AMD XC2VP20-6FGG676C

Overview

XC2VP20-6FGG676C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond packages), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in a 676-pin Fine-Pitch BGA (FGG676) package. It targets high-performance telecom, networking, and video processing systems requiring embedded processing and serial interconnect.

For engineers reviewing the XC2VP20-6FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC 405 core support, 2.5 Gb/s RocketIO transceiver performance in FGG676 packaging, DCM-based clock management, SelectIO-Ultra I/O flexibility, and compatibility with Xilinx Foundation/Alliance design tools.

Technical Context

This device implements a hybrid architecture combining SRAM-based FPGA fabric with hard IP: dual 300–350 MHz PowerPC 405 cores (per speed grade), each with 16 KB instruction and data caches, MMU, and OCM interface; eight RocketIO transceivers supporting 600 Mb/s to 2.5 Gb/s per channel in wire-bond packages like FGG676; and programmable logic resources including CLBs, 18×18 multipliers, and 18-Kb Block SelectRAM+ modules.

The FPGA fabric uses a 0.13 µm nine-layer copper process with 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and configurable I/O supply (VCCO). Routing employs Active Interconnect Technology with hierarchical segmented structure, and I/O supports 22 single-ended and 10 differential standards-including LVDS, SSTL, HSTL-with Digitally Controlled Impedance (DCI) and on-chip termination.

Key Specifications

Pinout & Package

XC2VP20-6FGG676C is housed in a 676-ball Fine-Pitch BGA (FGG676) package with 1.0 mm pitch, optimized for thermal performance and signal integrity in high-density PCB layouts. Pin definitions follow Xilinx DS083 Module 4, covering configuration, JTAG, clock, PowerPC bus, RocketIO differential pairs, and user I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP20-6FGG676C, XC2VP30-6FGG676C offers scalable logic headroom within identical mechanical and thermal constraints, while XC2VP40-6FF672C trades transceiver integration for raw I/O and logic capacity-making it suitable only when serial interface functions are implemented externally.

Availability

XC2VP20-6FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging equipment, and industrial video processing systems requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP20-6FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA technology and advanced system-on-chip architectures for high-performance digital design.

The Virtex-II Pro family was designed to unify programmable logic, embedded processors, and high-speed serial I/O in a single device-targeting applications where ASIC-level performance meets FPGA-level flexibility.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP20-6FGG676C?

XC2VP20-6FGG676C supports RocketIO transceivers operating up to 2.5 Gb/s in the FGG676 wire-bond package. This speed is confirmed in DS083 Table 4 for -6 speed grade devices using FG/FGG packages. The higher 6.25 Gb/s RocketIO X capability applies only to XC2VPX20 and XC2VPX70 variants-not to XC2VP20-6FGG676C.

Does XC2VP20-6FGG676C include PowerPC processor cores?

Yes, XC2VP20-6FGG676C integrates two PowerPC 405 RISC processor blocks, each with 16 KB instruction cache, 16 KB data cache, MMU, and OCM interface. These cores operate at up to 350 MHz in -6 speed grade commercial devices, as specified in DS083 Table 4 and Module 2 functional description.

What package type and pin count does XC2VP20-6FGG676C use?

XC2VP20-6FGG676C uses the FGG676 package: a 676-ball wire-bond fine-pitch BGA with 1.0 mm pitch and 26 mm × 26 mm body size. It is Pb-free compliant and supports 564 user I/Os, as documented in DS083 Table 3 and Module 4 pinout information.

Is XC2VP20-6FGG676C suitable for new designs?

No-XC2VP20-6FGG676C is marked "Product Not Recommended For New Designs" in DS083 (v5.0, June 2011). It remains available for legacy support and obsolescence management, but Xilinx recommends Virtex-4 or later families for new development due to enhanced performance, power efficiency, and toolchain support.

What configuration modes does XC2VP20-6FGG676C support?

XC2VP20-6FGG676C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. All modes are detailed in DS083 Module 1 Section "Configuration", with optional triple-DES bitstream encryption available for secure deployment.