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AMD XC2VP2-5FG456C
- Part No.:
- XC2VP2-5FG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2VP2-5FG456C.pdf
- Description:
- IC FPGA 156 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,232
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Product details
Overview
XC2VP2-5FG456C from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (up to 2.5 Gb/s per channel), and no embedded PowerPC processor block. It uses a 0.13 µm copper process with 1.5 V core voltage and is packaged in a 456-pin fine-pitch wire-bond BGA (FG456) with 156 user I/Os. It targets high-speed serial interconnect applications in telecom and networking equipment.
For engineers reviewing the XC2VP2-5FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed grade (-5), I/O count (156), CLB resources (1,408 slices), DCM availability (4 units), and compatibility with SelectIO-Ultra standards including LVDS and PCI-X.
Technical Context
The XC2VP2-5FG456C implements a SRAM-based, in-system reprogrammable architecture with Active Interconnect routing, Digitally Controlled Impedance (DCI) I/O, and four Digital Clock Managers (DCMs) supporting precise clock de-skew, frequency synthesis, and phase shifting. Its 4 RocketIO transceivers operate at up to 2.5 Gb/s in wire-bond packages and support 8B/10B encoding, channel bonding, and programmable pre-emphasis.
It contains 12 18×18-bit multipliers, 12 Block SelectRAM+ modules (each 18 Kb), and 216 Kb of distributed RAM. The FG456 package supports 156 user I/Os across 22 single-ended and 10 differential I/O standards, with programmable drive strength (2–24 mA) and on-chip termination for LVDS, SSTL, and HSTL.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,168 - defines total combinational + sequential logic capacity for HDL synthesis |
| CLB Slices | 1,408 - determines maximum number of independent LUT+FF pairs for logic mapping |
| RocketIO Transceivers | 4 × up to 2.5 Gb/s - enables four independent high-speed serial links (e.g., Gigabit Ethernet, XAUI) |
| Digital Clock Managers (DCMs) | 4 - provides independent clock deskew, multiplication/division, and ±180° phase shift per domain |
| User I/O Pins | 156 - supports mixed-voltage interfaces including LVDS, SSTL-2, HSTL, and PCI-X |
| Block RAM (18 Kb) | 12 × 18 Kb = 216 Kb - delivers true dual-port memory for FIFOs, buffers, or coefficient storage |
| Multipliers (18×18) | 12 - accelerates DSP operations such as FIR filtering and FFT without consuming LUT resources |
Pinout & Package
XC2VP2-5FG456C is housed in a 456-ball fine-pitch wire-bond BGA (FG456) with 1.0 mm pitch, 23 mm × 23 mm body size, and RoHS-compliant Pb-free option (FGG456). The package supports 156 user I/Os plus dedicated configuration, clock, and power pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during master serial or SelectMAP programming |
| DONE | Configuration Status Output | Signals completion of bitstream loading; must be pulled high externally to release I/Os |
| M0–M2 | Mode Selection Inputs | Set configuration mode (e.g., slave serial, master SelectMAP) at power-up |
| PROG_B | Program Initiate Input | Active-low signal that resets configuration memory and initiates reconfiguration |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant testing, debugging, and partial reconfiguration |
| VRP/VRN | DCI Reference Pins | Provide external 50 Ω reference resistor connection for on-chip impedance calibration |
| GCLK0–GCLK15 | Global Clock Inputs | Feed dedicated low-skew clock networks to DCMs and synchronous logic domains |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-based in-system configuration | Enables unlimited field reprogramming and partial reconfiguration without hardware change |
| SelectIO-Ultra I/O technology | Supports 22 single-ended and 10 differential standards (LVDS, SSTL, HSTL) with programmable drive strength |
| Digitally Controlled Impedance (DCI) | Automatically calibrates on-die series/parallel termination to match trace impedance (50 Ω/75 Ω) |
| RocketIO transceivers (4 × 2.5 Gb/s) | Integrates SERDES, CDR, 8B/10B encode/decode, and channel bonding-eliminates need for external PHY ICs |
| Dual-port Block SelectRAM+ (12 × 18 Kb) | Provides true dual-clock, dual-port memory blocks with read-during-write capability for pipeline buffering |
Applications
| Wireless Baseband Processing | Gigabit Ethernet Line Cards |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding in 3G/LTE remote radio heads. IC Role / Device Role / Timing Role: FPGA fabric implements custom DSP pipelines; RocketIO transceivers interface with RFICs via CPRI or OBSAI serial links. Use Value: 4 × 2.5 Gb/s transceivers meet CPRI v4.1 line rates; 12 multipliers accelerate convolutional/Viterbi decoding with deterministic latency. | Use Scenario: Aggregation of eight 1 GbE ports into a backplane switch fabric using XAUI or SGMII. IC Role / Device Role / Timing Role: Acts as media access controller (MAC) and physical layer bridge; RocketIO handles serial lane aggregation. Use Value: 156 I/Os support parallel GMII interfaces; DCMs synchronize multiple clock domains (125 MHz, 250 MHz, 312.5 MHz) with sub-100 ps skew. |
| Medical Imaging Data Acquisition | Industrial Machine Vision Controllers |
