AMD XC2VP20-7FFG1152C

Overview

XC2VP20-7FFG1152C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers, 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It delivers up to 400 MHz processor operation and 3.125 Gb/s per transceiver channel for high-bandwidth telecom and networking systems.

For engineers reviewing the XC2VP20-7FFG1152C datasheet, pinout, applications, or equivalent options, key selection criteria include dual-processor support, embedded SERDES bandwidth, DCM count for clock domain management, SelectIO-Ultra I/O voltage flexibility (1.5V–3.3V), and 1.5V core supply compatibility with legacy 0.13 µm system designs.

Technical Context

The XC2VP20-7FFG1152C implements a hardened architecture combining SRAM-based FPGA fabric with two independent PowerPC 405 cores-each featuring 16 KB instruction and data caches, MMU, and OCM interface-and eight RocketIO transceivers supporting 600 Mb/s to 3.125 Gb/s full-duplex serial links. Its routing uses Active Interconnect Technology with hierarchical segmented resources and predictable delay independent of fanout.

Digital Clock Manager (DCM) modules provide self-calibrating clock de-skew, integer/fractional frequency synthesis, and 1/256-period fine phase shifting across twelve independent instances. The device supports IEEE 1149.1 boundary-scan and IEEE 1532 configuration, with triple-DES bitstream encryption and partial reconfiguration capability enabled by its SRAM-based configuration memory.

Key Specifications

Pinout & Package

XC2VP20-7FFG1152C is housed in a 1152-ball flip-chip fine-pitch BGA (FFG1152) package with 1.0 mm pitch, optimized for high I/O count, signal integrity, and thermal dissipation. Pin definitions follow Xilinx DS083 Module 4, where balls are organized into banks with dedicated VCCO, VREF, and configuration pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP30-7FF896C, the XC2VP20-7FFG1152C offers identical transceiver count and processor count in a thermally superior 1152-ball flip-chip package but trades logic density for compact board area. Compared with XC2VPX20-7FFG1152C, it uses standard RocketIO (not RocketIO X), limiting max serial rate to 3.125 Gb/s but retaining full 564 I/O availability.

Availability

XC2VP20-7FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging backend processing, avionics data concentration, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2VP20-7FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive computing solutions targeting high-performance embedded and infrastructure markets.

The Virtex-II Pro family was engineered to integrate hard processor subsystems and multi-gigabit transceivers into high-density FPGA fabric for wireline communications, defense systems, and real-time signal processing applications.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP20-7FFG1152C?

The XC2VP20-7FFG1152C supports up to 400 MHz PowerPC 405 core operation in -7 speed grade Commercial devices. This requires adherence to XAPP755 guidelines for dual-processor timing closure above 350 MHz, including specific clock macro instantiation and PCB layout rules for power integrity and signal routing.

Does XC2VP20-7FFG1152C support partial reconfiguration?

Yes, XC2VP20-7FFG1152C supports partial reconfiguration through its SRAM-based configuration architecture and SelectMAP interface. Users can dynamically reload designated logic regions without disrupting active processor operation or transceiver links, enabling field-upgradable functions in telecom and defense systems.

What I/O standards are supported by the SelectIO-Ultra blocks in XC2VP20-7FFG1152C?

XC2VP20-7FFG1152C supports 22 single-ended standards (including LVTTL, LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Digitally Controlled Impedance (DCI) provides automatic on-chip termination for all single-ended I/Os.

Is XC2VP20-7FFG1152C pin-compatible with other Virtex-II Pro devices in the FFG1152 package?

No, XC2VP20-7FFG1152C is not pin-compatible with other Virtex-II Pro devices in the FFG1152 package. While package footprint and ball map are identical, I/O bank assignments, voltage requirements, and transceiver pin allocations differ across device densities-requiring unique PCB layouts for each part number.

What configuration modes does XC2VP20-7FFG1152C support?

XC2VP20-7FFG1152C supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. Configuration is initiated via PROG_B and controlled by M0–M2 mode pins; bitstream security is enhanced by optional triple-DES encryption.