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AMD XC2VP2-5FG256I

Part No.:
XC2VP2-5FG256I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BGA
Datasheet:
AetrixXC2VP2-5FG256I.pdf
Description:
IC FPGA 140 I/O 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,826

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Product details

Overview

XC2VP2-5FG256I from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (2.5 Gb/s max), and no embedded PowerPC processor block. It uses a 0.13 µm copper process, 1.5 V core supply, and supports SelectIO-Ultra I/O standards including LVDS, SSTL, and HSTL. It targets high-speed serial interconnect in telecom and networking equipment where moderate logic density and transceiver capability are required.

For engineers reviewing the XC2VP2-5FG256I datasheet, pinout, applications, or equivalent options, key selection considerations include its -5 speed grade (300 MHz PowerPC clock limit, 2.5 Gb/s transceiver rate), FG256 wire-bond BGA package (256 balls, 1.0 mm pitch), 204 user I/Os, and absence of embedded processor blocks - distinguishing it from higher-density Virtex-II Pro variants.

Technical Context

The XC2VP2-5FG256I implements a SRAM-based, in-system reprogrammable architecture with Configurable Logic Blocks (CLBs), 18 Kb Block SelectRAM+ memory modules, and dedicated 18×18-bit multipliers. Its Digital Clock Manager (DCM) provides phase shifting, frequency synthesis, and deskew for up to 12 global clocks.

It integrates four RocketIO transceivers supporting full-duplex operation at 600 Mb/s to 2.5 Gb/s (per channel), 8/16/32-bit parallel FPGA interface, 8B/10B encoding, and on-chip 50 Ω termination. The IOBs support DCI-controlled impedance matching and DDR/LVDS signaling, but lack PowerPC 405 cores - confirming its role as a transceiver-enhanced logic fabric without embedded processing.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Cells 3,168 - determines maximum combinational/sequential logic capacity for custom RTL implementation
RocketIO Transceivers 4 × 2.5 Gb/s - enables four independent high-speed serial links (e.g., Gigabit Ethernet, XAUI)
User I/O Pads 204 - supports wide parallel buses, memory interfaces, or multi-standard I/O with programmable drive strength
Block RAM 12 × 18 Kb SelectRAM+ - provides 216 KB of true dual-port embedded memory for FIFOs, buffers, or lookup tables
Digital Clock Managers 4 DCMs - deliver jitter-tolerant clock synthesis, phase alignment, and frequency multiplication/division
Multiplier Blocks 12 × 18×18-bit - accelerates DSP operations such as FIR filtering and FFT computation
Core Voltage 1.5 V VCCINT - defines power delivery requirements and thermal management constraints

Pinout & Package

XC2VP2-5FG256I is housed in a 256-ball Fine-Pitch Ball Grid Array (FG256) package with 1.0 mm ball pitch, wire-bond interconnect, and industrial temperature rating (–40°C to +100°C). Pin definitions follow Xilinx DS083 Module 4, with dedicated configuration, JTAG, clock, and transceiver differential pairs.

Pin/Terminal Circuit Role Design Meaning
CCLK Configuration Clock Input Drives internal configuration shift register during master serial or SelectMAP programming
DONE Configuration Status Output Signals completion of bitstream loading and initiates device startup sequence
TCK/TMS/TDI/TDO JTAG Boundary-Scan Interface Enables IEEE 1149.1-compliant testing, debugging, and partial reconfiguration
DXP/DXN RocketIO Differential Transmitter High-speed serial output pair (LVDS-compatible) supporting 2.5 Gb/s per channel
DRP/DRN RocketIO Differential Receiver High-speed serial input pair with on-chip 50 Ω termination and programmable equalization
VCCO_0–VCCO_5 I/O Bank Supply Independent 1.5–3.3 V supplies per I/O bank enable mixed-voltage interface design

Key Features

Feature Design Value
SelectIO-Ultra I/O Technology Supports 22 single-ended (LVCMOS, SSTL, HSTL) and 10 differential (LVDS, BLVDS, LVPECL) standards with programmable drive strength (2–24 mA)
Digitally Controlled Impedance (DCI) On-die series/parallel termination eliminates external resistors and ensures signal integrity across voltage/temperature variations
RocketIO Transceivers Four 2.5 Gb/s full-duplex channels with 8B/10B encoding, channel bonding, and internal loopback for protocol-agnostic serial link development
Active Interconnect Routing Predictable timing with fourth-generation segmented routing; delay independent of fanout for deterministic high-speed design
SRAM-Based Configuration Unlimited reprogramming, partial reconfiguration, and DES-encrypted bitstream support for secure field updates

Applications

Telecom Line Card Interface Industrial Protocol Gateway

Use Scenario: Aggregating multiple T1/E1 or STM-1 streams into a backplane using time-division multiplexing.

IC Role / Device Role / Timing Role: FPGA fabric implements TDM switch logic; RocketIO transceivers serialize/deserialize data to/from optical modules.

Use Value: 204 I/Os accommodate parallel bus interfaces to framer ICs, while 4×2.5 Gb/s transceivers support OC-3/STM-1 line rates without external SERDES.

Use Scenario: Bridging Modbus RTU over RS-485 to EtherNet/IP via embedded TCP/IP stack running on external microcontroller.

IC Role / Device Role / Timing Role: XC2VP2-5FG256I acts as protocol translation engine and physical layer adapter, managing timing-critical UART-to-FPGA handshaking and packet buffering.

Use Value: SelectIO-Ultra supports both 5 V-tolerant RS-485 drivers and 3.3 V Ethernet PHY interfaces; DCI ensures robust signal integrity across noisy factory environments.

