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AMD XC2VP20-7FG676C

Part No.:
XC2VP20-7FG676C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BGA
Datasheet:
AetrixXC2VP20-7FG676C.pdf
Description:
IC FPGA 404 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,021

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Product details

Overview

XC2VP20-7FG676C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond FG676 package), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in a 676-pin fine-pitch BGA. It targets high-bandwidth telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP20-7FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC 405 core support at up to 400 MHz, RocketIO transceiver compatibility with Fibre Channel and Gigabit Ethernet, DCM-based clock deskew and phase shifting, and SelectIO-Ultra I/O supporting LVDS, SSTL, and DCI termination.

Technical Context

The XC2VP20-7FG676C implements a hybrid architecture combining hard IP blocks (dual PowerPC 405 cores, eight RocketIO transceivers) with programmable FPGA fabric based on 0.13 µm copper process. Its RocketIO transceivers operate at 2.5 Gb/s in the FG676 wire-bond package and support 8B/10B encoding, channel bonding, and programmable pre-emphasis.

Each PowerPC 405 block includes 16 KB instruction and 16 KB data caches, MMU with 64-entry TLB, and OCM interface for low-latency memory access. The FPGA fabric delivers 20,880 logic cells, 290 18×18 multipliers, 88 Block SelectRAM+ modules (18 Kb each), and twelve DCMs enabling precise clock de-skew, frequency synthesis, and ±1/256-cycle phase adjustment.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells20,880 - determines maximum combinational/sequential logic capacity for custom RTL implementation
PowerPC Cores2 × PowerPC 405 - enables dual-core embedded software execution with cache, MMU, and OCM support
RocketIO Transceivers8 × 2.5 Gb/s - provides full-duplex serial links compatible with Fibre Channel, Gigabit Ethernet, and XAUI
Digital Clock Managers12 × DCM - supports clock de-skew, multiplication/division, and fine-grained phase shifting (±1/256 cycle)
User I/O Pins564 - supports high-pin-count parallel buses and multiple differential standards including LVDS and SSTL
Block RAM88 × 18 Kb SelectRAM+ - delivers 1,584 KB true dual-port RAM for buffering, FIFOs, and lookup tables
Multiplier Blocks290 × 18×18 - accelerates DSP operations such as FIR filtering and FFT without consuming LUT resources
Core Voltage1.5 V VCCINT - defines power delivery requirements and thermal management constraints for system design

Pinout & Package

XC2VP20-7FG676C uses a 676-ball fine-pitch wire-bond BGA (FG676) with 1.0 mm pitch, 26 mm × 26 mm body size, and Pb-free option (FGG676). Pin definitions are documented across 302 pages in DS083 Module 4, covering ball assignments for configuration, JTAG, PowerPC debug, RocketIO reference clocks, and SelectIO-Ultra banks.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration Clock InputDrives internal configuration shift register during master serial or SelectMAP programming
DONEConfiguration Status OutputSignals completion of bitstream loading and initiates device startup sequence
TCK/TMS/TDI/TDOJTAG Boundary-Scan InterfaceEnables IEEE 1149.1-compliant testing, debugging, and partial reconfiguration
PPC405_0_DBGRQ/DBGRSPPowerPC Debug Request/ResponseSupports real-time hardware debug of first PowerPC core via dedicated JTAG path
MGTREFCLK0_P/NRocketIO Reference Clock InputProvides low-jitter clock source for transceiver CDR circuitry; requires external differential oscillator
IO_LxxN/P_yy_YYSelectIO-Ultra Bank I/OConfigurable single-ended/differential pins supporting LVDS, SSTL-2, HSTL, and DCI termination per bank

Key Features

FeatureDesign Value
Dual PowerPC 405 CoresEnables symmetric multiprocessing or asymmetric task partitioning with shared memory via CoreConnect bus
Eight RocketIO TransceiversDelivers 20 Gb/s aggregate full-duplex bandwidth for backplane interconnect without external SERDES chips
Digitally Controlled Impedance (DCI)Eliminates external termination resistors for single-ended I/O standards like LVCMOS and SSTL, reducing BOM count and layout area
Twelve Digital Clock ManagersAllows independent clock domain management for processor, transceiver, and fabric logic with sub-cycle phase alignment
SelectIO-Ultra I/O ArchitectureSupports 22 single-ended and 10 differential standards-including 840 Mb/s LVDS-with programmable drive strength (2–24 mA)
SRAM-Based In-System ConfigurationPermits unlimited field updates, partial reconfiguration, and bitstream encryption using Triple-DES keys

Applications

Telecom Line CardWireless Baseband Processing

Use Scenario: High-density aggregation card handling OC-48/STM-16 traffic with protocol bridging between SONET and Ethernet.

IC Role / Device Role / Timing Role: FPGA fabric implements packet classification and traffic shaping; RocketIO transceivers interface to optical PHY; PowerPC cores run control plane software.

Use Value: Integrated transceivers eliminate discrete SERDES, reducing latency and board space; dual PowerPC cores enable concurrent management and real-time monitoring tasks.

Use Scenario: 3G Node-B baseband unit performing channel coding, modulation, and MIMO signal processing.

IC Role / Device Role / Timing Role: FPGA fabric executes custom DSP pipelines; PowerPC cores manage RRC layer and transport protocols; SelectIO-Ultra interfaces to ADC/DAC and memory.

Use Value: 290 dedicated multipliers accelerate convolutional coding and FFTs; 88 Block RAM modules provide low-latency buffer storage for symbol streams.

Industrial Video SwitcherDefense Radar Signal Processor

Use Scenario: Multi-format broadcast switcher routing HD-SDI, HDMI, and IP video streams with frame synchronization and color correction.

