AMD XC2VP2-5FG256I
- Part No.:
- XC2VP2-5FG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2VP2-5FG256I.pdf
- Description:
- IC FPGA 140 I/O 256FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC2VP2-5FG256I from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (2.5 Gb/s max), and no embedded PowerPC processor block. It uses a 0.13 µm copper process, 1.5 V core supply, and supports SelectIO-Ultra I/O standards including LVDS, SSTL, and HSTL. It targets high-speed serial interconnect in telecom and networking equipment where moderate logic density and transceiver capability are required.
For engineers reviewing the XC2VP2-5FG256I datasheet, pinout, applications, or equivalent options, key selection considerations include its -5 speed grade (300 MHz PowerPC clock limit, 2.5 Gb/s transceiver rate), FG256 wire-bond BGA package (256 balls, 1.0 mm pitch), 204 user I/Os, and absence of embedded processor blocks - distinguishing it from higher-density Virtex-II Pro variants.
Technical Context
The XC2VP2-5FG256I implements a SRAM-based, in-system reprogrammable architecture with Configurable Logic Blocks (CLBs), 18 Kb Block SelectRAM+ memory modules, and dedicated 18×18-bit multipliers. Its Digital Clock Manager (DCM) provides phase shifting, frequency synthesis, and deskew for up to 12 global clocks.
It integrates four RocketIO transceivers supporting full-duplex operation at 600 Mb/s to 2.5 Gb/s (per channel), 8/16/32-bit parallel FPGA interface, 8B/10B encoding, and on-chip 50 Ω termination. The IOBs support DCI-controlled impedance matching and DDR/LVDS signaling, but lack PowerPC 405 cores - confirming its role as a transceiver-enhanced logic fabric without embedded processing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,168 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| RocketIO Transceivers | 4 × 2.5 Gb/s - enables four independent high-speed serial links (e.g., Gigabit Ethernet, XAUI) |
| User I/O Pads | 204 - supports wide parallel buses, memory interfaces, or multi-standard I/O with programmable drive strength |
| Block RAM | 12 × 18 Kb SelectRAM+ - provides 216 KB of true dual-port embedded memory for FIFOs, buffers, or lookup tables |
| Digital Clock Managers | 4 DCMs - deliver jitter-tolerant clock synthesis, phase alignment, and frequency multiplication/division |
| Multiplier Blocks | 12 × 18×18-bit - accelerates DSP operations such as FIR filtering and FFT computation |
| Core Voltage | 1.5 V VCCINT - defines power delivery requirements and thermal management constraints |
Pinout & Package
XC2VP2-5FG256I is housed in a 256-ball Fine-Pitch Ball Grid Array (FG256) package with 1.0 mm ball pitch, wire-bond interconnect, and industrial temperature rating (–40°C to +100°C). Pin definitions follow Xilinx DS083 Module 4, with dedicated configuration, JTAG, clock, and transceiver differential pairs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master serial or SelectMAP programming |
| DONE | Configuration Status Output | Signals completion of bitstream loading and initiates device startup sequence |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant testing, debugging, and partial reconfiguration |
| DXP/DXN | RocketIO Differential Transmitter | High-speed serial output pair (LVDS-compatible) supporting 2.5 Gb/s per channel |
| DRP/DRN | RocketIO Differential Receiver | High-speed serial input pair with on-chip 50 Ω termination and programmable equalization |
| VCCO_0–VCCO_5 | I/O Bank Supply | Independent 1.5–3.3 V supplies per I/O bank enable mixed-voltage interface design |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO-Ultra I/O Technology | Supports 22 single-ended (LVCMOS, SSTL, HSTL) and 10 differential (LVDS, BLVDS, LVPECL) standards with programmable drive strength (2–24 mA) |
| Digitally Controlled Impedance (DCI) | On-die series/parallel termination eliminates external resistors and ensures signal integrity across voltage/temperature variations |
| RocketIO Transceivers | Four 2.5 Gb/s full-duplex channels with 8B/10B encoding, channel bonding, and internal loopback for protocol-agnostic serial link development |
| Active Interconnect Routing | Predictable timing with fourth-generation segmented routing; delay independent of fanout for deterministic high-speed design |
| SRAM-Based Configuration | Unlimited reprogramming, partial reconfiguration, and DES-encrypted bitstream support for secure field updates |
Applications
| Telecom Line Card Interface | Industrial Protocol Gateway |
|---|---|
Use Scenario: Aggregating multiple T1/E1 or STM-1 streams into a backplane using time-division multiplexing. IC Role / Device Role / Timing Role: FPGA fabric implements TDM switch logic; RocketIO transceivers serialize/deserialize data to/from optical modules. Use Value: 204 I/Os accommodate parallel bus interfaces to framer ICs, while 4×2.5 Gb/s transceivers support OC-3/STM-1 line rates without external SERDES. |
Use Scenario: Bridging Modbus RTU over RS-485 to EtherNet/IP via embedded TCP/IP stack running on external microcontroller. IC Role / Device Role / Timing Role: XC2VP2-5FG256I acts as protocol translation engine and physical layer adapter, managing timing-critical UART-to-FPGA handshaking and packet buffering. Use Value: SelectIO-Ultra supports both 5 V-tolerant RS-485 drivers and 3.3 V Ethernet PHY interfaces; DCI ensures robust signal integrity across noisy factory environments. |
| Medical Imaging Data Link | Test Equipment High-Speed Trigger |
Use Scenario: Transmitting real-time ultrasound echo data from ADC array to host PC via fiber-optic link. IC Role / Device Role / Timing Role: FPGA captures parallel ADC outputs, applies beamforming logic, and serializes data via RocketIO for low-latency transmission. Use Value: 12×18 Kb Block RAM buffers raw image frames; 2.5 Gb/s transceivers meet 1.25 Gb/s minimum payload requirement for uncompressed 12-bit 40 MSPS data. |
