwidth telecom backplane interfaces, embedded networking systems, and DSP-accelerated video processing where on-chip processing, serial interconnect, and reconfigurable logic coexist.

For engineers reviewing the XC2VP20-6FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC 405 core support at 350 MHz (–6 speed grade), RocketIO transceiver compatibility with Fibre Channel and Gigabit Ethernet, DCM-based clock deskew and phase shifting, and SelectIO-Ultra I/O with digitally controlled impedance (DCI) for LVDS and SSTL-2.

Technical Context

The XC2VP20-6FG676C implements a hardened architecture combining SRAM-based FPGA fabric with embedded processor subsystems and serial transceivers. Its two PowerPC 405 cores operate at up to 350 MHz (–6 grade), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. The eight RocketIO transceivers support full-duplex operation from 600 Mb/s to 2.5 Gb/s (wire-bond FG676 limit), with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

Logic resources include 9,280 CLB slices, 290 dedicated 18×18 multipliers, and 88 Block SelectRAM+ modules (18 Kb each), enabling large embedded memory and DSP-intensive functions. Clocking uses twelve DCMs for precise de-skew, frequency synthesis (integer/fractional), and coarse/fine phase shifting (1/256 period resolution), all routed via 16 global clock nets and active interconnect routing.

Key Specifications

Pinout & Package

XC2VP20-6FG676C is housed in a 676-ball fine-pitch wire-bond BGA (FG676) with 1.0 mm pitch, 26 mm × 26 mm body size, and Pb-free option (FGG676). Package supports 564 user I/Os plus dedicated configuration, JTAG, power, and transceiver pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP20-6FG676C, XC2VP30-6FF896C offers greater transceiver count and I/O but sacrifices DCI and increases thermal design complexity, while XC2VP7-6FG456C retains identical I/O standards and package compatibility at lower logic density and cost-making it a scalable entry point for Virtex-II Pro-based platforms.

Availability

XC2VP20-6FG676C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, defense signal processing, and medical imaging systems requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP20-6FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic platforms for demanding system-level integration.

The Virtex-II Pro product line was designed to unify programmable logic, embedded processors, and high-speed serial I/O in a single device-targeting applications where ASIC-level performance meets FPGA-level flexibility and rapid iteration.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP20-6FG676C?

The XC2VP20-6FG676C supports dual PowerPC 405 cores running at up to 350 MHz under the –6 speed grade, as confirmed in DS083 Table 4. This frequency assumes proper PCB layout, thermal management, and 1.5 V VCCINT supply regulation. The XC2VP20-6FG676C achieves this performance using its hardened processor block with on-chip cache and MMU-no external clock multiplier is needed.

Does XC2VP20-6FG676C support 8B/10B encoding in its RocketIO transceivers?

Yes, XC2VP20-6FG676C includes eight RocketIO transceivers that natively support 8B/10B encoding and decoding, as specified in Module 2 of DS083. This capability enables direct compliance with Gigabit Ethernet, Fibre Channel, and XAUI protocols without external encoding logic. The XC2VP20-6FG676C also supports optional bypass of the encoder/decoder for custom serial protocols.

What I/O standards are supported by XC2VP20-6FG676C with Digitally Controlled Impedance (DCI)?

XC2VP20-6FG676C supports DCI for LVCMOS (1.5V, 1.8V, 2.5V, 3.3V), SSTL (1.8V, 2.5V Class I/II), and HSTL (1.5V, 1.8V Class I–IV) single-ended standards, as documented in DS083 Module 1. DCI automatically calibrates on-die termination to match transmission line impedance-eliminating external resistors. The XC2VP20-6FG676C does not apply DCI to differential standards like LVDS.

Can XC2VP20-6FG676C be configured via JTAG boundary-scan?

Yes, XC2VP20-6FG676C fully supports IEEE 1149.1 boundary-scan configuration through its TCK/TMS/TDI/TDO pins. It implements BYPASS, PRELOAD, SAMPLE, IDCODE, and USERCODE instructions, and allows partial reconfiguration and readback of configuration memory, flip-flops, and Block SelectRAM+. This capability is integral to the XC2VP20-6FG676C's test and debug workflow.

Is XC2VP20-6FG676C recommended for new designs?

No, XC2VP20-6FG676C is marked "Product Not Recommended For New Designs" per DS083 v5.0 (June 2011). While fully functional and supported for legacy program continuity, Xilinx recommends migrating to newer families (e.g., Kintex-7 or Versal) for enhanced performance, power efficiency, and toolchain support. Aetrix Electronics maintains inventory and lifecycle coordination for existing XC2VP20-6FG676C deployments.