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AMD XC2VP2-6FFG672I
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- Part No.:
- XC2VP2-6FFG672I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 672-BBGA, FCBGA
- Datasheet:
-
XC2VP2-6FFG672I.pdf
- Description:
- IC FPGA 204 I/O 672FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,413
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Product details
Overview
XC2VP2-6FFG672I from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (up to 3.125 Gb/s), and no embedded PowerPC processor block. It uses a 0.13 µm nine-layer copper process with 1.5 V core supply, packaged in a 672-pin flip-chip fine-pitch BGA (FFG672) for high-density I/O routing and thermal performance in telecom and networking systems.
For engineers reviewing the XC2VP2-6FFG672I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed grade (-6), CLB resource density, DCM clock management capability, and compatibility with SelectIO-Ultra I/O standards including LVDS and PCI-X.
Technical Context
The XC2VP2-6FFG672I implements a SRAM-based, in-system reprogrammable architecture with Active Interconnect routing, Digital Clock Manager (DCM) modules for phase-shifting and frequency synthesis, and Configurable Logic Blocks (CLBs) containing dual 4-input LUTs and flip-flops per slice. Its IOBs support SDR/DDR registers and Digitally Controlled Impedance (DCI) for on-die termination.
It integrates four RocketIO transceivers compliant with Fibre Channel, Gigabit Ethernet, and XAUI protocols at up to 3.125 Gb/s full-duplex operation, with monolithic CDR, 8B/10B encoding, and programmable pre-emphasis. The device lacks PowerPC blocks and RocketIO X cores, distinguishing it from higher-tier Virtex-II Pro X variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,168 - defines total combinational + sequential logic capacity for HDL synthesis targeting moderate-complexity control and datapath logic |
| RocketIO Transceivers | 4 × full-duplex SERDES - enables four independent high-speed serial links (e.g., quad XAUI or Fibre Channel interfaces) |
| Speed Grade | -6 - guarantees 3.125 Gb/s transceiver operation and 350 MHz PowerPC-equivalent timing margin for fabric logic |
| Digital Clock Managers (DCMs) | 4 - provides deskew, multiplication/division, and fine-grained phase shifting (1/256 period resolution) for internal clock domains |
| User I/O Pads | 204 - supports high-pin-count parallel buses, DDR memory interfaces, and mixed-voltage I/O standards via SelectIO-Ultra |
| Core Voltage (VCCINT) | 1.5 V - requires dedicated low-noise core regulator; impacts static/dynamic power budget and thermal design |
| Block RAM (18 Kb) | 12 × 18 Kb - delivers 216 KB of true dual-port embedded memory for FIFOs, buffers, or lookup tables without external SRAM |
| Multiplier Blocks | 44 × 18×18-bit - accelerates DSP operations such as FIR filtering, correlation, and FFT butterfly stages |
Pinout & Package
XC2VP2-6FFG672I is housed in a 672-ball flip-chip fine-pitch BGA (FFG672) package with 1.0 mm pitch, optimized for signal integrity and thermal dissipation in high-speed PCB layouts. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCAUX (2.5 V), VCCO (configurable I/O voltage), and transceiver reference clocks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master serial or SelectMAP programming; must be stable before PROG_B deassertion |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful bitstream loading and initialization completion |
| M0–M2 | Mode Selection Inputs | Set configuration mode (e.g., slave serial, master SelectMAP) at power-up; latched on PROG_B rising edge |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Support IEEE 1149.1 test access port for programming, debugging, and interconnect verification |
| DXP/DXN | Differential Transceiver Reference | LVDS pair providing clean 100 MHz–312.5 MHz reference clock to RocketIO PLLs; requires controlled impedance routing |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-based in-system configuration | Enables field-upgradable logic functionality and partial reconfiguration without hardware modification |