Use Scenario: Synchronizing multiple PXI chassis using ultra-low-jitter trigger distribution across backplane slots. IC Role / Device Role / Timing Role: XC2VP2-5FG256I generates and distributes precisely timed trigger pulses using DCM-controlled outputs and LVDS I/Os. Use Value: Four DCMs enable sub-nanosecond skew control across 204 I/Os; LVDS outputs ensure <100 ps edge jitter for deterministic multi-instrument triggering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic + transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP4-5FG456I | 6,768 logic cells, 1× PowerPC 405 core, 4 RocketIO transceivers, 348 I/Os, FG456 package | Supports embedded software-defined radio baseband processing; requires larger PCB footprint | Select when integrated soft-core processor and >3× logic capacity are needed without upgrading to XC2VP7 |
| XC2VP7-5FF672I | 11,088 logic cells, 1× PowerPC 405, 8 RocketIO transceivers, 396 I/Os, FF672 flip-chip BGA | Enables dual-channel 10Gbps XAUI interfaces; requires different PCB stack-up and thermal management | Choose for higher transceiver count and logic density where FG256 package size or cost must be balanced against performance scaling |
Compared with XC2VP2-5FG256I, XC2VP4-5FG456I adds processor capability and logic headroom at modest I/O and package size increase, while XC2VP7-5FF672I doubles transceiver count and logic resources but mandates flip-chip assembly and higher power delivery complexity - making XC2VP2-5FG256I optimal for cost-sensitive, space-constrained serial interface bridging.
Availability
XC2VP2-5FG256I is available at Aetrix Electronics and suitable for telecom line card interface, industrial protocol gateway, medical imaging data link, and test equipment high-speed trigger applications requiring stable component supply across extended lifecycle planning.
Supply support for XC2VP2-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex-II Pro family was designed for high-performance system integration requiring embedded serial transceivers and flexible logic fabric - targeting telecom infrastructure, video processing, and high-speed data acquisition where ASIC-like bandwidth meets FPGA-level reconfigurability.
FAQ
What is the maximum transceiver data rate supported by XC2VP2-5FG256I?
XC2VP2-5FG256I supports RocketIO transceivers rated up to 2.5 Gb/s per channel in the -5 speed grade. This is confirmed in DS083 Table 4 for wire-bond packages (FG256/FGG256) and applies to all four transceiver blocks on the device. The rate is fixed per speed grade and cannot be increased via configuration or external circuitry.
Does XC2VP2-5FG256I include an embedded PowerPC processor core?
No, XC2VP2-5FG256I does not contain a PowerPC 405 processor block. As shown in Table 1 of DS083, only XC2VP4 and higher Virtex-II Pro devices integrate PowerPC cores. XC2VP2-5FG256I is optimized for pure logic + transceiver applications, eliminating processor-related power, area, and toolchain overhead.
What I/O standards are supported by XC2VP2-5FG256I's SelectIO-Ultra blocks?
XC2VP2-5FG256I supports 22 single-ended standards (including LVTTL, LVCMOS 1.5/1.8/2.5/3.3 V, PCI-X, GTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, HSTL, SSTL). DCI enables automatic on-die termination for all single-ended standards, and on-chip differential termination is available for LVDS, ULVDS, and LDT.
Is XC2VP2-5FG256I suitable for new designs?
No - XC2VP2-5FG256I is marked "Product Not Recommended For New Designs" in DS083 (v5.0, June 2011). It remains available for legacy support and obsolescence management, but Xilinx recommends Virtex-4, Virtex-5, or newer families for new projects due to enhanced performance, lower power, and ongoing toolchain support.
What configuration modes does XC2VP2-5FG256I support?
XC2VP2-5FG256I supports slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan configuration modes. Bitstream encryption via triple-DES is optional. Configuration is SRAM-based, enabling unlimited reprogramming and partial reconfiguration without hardware changes to the XC2VP2-5FG256I device itself.
XC2VP2-5FG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 352
- Number of Logic Elements/Cells:
- 3168
- Total RAM Bits:
- 221184
- Number of I/O:
- 140
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2VP2-5FG256I FAQ
1.How can I place an order for XC2VP2-5FG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP2-5FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP2-5FG256I reliable?
The price and inventory of XC2VP2-5FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP2-5FG256I is usually 5 days.
3.What payment methods are accepted for XC2VP2-5FG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP2-5FG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP2-5FG256I?
XC2VP2-5FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP2-5FG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP2-5FG256I?
For technical support, including XC2VP2-5FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP2-5FG256I requirements.
6.How does Aetrix verify that XC2VP2-5FG256I is sourced from the original manufacturer or authorized distributors?
All XC2VP2-5FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP2-5FG256I meets industry standards.
7.What is the process for return or replacement of XC2VP2-5FG256I?
All XC2VP2-5FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP2-5FG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP2-5FG256I part is unused and in its original packaging.
Return procedure for XC2VP2-5FG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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