AMD XC2VP20-6FGG676I

Overview

XC2VP20-6FGG676I from Xilinx is a Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond packages), 20,880 logic cells, and 564 user I/Os in a 676-pin Fine-Pitch BGA (FGG676) package. It targets high-performance embedded systems requiring integrated processing, high-speed serial I/O, and programmable logic - such as telecom line cards and video processing subsystems.

For engineers reviewing the XC2VP20-6FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual-PPC405 support, RocketIO transceiver count and speed grade (-6 = 2.5 Gb/s for wire-bond), DCM count (8), Block RAM capacity (1,584 Kb), and industrial temperature rating (I suffix).

Technical Context

The XC2VP20-6FGG676I implements a hardened architecture combining two independent PowerPC 405 cores (350 MHz at -6 speed grade), eight RocketIO transceivers with 8B/10B encoding, and FPGA fabric built on 0.13 µm copper process. Its IOBs support DCI-terminated LVCMOS/LVDS and PCI-X, while CLBs deliver 20,880 logic cells with distributed RAM and 18×18 multipliers.

Digital Clock Managers (8 units) provide phase-shifting, frequency synthesis, and deskew; Block SelectRAM+ delivers 88 × 18-Kb true dual-port RAM blocks (1,584 Kb total); and configuration uses SRAM-based bitstream loading with optional DES encryption. The FGG676 package is wire-bond, 1.0 mm pitch, 26×26 mm, supporting 564 user I/Os excluding control and transceiver pins.

Key Specifications

Pinout & Package

XC2VP20-6FGG676I uses a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.0 mm pitch, wire-bond interconnect, and 26×26 mm footprint. It supports 564 user I/Os plus dedicated configuration, clock, JTAG, and power pins. RocketIO transceiver pins are assigned to specific differential pairs in banks V1–W1 and Y1–AA1 per DS083 Module 4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP20-6FGG676I, the -5 variant trades transceiver and CPU speed for lower power and cost, while the XC2VP30-6FGG676I extends scalability with +48% logic and +55% RAM - both retain identical pinout, package, and industrial temperature rating.

Availability

XC2VP20-6FGG676I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial control gateways requiring stable component supply across extended product lifecycles.

Supply support for XC2VP20-6FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded hard IP and system-level integration.

The Virtex-II Pro family was designed to unify programmable logic, high-speed serial I/O, and embedded RISC processing in a single die - targeting applications where ASIC-like performance meets FPGA flexibility.

FAQ

What does the "I" suffix in XC2VP20-6FGG676I indicate?

The "I" suffix denotes Industrial temperature grade, specifying operation from –40°C to +100°C ambient. This ensures reliable functionality in uncontrolled environments such as factory floors or outdoor telecom cabinets. The XC2VP20-6FGG676I maintains full specification compliance across this range, including RocketIO transceiver jitter and PowerPC timing margins - unlike commercial-grade variants which are limited to 0°C–85°C.

Does XC2VP20-6FGG676I support PCIe Gen1 x1 interfaces?

No, XC2VP20-6FGG676I does not natively support PCIe Gen1. Its RocketIO transceivers comply with Fibre Channel, Gigabit Ethernet, and XAUI standards but lack PCIe-specific PHY logic, training sequences, or LTSSM state machines. Implementing PCIe requires external PHY or soft IP with significant resource overhead - and is not validated or recommended by Xilinx for this device. For PCIe integration, later-generation Virtex-4 or Spartan-6 devices are appropriate alternatives.

How many RocketIO transceivers are active in XC2VP20-6FGG676I, and what is their maximum data rate?

XC2VP20-6FGG676I contains eight RocketIO transceivers, all fully functional and accessible in the FGG676 package. At speed grade -6 in wire-bond packages, each operates up to 2.5 Gb/s full-duplex (5 Gb/s aggregate per lane). This is confirmed in Table 4 of DS083 v5.0 and applies specifically to FG/FGG packages - not the higher-speed RocketIO X variants found in XC2VPX20.

Can XC2VP20-6FGG676I be configured via JTAG only, or are other methods supported?

XC2VP20-6FGG676I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 JTAG. JTAG is sufficient for programming and debugging but cannot replace dedicated configuration modes for production boot. For system startup, master SelectMAP (using external PROM) or slave serial (via microcontroller) is required - JTAG lacks the bandwidth and reliability for full bitstream loading in field-deployed systems.

Is bitstream encryption available on XC2VP20-6FGG676I, and how is it implemented?

Yes, XC2VP20-6FGG676I supports Triple-DES bitstream encryption using on-chip hardware decryptors. Configuration data is encrypted off-line using Xilinx tools and loaded into external PROM; during power-up, the FPGA decrypts the bitstream in real time using one or two stored DES keys. This prevents reverse engineering of logic design and protects firmware IP - a feature confirmed in DS083 Module 1 and enabled via BITGEN option settings.