| SelectIO-Ultra I/O technology | Supports 22 single-ended and 10 differential standards (LVDS, SSTL, HSTL) with programmable drive strength (2–24 mA) |
| Digitally Controlled Impedance (DCI) | Provides on-die series or parallel termination matching trace impedance (e.g., 50 Ω, 75 Ω) without external resistors |
| 18 Kb Block SelectRAM+ memory | Delivers true dual-port synchronous RAM with three read-during-write modes for pipeline buffering and data coalescing |
| Active Interconnect routing | Ensures predictable timing delay independent of fanout, critical for deterministic high-speed digital design |
| Triple-DES bitstream encryption | Protects intellectual property by decrypting encrypted configuration data using on-chip hardware security module |
Applications
| High-Speed Backplane Interface | Protocol-Agnostic Serial Link |
|---|---|
Use Scenario: Implementing a 4-lane XAUI interface between a switch ASIC and line-card FPGAs in a 10 GbE chassis. IC Role / Device Role / Timing Role: XC2VP2-6FFG672I serves as the physical layer serializer/deserializer and framing logic, handling 8B/10B encoding and elastic buffer deskew across lanes. Use Value: Four integrated RocketIO transceivers eliminate need for external PHY chips, reducing BOM cost and board area while maintaining <100 ppm BER at 3.125 Gb/s. | Use Scenario: Bridging legacy parallel bus peripherals (e.g., custom video capture engine) to modern serial infrastructure via Aurora or custom protocol. IC Role / Device Role / Timing Role: XC2VP2-6FFG672I acts as a protocol converter and clock domain crossing bridge, leveraging DCMs for precise clock alignment between source and destination domains. Use Value: On-chip DCMs enable sub-nanosecond skew control between transceiver reference clocks and fabric logic, ensuring reliable handshaking across asynchronous boundaries. |
| Industrial Control Data Aggregation | Test Equipment Signal Generator |
Use Scenario: Consolidating sensor inputs (LVDS camera streams, SPI temperature sensors) and generating synchronized PWM outputs for motor drives in factory automation. IC Role / Device Role / Timing Role: XC2VP2-6FFG672I functions as a real-time I/O concentrator and deterministic scheduler, using distributed RAM for input buffering and CLBs for state-machine control. Use Value: 204 user I/O pads support mixed-voltage signaling (1.5 V, 2.5 V, 3.3 V), enabling direct connection to diverse industrial sensors and actuators without level-shifter ICs. | Use Scenario: Generating calibrated multi-channel analog waveforms via external DACs in automated test equipment (ATE), requiring precise timing and jitter control. IC Role / Device Role / Timing Role: XC2VP2-6FFG672I operates as a waveform sequencer and jitter-clean clock distributor, using DCM outputs to drive DAC sample clocks with <50 ps peak-to-peak jitter. Use Value: Twelve DCM instances allow independent phase tuning per channel, enabling channel-to-channel skew compensation down to ±15 ps resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based serial interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP4-6FF672C | 6,768 logic cells, 1 PowerPC 405 block, same -6 speed grade and FFG672 package | Supports embedded software-defined control loops; adds cache-coherent processor subsystem | Select when firmware-driven protocol stack execution (e.g., TCP/IP offload) is required alongside transceiver logic |
| XC3S1600E-4FG484C | No transceivers; 1600 logic cells; Spartan-3E architecture; lower cost; 484-pin FG484 package | Limited to parallel or low-speed serial (≤200 Mbps) interfaces; no high-speed SERDES | Choose for cost-sensitive, non-transceiver applications where XC2VP2-6FFG672I's serial bandwidth is unnecessary |
Compared with XC2VP2-6FFG672I, XC2VP4-6FF672C offers embedded processing capability at higher logic density but identical transceiver count and speed, whereas XC3S1600E-4FG484C sacrifices all high-speed serial I/O for reduced cost and power in purely parallel-data applications.
