AMD XC2VP2-6FF672I

Overview

XC2VP2-6FF672I from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, four RocketIO multi-gigabit transceivers (600 Mb/s to 3.125 Gb/s), and no embedded PowerPC processor block. It uses a 0.13 µm nine-layer copper process, operates with 1.5 V core voltage (VCCINT), and is packaged in a 672-pin flip-chip fine-pitch BGA (FF672) with 204 user I/Os. It targets high-speed serial interconnect applications in telecom and datacom systems.

For engineers reviewing the XC2VP2-6FF672I datasheet, pinout, applications, or equivalent options, key selection considerations include its -6 speed grade timing performance, FF672 package I/O count and thermal profile, RocketIO transceiver compliance with Fibre Channel and Gigabit Ethernet, and absence of PowerPC cores-making it suitable for pure programmable logic + SERDES designs requiring deterministic latency and low-power serial interface integration.

Technical Context

The XC2VP2-6FF672I implements a SRAM-based, in-system reconfigurable architecture with Active Interconnect routing, SelectIO-Ultra I/O banks supporting LVDS, SSTL, HSTL, and PCI-X, and Digitally Controlled Impedance (DCI) for on-die termination. Its four RocketIO transceivers operate at up to 3.125 Gb/s full-duplex with 8B/10B encoding, channel bonding support, and monolithic CDR-enabling direct interface to XAUI, InfiniBand, and 10G Fibre Channel PHY layers without external clock recovery ICs.

Digital Clock Manager (DCM) modules provide jitter-tolerant clock synthesis, phase shifting (±180° in 1/256-step resolution), and deskew across 16 global clock nets. The FPGA fabric includes 1,408 CLB slices, 44 18×18-bit multipliers, 12 Block SelectRAM+ modules (18 Kb each), and distributed RAM resources-supporting DSP-intensive signal processing and protocol bridging within a single device.

Key Specifications

Pinout & Package

XC2VP2-6FF672I is housed in a 672-ball flip-chip fine-pitch BGA (FF672) with 1.0 mm pitch, optimized for thermal dissipation and high I/O density. The package supports 204 user-configurable I/Os plus dedicated configuration, JTAG, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based serial interface applications.

Compared with XC2VP2-6FF672I, XC2VP4-6FF672I adds embedded processor capability without changing footprint or transceiver count-ideal for hybrid control+data-plane designs-while XC2VP7-6FF676I trades larger package size for doubled transceiver count and 3× logic resources, enabling consolidation of multiple serial protocols onto one die.

Availability

XC2VP2-6FF672I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial data acquisition, and embedded networking applications requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP2-6FF672I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded hard IP and system-level integration.

The Virtex-II Pro family was designed for high-performance, mixed-signal system integration-combining FPGA fabric, multi-gigabit transceivers, and (in higher variants) PowerPC processors to replace discrete ASIC+PHY+processor solutions in telecom and datacom equipment.

FAQ

What is the maximum data rate supported by the RocketIO transceivers in XC2VP2-6FF672I?

The XC2VP2-6FF672I features four RocketIO transceivers rated for full-duplex operation from 600 Mb/s up to 3.125 Gb/s. This range supports standards including Gigabit Ethernet (1.25 Gb/s), Fibre Channel (1.0625 Gb/s), and XAUI (3.125 Gb/s). The -6 speed grade ensures guaranteed timing closure at the upper limit under industrial temperature conditions.

Does XC2VP2-6FF672I include an embedded PowerPC processor core?

No, XC2VP2-6FF672I does not contain a PowerPC processor block. According to Table 1 in DS083 (v5.0), the XC2VP2 variant has zero PowerPC blocks-unlike XC2VP4 and higher members of the Virtex-II Pro family. Its architecture focuses exclusively on programmable logic and serial transceivers, making it optimal for hardware-accelerated, latency-sensitive applications without software control requirements.

What package type and pin count does XC2VP2-6FF672I use?

XC2VP2-6FF672I uses the FF672 flip-chip fine-pitch BGA package with 672 balls and 1.0 mm pitch. It provides 204 user I/O pins, plus dedicated configuration, JTAG, power, and transceiver differential pairs. The FF672 package is thermally optimized for industrial environments and supports higher I/O density than wire-bond alternatives of similar size.

Can XC2VP2-6FF672I be configured via JTAG boundary scan?

Yes, XC2VP2-6FF672I fully supports IEEE 1149.1 boundary-scan testing and configuration via its TCK, TMS, TDI, and TDO pins. The device implements standard BYPASS, EXTEST, INTEST, and SAMPLE instructions, enabling in-circuit testing, programming, and debug access without requiring dedicated configuration pins-critical for system-level validation and field updates.

Is XC2VP2-6FF672I recommended for new designs?

No-XC2VP2-6FF672I is marked "Product Not Recommended For New Designs" in Xilinx documentation (DS083 v5.0, June 2011). It remains available for legacy support, obsolescence mitigation, and repair of installed base systems. New designs should consider modern alternatives such as Kintex-7 or Versal ACAP families, though XC2VP2-6FF672I continues to be stocked and supported by Aetrix Electronics for lifecycle continuity.