AMD XC2VP2-5FGG256I

Overview

XC2VP2-5FGG256I from Xilinx is a Virtex-II Pro platform FPGA with 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (600 Mb/s to 3.125 Gb/s), and no embedded PowerPC processor block. It features 204 user I/Os in a 256-pin fine-pitch wire-bond BGA (FGG256) package, 12 DCM clock management units, and supports LVDS, SSTL, HSTL, and PCI-compliant I/O standards. It is used in legacy telecom line-card interfaces requiring serial backplane connectivity and reconfigurable logic.

For engineers reviewing the XC2VP2-5FGG256I datasheet, pinout, applications, or equivalent options, key selection considerations include its -5 speed grade (300 MHz PowerPC max, 2.0 Gb/s RocketIO max for wire-bond), FGG256 package I/O count (204), DCI-enabled single-ended termination, and absence of embedded processor cores - distinguishing it from higher-density Virtex-II Pro variants.

Technical Context

The XC2VP2-5FGG256I implements a SRAM-based, 0.13 µm nine-layer copper FPGA architecture with Active Interconnect routing, SelectIO-Ultra I/O banks supporting 22 single-ended and 10 differential standards, and Digitally Controlled Impedance (DCI) for on-die termination. Its 4 RocketIO transceivers operate at up to 3.125 Gb/s (speed grade -5), with monolithic CDR, 8/16/32-bit parallel interface, and 8B/10B encoding.

It contains 1,408 CLB slices (each with two 4-LUTs + flip-flops), 44 18×18 multipliers, 12 Block SelectRAM+ modules (18 Kb each), and 12 Digital Clock Managers enabling precise deskew, frequency synthesis, and ±180° phase shifting. Core voltage is 1.5 V (VCCINT), with dedicated 2.5 V VCCAUX and programmable VCCO per bank.

Key Specifications

Pinout & Package

XC2VP2-5FGG256I uses a 256-ball fine-pitch wire-bond BGA (FGG256) package with 1.0 mm pitch, 17 mm × 17 mm body size, and Pb-free construction. Pin definitions follow Xilinx DS083 Module 4, with dedicated configuration (M0/M1/M2, PROG_B, CCLK, DONE), JTAG (TCK/TMS/TDI/TDO), and power (VCCINT, VCCAUX, VCCO, GND) terminals distributed across the array.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based serial interface applications.

Compared with XC2VP2-5FGG256I, XC2VP4-5FGG456I adds processor capability and I/O headroom at higher cost and power, while XC3S1000-4FGG320C offers gate-equivalent logic without transceivers - making XC2VP2-5FGG256I the optimal balance of integrated serial I/O, logic density, and industrial temperature support for mid-range backplane designs.

Availability

XC2VP2-5FGG256I is available at Aetrix Electronics and suitable for telecom infrastructure upgrades, industrial protocol gateways, and legacy test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP2-5FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-II Pro family was designed for high-performance, system-level integration in telecommunications, networking, and video infrastructure - combining FPGA fabric with embedded multi-gigabit transceivers and processor blocks before the advent of modern RFSoCs.

FAQ

What is the maximum RocketIO transceiver data rate supported by XC2VP2-5FGG256I?

The XC2VP2-5FGG256I supports RocketIO transceivers up to 3.125 Gb/s in theory, but its -5 speed grade limits guaranteed operation to 2.0 Gb/s for wire-bond packages like FGG256. This rating is validated per DS083 Table 4 and applies under industrial temperature conditions (–40°C to +85°C). The XC2VP2-5FGG256I does not contain RocketIO X transceivers, which are exclusive to Virtex-II Pro X devices.

Does XC2VP2-5FGG256I include an embedded PowerPC processor core?

No, XC2VP2-5FGG256I does not include any PowerPC processor block. As confirmed in DS083 Table 1, only Virtex-II Pro devices starting from XC2VP4 and above integrate one or two PowerPC 405 cores. The XC2VP2-5FGG256I is optimized for pure programmable logic and serial I/O applications without embedded processing requirements.

What I/O standards are supported by XC2VP2-5FGG256I's SelectIO-Ultra banks?

XC2VP2-5FGG256I supports 22 single-ended standards (including LVTTL, LVCMOS at 1.5 V/1.8 V/2.5 V/3.3 V, PCI, PCI-X, GTL, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Each I/O bank is independently configurable for voltage and standard, and Digitally Controlled Impedance (DCI) provides on-die termination for all supported single-ended interfaces.

Is XC2VP2-5FGG256I suitable for industrial temperature operation?

Yes, XC2VP2-5FGG256I is rated for industrial temperature range (–40°C to +85°C), as indicated by the "I" suffix in its part number. Its -5 speed grade guarantees timing closure for RocketIO transceivers up to 2.0 Gb/s and FPGA fabric operation at 300 MHz under these conditions, per DS083 Table 4 and Module 3 electrical specifications.

What configuration modes are supported by XC2VP2-5FGG256I?

XC2VP2-5FGG256I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is performed via dedicated pins (CCLK, DIN/DOUT, PROG_B, M0–M2, DONE), and bitstream security is available via optional triple-DES encryption using the on-chip decryptor.