Availability
XC2VP2-6FFG672I is available at Aetrix Electronics and suitable for high-reliability telecom infrastructure, industrial control gateways, and test equipment requiring stable component supply over extended product lifecycles.
Supply support for XC2VP2-6FFG672I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as its flagship high-performance FPGA platform for demanding system-level integration.
The Virtex-II Pro product line was designed specifically to integrate hard IP (RocketIO transceivers) with flexible fabric logic, targeting applications requiring both high-speed serial connectivity and customizable datapath processing without ASIC development cycles.
FAQ
What is the maximum guaranteed transceiver data rate for XC2VP2-6FFG672I?
The XC2VP2-6FFG672I is rated for RocketIO transceiver operation up to 3.125 Gb/s full-duplex per channel under -6 speed grade conditions, as confirmed in DS083 Table 4. This rate supports XAUI, Gigabit Ethernet, and Fibre Channel protocols. Operation above this rate is not guaranteed and requires validation against specific board layout and signal integrity constraints.
Does XC2VP2-6FFG672I include an embedded PowerPC processor?
No, XC2VP2-6FFG672I does not contain a PowerPC 405 processor block. As shown in Table 1 of DS083, only Virtex-II Pro devices starting from XC2VP4 and above integrate PowerPC cores. XC2VP2-6FFG672I provides pure FPGA fabric with transceivers, making it suitable for hardware-centric serial interface applications without embedded software requirements.
Which package type does XC2VP2-6FFG672I use, and what does "FFG672" signify?
XC2VP2-6FFG672I uses the FFG672 package: a 672-ball flip-chip fine-pitch BGA with 1.0 mm pitch. "FF" denotes flip-chip construction (superior thermal and electrical performance vs. wire-bond), "G" indicates lead-free (Pb-free) finish, and "672" specifies ball count. This package supports 204 user I/Os and is documented in DS083 Module 4 pinout tables.
Can XC2VP2-6FFG672I perform partial reconfiguration?
Yes, XC2VP2-6FFG672I supports partial reconfiguration as a feature of Virtex-II Pro architecture, enabled via SelectMAP or JTAG configuration interfaces. This allows dynamic logic module swapping without resetting the entire device - critical for adaptive communication systems. Implementation requires Xilinx ISE tools and proper floorplanning to isolate reconfigurable regions within the XC2VP2-6FFG672I fabric.
What I/O standards are supported by XC2VP2-6FFG672I's SelectIO-Ultra blocks?
XC2VP2-6FFG672I supports 22 single-ended standards (including LVCMOS 1.5 V/1.8 V/2.5 V/3.3 V, PCI, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). DCI enables on-die termination for most single-ended standards, while on-chip differential termination is available for LVDS and related variants - all configurable per bank in the XC2VP2-6FFG672I.
XC2VP2-6FFG672I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 672-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 352
- Number of Logic Elements/Cells:
- 3168
- Total RAM Bits:
- 221184
- Number of I/O:
- 204
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 672-FCBGA (27x27)
XC2VP2-6FFG672I FAQ
1.How can I place an order for XC2VP2-6FFG672I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP2-6FFG672I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP2-6FFG672I reliable?
The price and inventory of XC2VP2-6FFG672I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP2-6FFG672I is usually 5 days.
3.What payment methods are accepted for XC2VP2-6FFG672I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP2-6FFG672I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP2-6FFG672I?
XC2VP2-6FFG672I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP2-6FFG672I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP2-6FFG672I?
For technical support, including XC2VP2-6FFG672I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP2-6FFG672I requirements.
6.How does Aetrix verify that XC2VP2-6FFG672I is sourced from the original manufacturer or authorized distributors?
All XC2VP2-6FFG672I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP2-6FFG672I meets industry standards.
7.What is the process for return or replacement of XC2VP2-6FFG672I?
All XC2VP2-6FFG672I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP2-6FFG672I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP2-6FFG672I part is unused and in its original packaging.
Return procedure for XC2VP2-6FFG672I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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