AMD XC2VP20-6FG676I

Overview

XC2VP20-6FG676I from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond FG676 package), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in a 676-pin Fine-Pitch BGA (FG676) package. It targets high-bandwidth telecom and networking systems requiring embedded processing and serial interconnect.

For engineers reviewing the XC2VP20-6FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC 405 core support, RocketIO transceiver count and speed grade (-6 = 2.5 Gb/s for wire-bond packages), DCM count, I/O count (564), and FG676 package compatibility with industrial temperature range (–40°C to +100°C).

Technical Context

The XC2VP20-6FG676I implements a hardened architecture combining SRAM-based FPGA fabric with two embedded IBM PowerPC 405 cores (350 MHz at -6 speed grade), eight RocketIO transceivers (2.5 Gb/s full-duplex SERDES), and twelve DCMs for clock synthesis, de-skew, and phase shifting. Its IOBs support SelectIO-Ultra with DCI termination and 22 single-ended / 10 differential I/O standards.

It uses a 0.13 µm nine-layer copper process with 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Configuration is via Slave/Master SelectMAP or JTAG (IEEE 1532), with optional Triple-DES bitstream encryption and readback capability.

Key Specifications

Pinout & Package

XC2VP20-6FG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FG676) package with 1.0 mm pitch, wire-bond construction, and industrial temperature rating (–40°C to +100°C). The package supports 564 user I/Os plus dedicated configuration, clock, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP20-6FG676I, XC2VP20-5FG676I trades transceiver speed and CPU frequency for lower power and cost, while XC2VP30-6FG676I extends logic capacity and I/O count without changing package or speed - enabling scalable design reuse across product tiers.

Availability

XC2VP20-6FG676I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial protocol conversion, medical imaging, and avionics data acquisition requiring stable component supply over extended lifecycles.

Supply support for XC2VP20-6FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and embedded processor integration.

The Virtex-II Pro family, including XC2VP20-6FG676I, was designed for high-performance embedded systems demanding both programmable logic and hard processor subsystems - targeting telecom, aerospace, and industrial control applications where flexibility and deterministic timing are critical.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP20-6FG676I?

The XC2VP20-6FG676I supports RocketIO transceivers up to 2.5 Gb/s in full-duplex mode. This speed grade (-6) applies specifically to wire-bond packages like FG676; RocketIO X variants (e.g., XC2VPX20) support higher rates but are not applicable to this part number. Performance is validated per DS083 Table 4 for industrial temperature operation.

Does XC2VP20-6FG676I include embedded processor cores?

Yes, XC2VP20-6FG676I integrates two hardened IBM PowerPC 405 RISC processor cores, each with 16 KB instruction and 16 KB data caches, MMU, and CoreConnect bus interface. At the -6 speed grade, they operate up to 350 MHz in commercial grade and 300 MHz in industrial grade, as specified in DS083 Module 1.

What package type and pin count does XC2VP20-6FG676I use?

XC2VP20-6FG676I uses a 676-ball Fine-Pitch Ball Grid Array (FG676) package with 1.0 mm pitch and wire-bond interconnect. It provides 564 user I/O pins, plus dedicated configuration, clock, power, and JTAG pins - fully documented in DS083 Module 4 Pinout Information.

Is XC2VP20-6FG676I suitable for industrial temperature applications?

Yes, the "I" suffix in XC2VP20-6FG676I denotes Industrial temperature grade (–40°C to +100°C). All electrical characteristics, including RocketIO transceiver jitter, DCM stability, and PowerPC timing, are guaranteed across this range per DS083 DC and Switching Characteristics specifications.

What configuration modes are supported by XC2VP20-6FG676I?

XC2VP20-6FG676I supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and JTAG (IEEE 1532). It also includes an on-chip DES decryptor for optional Triple-DES bitstream encryption, enabling secure configuration in deployed systems.