AMD XC2VP20-7FGG676C

Overview

XC2VP20-7FGG676C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond packages), 20,880 logic cells, twelve Digital Clock Managers (DCMs), and 564 user I/Os in a 676-pin Fine-Pitch BGA (FGG676) package. It targets high-performance telecom, networking, and video processing systems requiring embedded processing and serial interconnect.

For engineers reviewing the XC2VP20-7FGG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, transceiver timing limits, DCM phase-shift resolution, I/O standard support (LVDS, SSTL, HSTL), and confirmed alternative FPGAs for legacy system maintenance and redesign.

Technical Context

The XC2VP20-7FGG676C implements a dual-processor SoC-FPGA architecture with two independent PowerPC 405 cores running up to 400 MHz (at -7 speed grade), each backed by 16 KB instruction and 16 KB data caches plus MMU support. Its eight RocketIO transceivers operate at 2.5 Gb/s in the FGG676 wire-bond package, with monolithic CDR, 8B/10B encoding, and per-channel loopback.

Logic fabric includes 9,280 CLB slices, 290 dedicated 18×18 multipliers, 88 Block SelectRAM+ modules (18 Kb each), and twelve DCMs offering ±1/256-cycle fine phase shift, frequency synthesis, and deskew. I/O subsystem supports 22 single-ended and 10 differential standards-including LVDS at 840 Mb/s-with Digitally Controlled Impedance (DCI) termination.

Key Specifications

Pinout & Package

XC2VP20-7FGG676C uses a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.0 mm pitch, wire-bond interconnect, and Pb-free construction. Pin functions are defined across four quadrants with dedicated configuration, JTAG, clock, MGT, and I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP20-7FGG676C, XC2VP30-7FF896C offers scalable logic and transceiver count but demands new thermal and layout design; XC3S1600E-4FGG456C sacrifices embedded processing and serial I/O for lower cost and power, limiting use to simpler control tasks.

Availability

XC2VP20-7FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial automation systems requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP20-7FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, adaptive SoC, and ACAP solutions since 1984.

The Virtex-II Pro family was designed to integrate hard processor subsystems and high-speed serial transceivers into a single FPGA die, targeting high-end communications and signal processing applications before the advent of modern RFSoCs.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP20-7FGG676C?

The XC2VP20-7FGG676C supports PowerPC 405 cores running up to 400 MHz under commercial -7 speed grade conditions. This assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-processor timing closure. The actual achievable frequency depends on clock routing, cache hit rate, and bus contention in the final design. XC2VP20-7FGG676C documentation confirms this limit in Table 4 of DS083 v5.0.

Does XC2VP20-7FGG676C support LVDS I/O at full data rates?

Yes, XC2VP20-7FGG676C supports LVDS I/O with 840 Mb/s data rates using its SelectIO-Ultra technology. Each differential pair uses dedicated current-mode drivers and on-chip 100 Ω termination. Performance is validated in DS083 Module 3, with timing parameters specified for source-synchronous interfaces. XC2VP20-7FGG676C requires proper PCB layout (controlled impedance, length matching) to maintain signal integrity at these speeds.

Can XC2VP20-7FGG676C be configured via JTAG boundary scan?

Yes, XC2VP20-7FGG676C fully supports IEEE 1149.1 JTAG boundary-scan configuration through TCK, TMS, TDI, and TDO pins. It implements EXTEST, INTEST, and HIGHZ instructions, enabling in-system programming, verification, and debug. Configuration bitstream loading via JTAG is documented in DS083 Module 1 and supported by Xilinx iMPACT tools. XC2VP20-7FGG676C also allows partial reconfiguration and readback through this interface.

What is the purpose of the VRP and VRN pins on XC2VP20-7FGG676C?

The VRP and VRN pins on XC2VP20-7FGG676C provide reference voltages for Digitally Controlled Impedance (DCI) termination in single-ended I/O banks. VRP is typically tied to VCCO/2 and VRN to ground, allowing the FPGA to auto-calibrate output driver impedance to match the PCB trace characteristic impedance (e.g., 50 Ω). This eliminates external termination resistors and improves signal integrity. XC2VP20-7FGG676C requires stable, low-noise references for accurate DCI operation.

Is XC2VP20-7FGG676C recommended for new designs?

No, XC2VP20-7FGG676C is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). It remains available for legacy system repair, obsolescence mitigation, and long-life industrial deployments, but Xilinx recommends Virtex-4, Virtex-5, or newer families for new projects. Aetrix Electronics maintains traceable inventory and lifecycle coordination specifically for XC2VP20-7FGG676C to support ongoing maintenance needs.