AMD XC2VP2-6FF672C

Overview

XC2VP2-6FF672C from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (up to 3.125 Gb/s), and no embedded PowerPC processor block. It uses a 0.13 µm nine-layer copper process with 1.5 V core voltage and is packaged in a 672-pin flip-chip fine-pitch BGA (FF672) supporting 204 user I/Os. It targets high-speed serial interconnect applications in telecom and datacom systems.

For engineers reviewing the XC2VP2-6FF672C datasheet, pinout, applications, or equivalent options, key selection considerations include its -6 speed grade timing performance, FF672 package I/O count and thermal profile, RocketIO transceiver compliance with Fibre Channel and Gigabit Ethernet, and absence of PowerPC blocks for pure programmable logic + SERDES use cases.

Technical Context

The XC2VP2-6FF672C implements a SRAM-based, in-system reconfigurable architecture with Configurable Logic Blocks (CLBs), 18 × 18-bit dedicated multipliers, and 12 Block SelectRAM+ modules (18 Kb each). Its 4 RocketIO transceivers operate at up to 3.125 Gb/s full-duplex with monolithic clock recovery, 8B/10B encoding, and on-chip 50 Ω termination.

Digital Clock Manager (DCM) modules provide precise clock de-skew, frequency synthesis, and phase shifting; SelectIO-Ultra I/O supports 22 single-ended and 10 differential standards including LVDS at 840 Mb/s, with Digitally Controlled Impedance (DCI) for on-die termination.

Key Specifications

Pinout & Package

XC2VP2-6FF672C is housed in a 672-ball flip-chip fine-pitch BGA (FF672) with 1.0 mm pitch, optimized for thermal dissipation and signal integrity in high-speed serial applications. The package supports 204 user-configurable I/Os plus dedicated configuration, clock, and transceiver pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based serial interconnect applications.

Compared with XC2VP4-6FF672C, XC2VP2-6FF672C offers lower gate count and no processor-ideal for lean, latency-critical SERDES bridging. Versus XC3S1600E-4FG456C, it delivers integrated 3.125 Gb/s transceivers but at higher unit cost and legacy process node.

Availability

XC2VP2-6FF672C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video transport, test equipment data acquisition, and Gigabit Ethernet switch fabric applications requiring stable component supply across extended product lifecycles.

Supply support for XC2VP2-6FF672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-performance FPGAs for demanding system-level integration.

The Virtex-II Pro product line was engineered to unify FPGA fabric, high-speed serial transceivers, and embedded processors-targeting communications, networking, and DSP applications where flexibility and bandwidth converge.

FAQ

What is the maximum data rate supported by the RocketIO transceivers in XC2VP2-6FF672C?

The XC2VP2-6FF672C integrates 4 RocketIO multi-gigabit transceivers, each capable of full-duplex operation up to 3.125 Gb/s. This rate complies with Fibre Channel, Gigabit Ethernet, and XAUI standards. The -6 speed grade ensures timing closure for transceiver logic at this rate under commercial temperature conditions.

Does XC2VP2-6FF672C include an embedded PowerPC processor core?

No, XC2VP2-6FF672C does not contain a PowerPC 405 processor block. Per Table 1 in DS083, only devices starting from XC2VP4 and above include one or two PowerPC blocks. XC2VP2-6FF672C is optimized for pure programmable logic and serial transceiver functionality without embedded processing overhead.

What package type and pin count does XC2VP2-6FF672C use?

XC2VP2-6FF672C uses the FF672 flip-chip fine-pitch BGA package with 672 balls and 1.0 mm pitch. It provides 204 user I/O pads, as confirmed in Table 3 of DS083. This package supports superior thermal performance and signal integrity for high-speed serial applications compared to wire-bond alternatives.

Can XC2VP2-6FF672C be configured via JTAG, and what standard does it follow?

Yes, XC2VP2-6FF672C supports IEEE 1149.1-compliant boundary-scan configuration via JTAG pins (TCK, TMS, TDI, TDO, and TDO). It also supports IEEE 1532 for in-system programming. The JTAG interface enables programming, debugging, and verification without requiring dedicated configuration memory or microcontroller boot code.

Is XC2VP2-6FF672C recommended for new designs, and what is its lifecycle status?

No-XC2VP2-6FF672C is marked "Product Not Recommended For New Designs" per DS083 (v5.0, June 2011). It remains available for legacy support and obsolescence management, but Xilinx recommends Virtex-4, Virtex-5, or newer families for new projects due to improved density, power efficiency, and transceiver capabilities.