Use Scenario: High-fidelity ultrasound beamforming where ADC samples are streamed from 64+ channels at 40 MSPS. IC Role / Device Role / Timing Role: Configurable logic processes time-aligned sample streams; Block RAM buffers frame data before compression. Use Value: 216 Kb of true dual-port RAM enables simultaneous acquisition and readout; LVDS I/Os interface directly with high-speed ADCs (e.g., AD9272). | Use Scenario: Real-time defect detection on PCB assembly lines using multi-camera synchronized image capture and FPGA-accelerated CNN inference. IC Role / Device Role / Timing Role: Coordinates camera triggers, pixel data ingestion via Camera Link or CoaXPress, and edge-AI preprocessing. Use Value: SelectIO-Ultra supports 840 Mb/s LVDS for Camera Link Base; 12 multipliers accelerate Sobel/edge kernels without external DSP. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based serial interconnect applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP4-5FG456C | 6,768 logic cells, 1 PowerPC 405 core, 4 RocketIO, 248 user I/Os | Supports embedded software control of transceivers and real-time protocol stack offload | Select when system requires soft CPU for management firmware alongside FPGA datapath |
| XC3S1600E-4FG456C | No transceivers, 16,000 logic cells, Spartan-3E architecture, 304 I/Os, 1.2 V core | Lacks high-speed serial I/O; suited for cost-sensitive parallel bus bridging or control logic only | Choose only if serial transceivers are unnecessary and budget constraints outweigh performance needs |
Compared with XC2VP2-5FG456C, XC2VP4-5FG456C adds embedded processing capability and higher logic density at identical package and transceiver count, while XC3S1600E-4FG456C trades transceiver functionality for lower cost and higher I/O count in non-serial applications.
Availability
XC2VP2-5FG456C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial imaging, and high-speed test equipment requiring stable component supply and long-term obsolescence management.
Supply support for XC2VP2-5FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic and adaptive computing, delivering FPGAs, SoCs, and ACAPs for aerospace, defense, communications, and industrial markets.
The Virtex-II Pro family was designed for high-performance system integration, combining FPGA fabric with hard IP (RocketIO transceivers) to replace discrete PHY+FPGA solutions in telecom and datacom equipment.
FAQ
What is the maximum data rate supported by the RocketIO transceivers in XC2VP2-5FG456C?
The XC2VP2-5FG456C supports RocketIO transceivers rated up to 2.5 Gb/s in wire-bond packages like FG456. This is confirmed in DS083 Table 4 for -5 speed grade devices. The transceivers comply with Gigabit Ethernet, Fibre Channel, and XAUI standards. XC2VP2-5FG456C does not include RocketIO X cores, which are limited to XC2VPX20/XC2VPX70 variants.
Does XC2VP2-5FG456C include an embedded PowerPC processor?
No, XC2VP2-5FG456C contains zero PowerPC 405 processor blocks. Per Table 1 in DS083, only XC2VP4 and higher Virtex-II Pro devices integrate one or two PowerPC cores. XC2VP2-5FG456C is optimized for pure logic and serial I/O applications without embedded software execution requirements.
What I/O standards are supported by XC2VP2-5FG456C?
XC2VP2-5FG456C supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI-X, GTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, HSTL, SSTL). On-chip DCI enables automatic impedance matching, and dedicated termination is provided for LVDS and other differential protocols.
How many Digital Clock Managers (DCMs) does XC2VP2-5FG456C have?
XC2VP2-5FG456C integrates 4 Digital Clock Managers (DCMs), as specified in Table 1 of DS083. Each DCM provides fully digital clock deskewing, frequency synthesis (integer/fractional multiplication/division), and coarse/fine phase shifting - critical for synchronizing multi-domain designs in telecom and imaging systems using XC2VP2-5FG456C.
Is XC2VP2-5FG456C recommended for new designs?
No - XC2VP2-5FG456C is marked "Product Not Recommended For New Designs" in the official DS083 datasheet (v5.0, June 2011). It remains available for legacy support, repair, and obsolescence management, but Xilinx recommends Virtex-4, Virtex-5, or newer families for new development due to process, density, and feature improvements.
XC2VP2-5FG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 352
- Number of Logic Elements/Cells:
- 3168
- Total RAM Bits:
- 221184
- Number of I/O:
- 156
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2VP2-5FG456C FAQ
1.How can I place an order for XC2VP2-5FG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP2-5FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP2-5FG456C reliable?
The price and inventory of XC2VP2-5FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP2-5FG456C is usually 5 days.
3.What payment methods are accepted for XC2VP2-5FG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP2-5FG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP2-5FG456C?
XC2VP2-5FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP2-5FG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP2-5FG456C?
For technical support, including XC2VP2-5FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP2-5FG456C requirements.
6.How does Aetrix verify that XC2VP2-5FG456C is sourced from the original manufacturer or authorized distributors?
All XC2VP2-5FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP2-5FG456C meets industry standards.
7.What is the process for return or replacement of XC2VP2-5FG456C?
All XC2VP2-5FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP2-5FG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP2-5FG456C part is unused and in its original packaging.
Return procedure for XC2VP2-5FG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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