IC Role / Device Role / Timing Role: FPGA fabric handles pixel-level timing-critical video processing; RocketIO transceivers carry SMPTE 292M serial digital video; DCMs align video clocks across domains.

Use Value: Twelve DCMs enable independent skew compensation for genlock, audio, and metadata clocks; SelectIO-Ultra supports both 1.8 V LVCMOS control and 2.5 V LVDS video I/O.

Use Scenario: AESA radar front-end processing digitized RF samples and executing pulse-Doppler algorithms under harsh environmental conditions.

IC Role / Device Role / Timing Role: FPGA fabric performs real-time beamforming and CFAR detection; PowerPC cores handle mission planning and health monitoring; IOBs interface to radiation-hardened ADCs.

Use Value: SRAM-based configuration allows remote bitstream updates for algorithm upgrades; DCI eliminates termination resistors on high-speed analog interface traces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC2VP30-7FG676C30,816 logic cells, 428 multipliers, 644 I/Os - higher density but same package and speed gradeRequired when design exceeds XC2VP20 resource limits while retaining identical footprint and transceiver countSelect if additional CLBs, RAM, or multiplier capacity is needed without changing PCB layout
XC2VPX20-7FF672CSame logic resources but RocketIO X transceivers (6.25 Gb/s), flip-chip FF672 package (672 balls), no DCI supportSuitable for ultra-high-speed serial links where 6.25 Gb/s is mandatory and wire-bond termination is not requiredChoose only when RocketIO X performance is essential and migration to flip-chip packaging is acceptable

Compared with XC2VP20-7FG676C, XC2VP30-7FG676C offers greater logic and I/O headroom within identical mechanical and electrical constraints, while XC2VPX20-7FF672C trades DCI and package compatibility for higher transceiver speed and different interconnect technology - neither is pin-compatible, but both serve adjacent design requirements in the Virtex-II Pro family.

Availability

XC2VP20-7FG676C is available at Aetrix Electronics and suitable for telecom line cards, wireless baseband units, industrial video switchers, and defense radar processors requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP20-7FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family for high-performance system-on-chip applications before its acquisition in 2022.

The Virtex-II Pro product line was engineered to integrate embedded processors and high-speed serial transceivers into programmable logic, targeting communications infrastructure and signal-intensive embedded systems.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP20-7FG676C?

The XC2VP20-7FG676C supports PowerPC 405 cores running at up to 400 MHz in -7 speed grade Commercial devices. This requires adherence to XAPP755 guidelines when both cores operate above 350 MHz. The actual achievable frequency depends on clock routing, voltage stability, and thermal conditions in the final PCB design. XC2VP20-7FG676C documentation confirms this rating applies specifically to the dual-core configuration under specified VCCINT and ambient conditions.

Does XC2VP20-7FG676C support partial reconfiguration?

Yes, XC2VP20-7FG676C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This allows dynamic swapping of functional modules in the FPGA fabric without resetting the entire device or interrupting PowerPC core operation. Implementation requires Xilinx ISE tools and proper floorplanning; XC2VP20-7FG676C's configuration interface (SelectMAP or JTAG) enables targeted bitstream loading to defined reconfigurable regions.

What I/O standards are supported by XC2VP20-7FG676C's SelectIO-Ultra blocks?

XC2VP20-7FG676C supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI, GTL, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Each I/O bank is independently configurable, and Digitally Controlled Impedance (DCI) provides on-chip termination for single-ended standards. XC2VP20-7FG676C's IOB structure also supports DDR input/output registers and built-in differential termination for LVDS and related standards.

Can XC2VP20-7FG676C be used in new designs despite its "Not Recommended For New Designs" status?

XC2VP20-7FG676C is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (2011), indicating it has been superseded by newer families like Virtex-4, Virtex-5, or Kintex. However, Aetrix Electronics maintains inventory and supply chain support for legacy systems requiring replacement or maintenance. XC2VP20-7FG676C remains viable for sustaining engineering, repair, or life-extended deployments where redesign is impractical or cost-prohibitive.

What is the role of the Digital Clock Manager (DCM) in XC2VP20-7FG676C?

The XC2VP20-7FG676C integrates twelve Digital Clock Managers (DCMs) that provide fully digital clock deskewing, frequency synthesis (multiplication/division), and fine-grained phase shifting (±1/256 cycle resolution). Each DCM accepts a single input clock and generates multiple synchronized outputs, enabling precise timing control across PowerPC cores, RocketIO transceivers, and FPGA fabric logic. XC2VP20-7FG676C's DCMs eliminate need for external PLLs and support jitter reduction critical for high-speed serial links and synchronous memory interfaces.

XC2VP20-7FG676C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II Pro
Package/Case:
676-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
2320
Number of Logic Elements/Cells:
20880
Total RAM Bits:
1622016
Number of I/O:
404
Number of Gates:
-
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FBGA (27x27)

XC2VP20-7FG676C FAQ

1.How can I place an order for XC2VP20-7FG676C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2VP20-7FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2VP20-7FG676C reliable?

The price and inventory of XC2VP20-7FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP20-7FG676C is usually 5 days.

3.What payment methods are accepted for XC2VP20-7FG676C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP20-7FG676C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2VP20-7FG676C?

XC2VP20-7FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2VP20-7FG676C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2VP20-7FG676C?

For technical support, including XC2VP20-7FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP20-7FG676C requirements.

6.How does Aetrix verify that XC2VP20-7FG676C is sourced from the original manufacturer or authorized distributors?

All XC2VP20-7FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP20-7FG676C meets industry standards.

7.What is the process for return or replacement of XC2VP20-7FG676C?

All XC2VP20-7FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP20-7FG676C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2VP20-7FG676C part is unused and in its original packaging.

Return procedure for XC2VP20-7FG676C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2VP20-7FG676C Tags

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