Medical Imaging Data Link Test Equipment High-Speed Trigger

Use Scenario: Transmitting real-time ultrasound echo data from ADC array to host PC via fiber-optic link.

IC Role / Device Role / Timing Role: FPGA captures parallel ADC outputs, applies beamforming logic, and serializes data via RocketIO for low-latency transmission.

Use Value: 12×18 Kb Block RAM buffers raw image frames; 2.5 Gb/s transceivers meet 1.25 Gb/s minimum payload requirement for uncompressed 12-bit 40 MSPS data.

Use Scenario: Synchronizing multiple PXI chassis using ultra-low-jitter trigger distribution across backplane slots.

IC Role / Device Role / Timing Role: XC2VP2-5FG256I generates and distributes precisely timed trigger pulses using DCM-controlled outputs and LVDS I/Os.

Use Value: Four DCMs enable sub-nanosecond skew control across 204 I/Os; LVDS outputs ensure <100 ps edge jitter for deterministic multi-instrument triggering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic + transceiver applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2VP4-5FG456I 6,768 logic cells, 1× PowerPC 405 core, 4 RocketIO transceivers, 348 I/Os, FG456 package Supports embedded software-defined radio baseband processing; requires larger PCB footprint Select when integrated soft-core processor and >3× logic capacity are needed without upgrading to XC2VP7
XC2VP7-5FF672I 11,088 logic cells, 1× PowerPC 405, 8 RocketIO transceivers, 396 I/Os, FF672 flip-chip BGA Enables dual-channel 10Gbps XAUI interfaces; requires different PCB stack-up and thermal management Choose for higher transceiver count and logic density where FG256 package size or cost must be balanced against performance scaling

Compared with XC2VP2-5FG256I, XC2VP4-5FG456I adds processor capability and logic headroom at modest I/O and package size increase, while XC2VP7-5FF672I doubles transceiver count and logic resources but mandates flip-chip assembly and higher power delivery complexity - making XC2VP2-5FG256I optimal for cost-sensitive, space-constrained serial interface bridging.

Availability

XC2VP2-5FG256I is available at Aetrix Electronics and suitable for telecom line card interface, industrial protocol gateway, medical imaging data link, and test equipment high-speed trigger applications requiring stable component supply across extended lifecycle planning.

Supply support for XC2VP2-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-II Pro family was designed for high-performance system integration requiring embedded serial transceivers and flexible logic fabric - targeting telecom infrastructure, video processing, and high-speed data acquisition where ASIC-like bandwidth meets FPGA-level reconfigurability.

FAQ

What is the maximum transceiver data rate supported by XC2VP2-5FG256I?

XC2VP2-5FG256I supports RocketIO transceivers rated up to 2.5 Gb/s per channel in the -5 speed grade. This is confirmed in DS083 Table 4 for wire-bond packages (FG256/FGG256) and applies to all four transceiver blocks on the device. The rate is fixed per speed grade and cannot be increased via configuration or external circuitry.

Does XC2VP2-5FG256I include an embedded PowerPC processor core?

No, XC2VP2-5FG256I does not contain a PowerPC 405 processor block. As shown in Table 1 of DS083, only XC2VP4 and higher Virtex-II Pro devices integrate PowerPC cores. XC2VP2-5FG256I is optimized for pure logic + transceiver applications, eliminating processor-related power, area, and toolchain overhead.

What I/O standards are supported by XC2VP2-5FG256I's SelectIO-Ultra blocks?

XC2VP2-5FG256I supports 22 single-ended standards (including LVTTL, LVCMOS 1.5/1.8/2.5/3.3 V, PCI-X, GTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, HSTL, SSTL). DCI enables automatic on-die termination for all single-ended standards, and on-chip differential termination is available for LVDS, ULVDS, and LDT.

Is XC2VP2-5FG256I suitable for new designs?

No - XC2VP2-5FG256I is marked "Product Not Recommended For New Designs" in DS083 (v5.0, June 2011). It remains available for legacy support and obsolescence management, but Xilinx recommends Virtex-4, Virtex-5, or newer families for new projects due to enhanced performance, lower power, and ongoing toolchain support.

What configuration modes does XC2VP2-5FG256I support?

XC2VP2-5FG256I supports slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan configuration modes. Bitstream encryption via triple-DES is optional. Configuration is SRAM-based, enabling unlimited reprogramming and partial reconfiguration without hardware changes to the XC2VP2-5FG256I device itself.

XC2VP2-5FG256I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II Pro
Package/Case:
256-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Total RAM Bits:
221184
Number of I/O:
140
Number of Gates:
-
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FBGA (17x17)

XC2VP2-5FG256I FAQ

1.How can I place an order for XC2VP2-5FG256I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2VP2-5FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2VP2-5FG256I reliable?

The price and inventory of XC2VP2-5FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP2-5FG256I is usually 5 days.

3.What payment methods are accepted for XC2VP2-5FG256I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP2-5FG256I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2VP2-5FG256I?

XC2VP2-5FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2VP2-5FG256I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2VP2-5FG256I?

For technical support, including XC2VP2-5FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP2-5FG256I requirements.

6.How does Aetrix verify that XC2VP2-5FG256I is sourced from the original manufacturer or authorized distributors?

All XC2VP2-5FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP2-5FG256I meets industry standards.

7.What is the process for return or replacement of XC2VP2-5FG256I?

All XC2VP2-5FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP2-5FG256I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2VP2-5FG256I part is unused and in its original packaging.

Return procedure for XC2VP2-5FG256I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2VP2-5FG256I Tags

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