AMD XC2VP20-7FG676C
- Part No.:
- XC2VP20-7FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC2VP20-7FG676C.pdf
- Description:
- IC FPGA 404 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,021
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2VP20-7FG676C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond FG676 package), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in a 676-pin fine-pitch BGA. It targets high-bandwidth telecom backplane interfaces requiring embedded processing and serial connectivity.
For engineers reviewing the XC2VP20-7FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC 405 core support at up to 400 MHz, RocketIO transceiver compatibility with Fibre Channel and Gigabit Ethernet, DCM-based clock deskew and phase shifting, and SelectIO-Ultra I/O supporting LVDS, SSTL, and DCI termination.
Technical Context
The XC2VP20-7FG676C implements a hybrid architecture combining hard IP blocks (dual PowerPC 405 cores, eight RocketIO transceivers) with programmable FPGA fabric based on 0.13 µm copper process. Its RocketIO transceivers operate at 2.5 Gb/s in the FG676 wire-bond package and support 8B/10B encoding, channel bonding, and programmable pre-emphasis.
Each PowerPC 405 block includes 16 KB instruction and 16 KB data caches, MMU with 64-entry TLB, and OCM interface for low-latency memory access. The FPGA fabric delivers 20,880 logic cells, 290 18×18 multipliers, 88 Block SelectRAM+ modules (18 Kb each), and twelve DCMs enabling precise clock de-skew, frequency synthesis, and ±1/256-cycle phase adjustment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 20,880 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| PowerPC Cores | 2 × PowerPC 405 - enables dual-core embedded software execution with cache, MMU, and OCM support |
| RocketIO Transceivers | 8 × 2.5 Gb/s - provides full-duplex serial links compatible with Fibre Channel, Gigabit Ethernet, and XAUI |
| Digital Clock Managers | 12 × DCM - supports clock de-skew, multiplication/division, and fine-grained phase shifting (±1/256 cycle) |
| User I/O Pins | 564 - supports high-pin-count parallel buses and multiple differential standards including LVDS and SSTL |
| Block RAM | 88 × 18 Kb SelectRAM+ - delivers 1,584 KB true dual-port RAM for buffering, FIFOs, and lookup tables |
| Multiplier Blocks | 290 × 18×18 - accelerates DSP operations such as FIR filtering and FFT without consuming LUT resources |
| Core Voltage | 1.5 V VCCINT - defines power delivery requirements and thermal management constraints for system design |
Pinout & Package
XC2VP20-7FG676C uses a 676-ball fine-pitch wire-bond BGA (FG676) with 1.0 mm pitch, 26 mm × 26 mm body size, and Pb-free option (FGG676). Pin definitions are documented across 302 pages in DS083 Module 4, covering ball assignments for configuration, JTAG, PowerPC debug, RocketIO reference clocks, and SelectIO-Ultra banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master serial or SelectMAP programming |
| DONE | Configuration Status Output | Signals completion of bitstream loading and initiates device startup sequence |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant testing, debugging, and partial reconfiguration |
| PPC405_0_DBGRQ/DBGRSP | PowerPC Debug Request/Response | Supports real-time hardware debug of first PowerPC core via dedicated JTAG path |
| MGTREFCLK0_P/N | RocketIO Reference Clock Input | Provides low-jitter clock source for transceiver CDR circuitry; requires external differential oscillator |
| IO_LxxN/P_yy_YY | SelectIO-Ultra Bank I/O | Configurable single-ended/differential pins supporting LVDS, SSTL-2, HSTL, and DCI termination per bank |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables symmetric multiprocessing or asymmetric task partitioning with shared memory via CoreConnect bus |
| Eight RocketIO Transceivers | Delivers 20 Gb/s aggregate full-duplex bandwidth for backplane interconnect without external SERDES chips |
| Digitally Controlled Impedance (DCI) | Eliminates external termination resistors for single-ended I/O standards like LVCMOS and SSTL, reducing BOM count and layout area |
| Twelve Digital Clock Managers | Allows independent clock domain management for processor, transceiver, and fabric logic with sub-cycle phase alignment |
| SelectIO-Ultra I/O Architecture | Supports 22 single-ended and 10 differential standards-including 840 Mb/s LVDS-with programmable drive strength (2–24 mA) |
| SRAM-Based In-System Configuration | Permits unlimited field updates, partial reconfiguration, and bitstream encryption using Triple-DES keys |
Applications
| Telecom Line Card | Wireless Baseband Processing |
|---|---|
Use Scenario: High-density aggregation card handling OC-48/STM-16 traffic with protocol bridging between SONET and Ethernet. IC Role / Device Role / Timing Role: FPGA fabric implements packet classification and traffic shaping; RocketIO transceivers interface to optical PHY; PowerPC cores run control plane software. Use Value: Integrated transceivers eliminate discrete SERDES, reducing latency and board space; dual PowerPC cores enable concurrent management and real-time monitoring tasks. | Use Scenario: 3G Node-B baseband unit performing channel coding, modulation, and MIMO signal processing. IC Role / Device Role / Timing Role: FPGA fabric executes custom DSP pipelines; PowerPC cores manage RRC layer and transport protocols; SelectIO-Ultra interfaces to ADC/DAC and memory. Use Value: 290 dedicated multipliers accelerate convolutional coding and FFTs; 88 Block RAM modules provide low-latency buffer storage for symbol streams. |
| Industrial Video Switcher | Defense Radar Signal Processor |
