AMD XC2VP2-5FGG256C

Overview

XC2VP2-5FGG256C from Xilinx is a Virtex-II Pro platform FPGA with 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (2.5 Gb/s max), and no embedded PowerPC processor block. It features 204 user I/Os in a 256-ball fine-pitch wire-bond BGA package (1.0 mm pitch), supporting LVDS, SSTL, HSTL, and PCI-X I/O standards. It targets high-speed serial interconnect applications in telecom and datacom systems where transceiver density and I/O flexibility are critical.

For engineers reviewing the XC2VP2-5FGG256C datasheet, pinout, applications, or equivalent options, key selection considerations include its -5 speed grade (2.5 Gb/s transceiver operation), absence of PowerPC cores, 1.5 V core voltage, and compatibility with SelectIO-Ultra and Digitally Controlled Impedance (DCI) I/O termination schemes.

Technical Context

The XC2VP2-5FGG256C implements a SRAM-based configurable logic architecture built on a 0.13 µm nine-layer copper process, with dedicated 18 × 18-bit multipliers, 12 Block SelectRAM+ modules (18 Kb each), and up to twelve Digital Clock Managers (DCMs) for precise clock synthesis and phase shifting. Its routing uses Active Interconnect Technology with hierarchical, predictable delay paths independent of fanout.

It integrates four RocketIO transceiver cores supporting full-duplex operation at up to 2.5 Gb/s per channel (speed grade -5), with 8/16/32-bit parallel FPGA interface, 8B/10B encoding, on-chip 50 Ω/75 Ω termination, and programmable pre-emphasis. No PowerPC 405 block is present - distinguishing it from larger Virtex-II Pro variants.

Key Specifications

Pinout & Package

XC2VP2-5FGG256C is housed in a 256-ball Fine-Pitch Ball Grid Array (FGG256) package with 1.0 mm pitch, wire-bond interconnect, and Pb-free construction. The package supports 204 user I/Os plus dedicated configuration, clock, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based serial interface applications.

Compared with XC2VP2-5FGG256C, XC2VP4-5FGG456C adds processor capability and logic resources but shares identical transceiver speed and architecture; XC3S1600E-4FGG456C offers greater I/O and lower cost but lacks any serial transceiver support, requiring external PHYs for high-speed links.

Availability

XC2VP2-5FGG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial data acquisition, protocol bridging, and legacy system upgrades requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP2-5FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with integrated hard IP and system-level platforms.

The Virtex-II Pro family was designed for high-performance, system-on-a-chip implementations combining FPGA fabric, multi-gigabit transceivers, and embedded processors - targeting demanding applications in networking, wireless infrastructure, and video processing.

FAQ

What is the maximum RocketIO transceiver data rate supported by XC2VP2-5FGG256C?

The XC2VP2-5FGG256C supports RocketIO transceivers operating at up to 2.5 Gb/s per channel, consistent with its -5 speed grade rating. This applies to both transmit and receive directions in full-duplex mode. The transceivers are compatible with standards including Gigabit Ethernet, Fibre Channel, and XAUI. Performance is validated under commercial temperature conditions per DS083 specifications.

Does XC2VP2-5FGG256C include an embedded PowerPC processor core?

No, XC2VP2-5FGG256C does not contain a PowerPC 405 processor block. According to Table 1 in DS083, only Virtex-II Pro devices starting from XC2VP4 and above integrate one or two PowerPC cores. The XC2VP2 variant is optimized for pure logic and transceiver-intensive applications without embedded processing overhead.

What package type and pin count does XC2VP2-5FGG256C use?

XC2VP2-5FGG256C uses the FGG256 package: a 256-ball fine-pitch wire-bond BGA with 1.0 mm pitch and Pb-free construction. It provides 204 user I/O pins plus dedicated configuration, clock, power, and JTAG pins. Pin definitions and ball map are documented in Module 4 of DS083, specifically for the FGG256 variant.

Can XC2VP2-5FGG256C be configured via JTAG boundary scan?

Yes, XC2VP2-5FGG256C supports IEEE 1149.1-compliant JTAG boundary-scan configuration using TCK, TMS, TDI, and TDO pins. It implements standard instructions including EXTEST, INTEST, SAMPLE, and BYPASS. JTAG mode enables in-system programming, verification, and debug access without requiring dedicated configuration memory or external controllers.

What I/O standards are supported by XC2VP2-5FGG256C's SelectIO-Ultra blocks?

XC2VP2-5FGG256C supports 22 single-ended I/O standards (including LVTTL, LVCMOS at 1.5/1.8/2.5/3.3 V, PCI-X, GTL, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). On-chip Digitally Controlled Impedance (DCI) provides automatic termination for single-ended standards, while on-chip differential termination is available for LVDS and related protocols.