AMD XC2VP2-6FFG672C

Overview

XC2VP2-6FFG672C from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (up to 3.125 Gb/s), and no embedded PowerPC processor block. It uses a 0.13 µm copper process, 1.5 V core supply, and supports SelectIO-Ultra I/O standards including LVDS, SSTL, and HSTL. It targets high-speed serial interconnect in telecom and networking equipment.

For engineers reviewing the XC2VP2-6FFG672C datasheet, pinout, applications, or equivalent options, key selection criteria include its FF672 flip-chip BGA package (672 pins), -6 speed grade timing (350 MHz DCM output, 2.5 Gb/s RocketIO), 204 user I/Os, and absence of PowerPC blocks - distinguishing it from higher-density Virtex-II Pro variants.

Technical Context

The XC2VP2-6FFG672C implements a SRAM-based FPGA architecture with Configurable Logic Blocks (CLBs), 18 × 18-bit dedicated multipliers, and 12 Block SelectRAM+ modules (18 Kb each). Its 4 RocketIO transceivers operate at up to 3.125 Gb/s with monolithic clock recovery, 8B/10B encoding, and programmable pre-emphasis.

Digital Clock Manager (DCM) modules provide phase-shifting, frequency synthesis, and deskew compensation across 16 global clock nets. The FF672 flip-chip BGA package enables 204 user I/Os with on-chip digitally controlled impedance (DCI) for single-ended standards and differential termination for LVDS/ULVDS.

Key Specifications

Pinout & Package

XC2VP2-6FFG672C is housed in a 27 mm × 27 mm flip-chip fine-pitch BGA (FF672) with 1.0 mm pitch and 672 balls. Package includes dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B), JTAG TAP signals, 204 user I/Os, 4 RocketIO transceiver pairs (TXP/TXN, RXP/RXN), and power/ground balls distributed for low-noise operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based serial interconnect applications.

Compared with XC2VP2-6FFG672C, XC2VP4-6FF672C adds embedded processing capability at higher logic density but increases power and cost, while XC3S1000-4FG456C sacrifices integrated high-speed serial I/O for lower unit price and simpler power delivery - making it suitable only when external transceiver ICs are acceptable.

Availability

XC2VP2-6FFG672C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial gateways, medical imaging subsystems, and automated test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP2-6FFG672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded hard IP and system-level integration.

The Virtex-II Pro family was designed for high-performance system-on-a-chip implementations requiring integrated serial transceivers and flexible logic fabric - targeting applications where ASIC development cost and time are prohibitive.

FAQ

What is the maximum RocketIO transceiver data rate supported by XC2VP2-6FFG672C?

The XC2VP2-6FFG672C supports RocketIO transceivers operating at up to 3.125 Gb/s in full-duplex mode. This rate is guaranteed for the -6 speed grade under commercial temperature conditions and aligns with Fibre Channel, Gigabit Ethernet, and XAUI protocol requirements. The device does not include RocketIO X cores, so 6.25 Gb/s operation is not supported.

Does XC2VP2-6FFG672C include an embedded PowerPC processor?

No, XC2VP2-6FFG672C does not contain a PowerPC 405 processor block. As confirmed in Table 1 of DS083, the XC2VP2 variant has zero PowerPC blocks - distinguishing it from XC2VP4 and higher-density Virtex-II Pro devices. All processing must be implemented in programmable logic or offloaded to external processors.

What package type and pin count does XC2VP2-6FFG672C use?

XC2VP2-6FFG672C uses the FF672 flip-chip fine-pitch BGA package with 672 balls and 1.0 mm pitch. It provides 204 user I/O pins, plus dedicated configuration, JTAG, and RocketIO transceiver pins. This package enables higher I/O density and better thermal performance than wire-bond alternatives like FG676.

Can XC2VP2-6FFG672C perform on-chip termination for LVDS signals?

Yes, XC2VP2-6FFG672C supports on-chip differential termination for LVDS, ULVDS, and LDT standards. Each differential pair can be configured with internal 100 Ω Thevenin termination, eliminating the need for external 100 Ω resistors and improving signal integrity in high-speed serial links.

Is XC2VP2-6FFG672C recommended for new designs?

No, XC2VP2-6FFG672C is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0. It remains available for legacy support and obsolescence management, but Xilinx recommends Virtex-5 or newer families for new projects due to superior performance, power efficiency, and toolchain support.