Use Scenario: Multi-format broadcast switcher routing HD-SDI, HDMI, and IP video streams with frame synchronization and color correction. IC Role / Device Role / Timing Role: FPGA fabric handles pixel-level timing-critical video processing; RocketIO transceivers carry SMPTE 292M serial digital video; DCMs align video clocks across domains. Use Value: Twelve DCMs enable independent skew compensation for genlock, audio, and metadata clocks; SelectIO-Ultra supports both 1.8 V LVCMOS control and 2.5 V LVDS video I/O. | Use Scenario: AESA radar front-end processing digitized RF samples and executing pulse-Doppler algorithms under harsh environmental conditions. IC Role / Device Role / Timing Role: FPGA fabric performs real-time beamforming and CFAR detection; PowerPC cores handle mission planning and health monitoring; IOBs interface to radiation-hardened ADCs. Use Value: SRAM-based configuration allows remote bitstream updates for algorithm upgrades; DCI eliminates termination resistors on high-speed analog interface traces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP30-7FG676C | 30,816 logic cells, 428 multipliers, 644 I/Os - higher density but same package and speed grade | Required when design exceeds XC2VP20 resource limits while retaining identical footprint and transceiver count | Select if additional CLBs, RAM, or multiplier capacity is needed without changing PCB layout |
| XC2VPX20-7FF672C | Same logic resources but RocketIO X transceivers (6.25 Gb/s), flip-chip FF672 package (672 balls), no DCI support | Suitable for ultra-high-speed serial links where 6.25 Gb/s is mandatory and wire-bond termination is not required | Choose only when RocketIO X performance is essential and migration to flip-chip packaging is acceptable |
Compared with XC2VP20-7FG676C, XC2VP30-7FG676C offers greater logic and I/O headroom within identical mechanical and electrical constraints, while XC2VPX20-7FF672C trades DCI and package compatibility for higher transceiver speed and different interconnect technology - neither is pin-compatible, but both serve adjacent design requirements in the Virtex-II Pro family.
Availability
XC2VP20-7FG676C is available at Aetrix Electronics and suitable for telecom line cards, wireless baseband units, industrial video switchers, and defense radar processors requiring stable component supply and long-term obsolescence management.
Supply support for XC2VP20-7FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family for high-performance system-on-chip applications before its acquisition in 2022.
The Virtex-II Pro product line was engineered to integrate embedded processors and high-speed serial transceivers into programmable logic, targeting communications infrastructure and signal-intensive embedded systems.
FAQ
What is the maximum operating frequency of the PowerPC 405 cores in XC2VP20-7FG676C?
The XC2VP20-7FG676C supports PowerPC 405 cores running at up to 400 MHz in -7 speed grade Commercial devices. This requires adherence to XAPP755 guidelines when both cores operate above 350 MHz. The actual achievable frequency depends on clock routing, voltage stability, and thermal conditions in the final PCB design. XC2VP20-7FG676C documentation confirms this rating applies specifically to the dual-core configuration under specified VCCINT and ambient conditions.
Does XC2VP20-7FG676C support partial reconfiguration?
Yes, XC2VP20-7FG676C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This allows dynamic swapping of functional modules in the FPGA fabric without resetting the entire device or interrupting PowerPC core operation. Implementation requires Xilinx ISE tools and proper floorplanning; XC2VP20-7FG676C's configuration interface (SelectMAP or JTAG) enables targeted bitstream loading to defined reconfigurable regions.
What I/O standards are supported by XC2VP20-7FG676C's SelectIO-Ultra blocks?
XC2VP20-7FG676C supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI, GTL, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Each I/O bank is independently configurable, and Digitally Controlled Impedance (DCI) provides on-chip termination for single-ended standards. XC2VP20-7FG676C's IOB structure also supports DDR input/output registers and built-in differential termination for LVDS and related standards.
Can XC2VP20-7FG676C be used in new designs despite its "Not Recommended For New Designs" status?
XC2VP20-7FG676C is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (2011), indicating it has been superseded by newer families like Virtex-4, Virtex-5, or Kintex. However, Aetrix Electronics maintains inventory and supply chain support for legacy systems requiring replacement or maintenance. XC2VP20-7FG676C remains viable for sustaining engineering, repair, or life-extended deployments where redesign is impractical or cost-prohibitive.
What is the role of the Digital Clock Manager (DCM) in XC2VP20-7FG676C?
The XC2VP20-7FG676C integrates twelve Digital Clock Managers (DCMs) that provide fully digital clock deskewing, frequency synthesis (multiplication/division), and fine-grained phase shifting (±1/256 cycle resolution). Each DCM accepts a single input clock and generates multiple synchronized outputs, enabling precise timing control across PowerPC cores, RocketIO transceivers, and FPGA fabric logic. XC2VP20-7FG676C's DCMs eliminate need for external PLLs and support jitter reduction critical for high-speed serial links and synchronous memory interfaces.
XC2VP20-7FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2320
- Number of Logic Elements/Cells:
- 20880
- Total RAM Bits:
- 1622016
- Number of I/O:
- 404
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC2VP20-7FG676C FAQ
1.How can I place an order for XC2VP20-7FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP20-7FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP20-7FG676C reliable?
The price and inventory of XC2VP20-7FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP20-7FG676C is usually 5 days.
3.What payment methods are accepted for XC2VP20-7FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP20-7FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP20-7FG676C?
XC2VP20-7FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP20-7FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP20-7FG676C?
For technical support, including XC2VP20-7FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP20-7FG676C requirements.
6.How does Aetrix verify that XC2VP20-7FG676C is sourced from the original manufacturer or authorized distributors?
All XC2VP20-7FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP20-7FG676C meets industry standards.
7.What is the process for return or replacement of XC2VP20-7FG676C?
All XC2VP20-7FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP20-7FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP20-7FG676C part is unused and in its original packaging.
Return procedure for XC2VP20-7FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2VP20-7FG676C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

