AMD XC2VP2-5FFG672C

Overview

XC2VP2-5FFG672C from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (600 Mb/s to 3.125 Gb/s), and no embedded PowerPC processor block. It uses a 0.13 µm copper process, 1.5 V core supply, and supports SelectIO-Ultra I/O standards including LVDS, SSTL, and HSTL. It targets high-speed serial interconnect in telecom and datacom equipment requiring deterministic timing and reconfigurable logic.

For engineers reviewing the XC2VP2-5FFG672C datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (3.125 Gb/s transceiver max), FFG672 flip-chip BGA package (672-pin, 1.0 mm pitch), 204 user I/Os, and absence of PowerPC blocks - distinguishing it from higher-density Virtex-II Pro variants.

Technical Context

The XC2VP2-5FFG672C implements a hard SERDES-based RocketIO transceiver architecture with monolithic clock recovery (CDR), programmable pre-emphasis (4 levels), and 8B/10B encoding. Its transceivers operate at up to 3.125 Gb/s full-duplex with internal 50 Ω termination and per-channel loopback for validation.

FPGA fabric includes Configurable Logic Blocks (CLBs) with dual 4-input LUTs and flip-flops per slice, 18 × 18-bit dedicated multipliers, 12 Block SelectRAM+ modules (18 Kb each), and 4 Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and deskew - all routed via Active Interconnect Technology with predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2VP2-5FFG672C is housed in a 672-ball flip-chip fine-pitch BGA (FFG672) package with 1.0 mm ball pitch, optimized for signal integrity and thermal dissipation in high-density applications. Pin definitions are documented across 302 pages in DS083 Module 4, covering ball assignments, I/O standards per bank, configuration pins (e.g., CCLK, DONE, M[0:2]), JTAG TAP signals, and dedicated transceiver differential pairs (RX/TX).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based serial interconnect applications.

Compared with XC2VP2-5FFG672C, XC2VP4-5FF672C adds processor capability and logic capacity at identical package and transceiver count, while XC3S1000-4FGG456C eliminates transceivers entirely - making it unsuitable for serial protocol bridging but viable for simpler control logic with lower BOM cost.

Availability

XC2VP2-5FFG672C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, medical imaging subsystems, and defense radar signal processing requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP2-5FFG672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGAs, adaptive SoCs, and AI inference acceleration platforms.

The Virtex-II Pro family was designed for high-performance, reconfigurable system-on-chip solutions integrating serial transceivers and embedded processors - targeting applications where ASIC flexibility is needed without mask costs or long lead times.

FAQ

What is the maximum data rate supported by the RocketIO transceivers in XC2VP2-5FFG672C?

The XC2VP2-5FFG672C supports RocketIO transceivers rated up to 3.125 Gb/s full-duplex per channel, compliant with Gigabit Ethernet, Fibre Channel, and XAUI standards. This rating applies specifically to the -5 speed grade under commercial temperature conditions and is validated in DS083 Table 4. The XC2VP2-5FFG672C does not include RocketIO X transceivers, which are limited to higher-density variants like XC2VPX20.

Does XC2VP2-5FFG672C include an embedded PowerPC processor block?

No, XC2VP2-5FFG672C contains zero PowerPC 405 processor blocks, as confirmed in Table 1 of DS083. It is the smallest member of the Virtex-II Pro family and omits the processor to reduce cost and complexity. For designs requiring embedded RISC processing, XC2VP4-5FF672C (1 PPC405) or XC2VP7-5FFG676C (1 PPC405) are verified alternatives with identical transceiver count.

What package type and pin count does XC2VP2-5FFG672C use?

XC2VP2-5FFG672C uses the FFG672 flip-chip fine-pitch BGA package with 672 solder balls and 1.0 mm pitch. Per Table 3 in DS083, this package delivers 204 user I/Os for the XC2VP2 device. The "FF" prefix denotes flip-chip construction, which provides superior thermal performance and signal integrity compared to wire-bond alternatives like FG676.

Can XC2VP2-5FFG672C be configured via JTAG boundary scan?

Yes, XC2VP2-5FFG672C fully supports IEEE 1149.1 boundary-scan testing and configuration through its dedicated TCK, TMS, TDI, and TDO pins. The device implements a standard Test Access Port (TAP) controller enabling bitstream loading, readback, and real-time debugging - as detailed in Module 1 Section "Boundary Scan" of DS083. This capability is integral to the XC2VP2-5FFG672C's production test and field update workflow.

Is XC2VP2-5FFG672C recommended for new designs?

No, XC2VP2-5FFG672C is marked "Product Not Recommended For New Designs" in DS083 (v5.0, June 2011). While fully functional and supported for legacy program continuity, Xilinx advises new projects to evaluate modern alternatives such as Kintex-7 or Versal ACAP families for improved power efficiency, higher transceiver speeds, and updated toolchain support. Aetrix Electronics maintains inventory and lifecycle coordination for ongoing production of XC2VP2-5FFG672C.