AMD XC2VP2-5FGG456C

Overview

XC2VP2-5FGG456C from Xilinx is a Virtex-II Pro platform FPGA with 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (2.5 Gb/s max), and no embedded PowerPC processor block. It features 12 DCMs, 216 I/O pins in a 456-ball fine-pitch BGA (FGG456), and supports LVDS, SSTL, HSTL, and PCI-X I/O standards for high-speed serial and parallel interface design in telecom backplane and video processing systems.

For engineers reviewing the XC2VP2-5FGG456C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, package-specific I/O count, transceiver performance limits, clock management specs, and real-world implementation constraints - all grounded in DS083 (v5.0) June 2011 official documentation.

Technical Context

The XC2VP2-5FGG456C implements a SRAM-based, 0.13 µm nine-layer copper FPGA fabric with Active Interconnect routing, SelectIO-Ultra I/O banks supporting 22 single-ended and 10 differential standards, and Digitally Controlled Impedance (DCI) for on-die termination. Its 4 RocketIO transceivers operate at up to 2.5 Gb/s in wire-bond packages and support 8B/10B encoding, channel bonding (2–20 channels), and programmable pre-emphasis.

It contains 1,408 CLB slices (each with two 4-LUTs + flip-flops), 44 18×18 multipliers, 12 × 18-Kb Block SelectRAM+ modules (216 Kb total), and 12 Digital Clock Managers offering ±1° phase shift resolution, frequency synthesis, and deskew. No PowerPC 405 core is present - distinguishing it from XC2VP4 and higher variants.

Key Specifications

Pinout & Package

XC2VP2-5FGG456C uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 1.0 mm pitch, Pb-free construction, and wire-bond interconnect. Package dimensions are 23 mm × 23 mm. It supports industrial temperature range (–40°C to +100°C) and includes 15 dedicated configuration/control pins (e.g., CCLK, DONE, PROG_B, TCK/TMS/TDI/TDO).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and logic acceleration applications.

Compared with XC2VP2-5FGG456C, XC2VP4-5FGG456C adds embedded processing capability at higher logic density and I/O count, while XC3S1600E-4FGG456C trades transceivers for greater LUT capacity and lower power - making each suitable for distinct architectural partitions in system-level FPGA selection.

Availability

XC2VP2-5FGG456C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial gateways, and test instrumentation requiring stable component supply across extended lifecycle programs.

Supply support for XC2VP2-5FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered SRAM-based FPGAs and platform architectures integrating hard IP.

The Virtex-II Pro family was designed for high-performance system integration - combining FPGA fabric, multi-gigabit transceivers, and embedded processors to replace ASICs in networking, wireless, and video applications.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP2-5FGG456C?

The XC2VP2-5FGG456C supports RocketIO transceivers up to 2.5 Gb/s in wire-bond packages like FGG456, as specified in Table 4 of DS083 (v5.0). This limit arises from package parasitics and I/O driver strength - not silicon capability - and applies regardless of speed grade (-5, -6, or -7). The XC2VP2-5FGG456C does not include RocketIO X cores, which are exclusive to Virtex-II Pro X devices such as XC2VPX20.

Does XC2VP2-5FGG456C include an embedded PowerPC processor?

No, XC2VP2-5FGG456C does not contain a PowerPC 405 processor block. Per Table 1 in DS083 (v5.0), only XC2VP4 and higher Virtex-II Pro devices integrate PowerPC cores. The XC2VP2-5FGG456C is optimized for logic-intensive, transceiver-assisted applications where soft-core processors (e.g., MicroBlaze) or external controllers manage system control.

How many user I/O pins does XC2VP2-5FGG456C have in the FGG456 package?

XC2VP2-5FGG456C provides 156 user I/O pins in the FGG456 package, as confirmed in Table 3 of DS083 (v5.0). This count excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B, etc.), VBATT, and RocketIO transceiver pins. All 156 are fully programmable for single-ended or differential signaling per bank voltage settings.

What clock management resources are available in XC2VP2-5FGG456C?

XC2VP2-5FGG456C integrates 12 Digital Clock Managers (DCMs), each supporting input jitter filtering, frequency synthesis (integer/fractional multiplication/division), phase shifting (±1° resolution), and deskew. These DCMs drive 16 global clock multiplexer buffers, enabling robust multi-domain clock distribution - critical for synchronizing RocketIO transceivers, DDR interfaces, and logic fabric in XC2VP2-5FGG456C designs.

Is XC2VP2-5FGG456C suitable for new designs?

No - XC2VP2-5FGG456C is marked "Product Not Recommended For New Designs" in DS083 (v5.0). Xilinx discontinued Virtex-II Pro production in 2011; the device remains available for legacy support and obsolescence management, but new designs should target 7-series, UltraScale, or Versal families for long-term supply, toolchain support, and enhanced features like PCIe Gen3/4, hardened ARM cores, and AI engines.