AMD XC2VP2-6FG256C

Overview

XC2VP2-6FG256C from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (2.5 Gb/s max), and no embedded PowerPC processor block. It uses a 0.13 µm copper process, 1.5 V core supply, and supports SelectIO-Ultra I/O standards including LVDS and PCI-X. It targets high-speed serial interconnect in telecom and networking equipment.

For engineers reviewing the XC2VP2-6FG256C datasheet, pinout, applications, or equivalent options, key selection factors include its FG256 wire-bond BGA package (256 balls, 1.0 mm pitch), -6 speed grade timing (DCM jitter, I/O setup/hold), RocketIO transceiver compliance with Fibre Channel and Gigabit Ethernet, and absence of PowerPC cores-making it suitable for pure programmable logic + SERDES applications without embedded processing.

Technical Context

The XC2VP2-6FG256C implements a SRAM-based FPGA architecture with Configurable Logic Blocks (CLBs), 18×18-bit dedicated multipliers, and 12 Block SelectRAM+ modules (18 Kb each). Its 4 RocketIO transceivers operate at up to 2.5 Gb/s in wire-bond packages and integrate monolithic clock recovery, 8B/10B encoding, and on-chip 50 Ω termination.

Digital Clock Manager (DCM) modules provide phase shifting, frequency synthesis, and deskew for internal clocks; IOBs support DDR/LVDS with Digitally Controlled Impedance (DCI); and routing uses Active Interconnect Technology with predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2VP2-6FG256C is housed in a 256-ball Fine-Pitch Ball Grid Array (FG256) package with 1.0 mm pitch, wire-bond interconnect, and 140 user I/O pins. The package supports industrial-grade thermal dissipation and is Pb-free compatible (FGG256 variant available).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA + SERDES applications.

Compared with XC2VP2-6FG256C, XC2VP4-6FG456C adds embedded processing capability and I/O headroom at higher cost and power, while XC3S1000-4FG320C sacrifices integrated SERDES for gate density and price-making XC2VP2-6FG256C optimal for fixed-function, transceiver-centric designs requiring minimal footprint and deterministic serial performance.

Availability

XC2VP2-6FG256C is available at Aetrix Electronics and suitable for telecom line cards, Gigabit Ethernet switch fabrics, Fibre Channel nodes, and high-speed test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP2-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded hard IP and system-level integration.

The Virtex-II Pro family was designed for high-performance, mixed-signal system integration-combining FPGA fabric, multi-gigabit transceivers, and (in higher variants) PowerPC processors to replace ASICs in telecom, networking, and video infrastructure.

FAQ

What is the maximum data rate supported by the RocketIO transceivers in XC2VP2-6FG256C?

The XC2VP2-6FG256C supports RocketIO transceivers rated for up to 2.5 Gb/s in wire-bond packages like FG256. This rate complies with Fibre Channel (1.0625 Gb/s), Gigabit Ethernet (1.25 Gb/s), and 10G Attachment Unit Interface (XAUI) protocols. The -6 speed grade ensures timing closure at this rate under commercial temperature conditions. XC2VP2-6FG256C does not support RocketIO X (6.25 Gb/s), which is exclusive to Virtex-II Pro X devices.

Does XC2VP2-6FG256C include an embedded PowerPC processor core?

No, XC2VP2-6FG256C contains zero PowerPC 405 processor blocks. Per Table 1 in DS083, only XC2VP4 and higher Virtex-II Pro devices include one or two PowerPC cores. XC2VP2-6FG256C is optimized for pure programmable logic and serial transceiver applications without embedded software execution capability. This makes XC2VP2-6FG256C suitable for hardware-accelerated, real-time signal processing where deterministic latency is prioritized over firmware flexibility.

What package type and pin count does XC2VP2-6FG256C use?

XC2VP2-6FG256C uses the FG256 wire-bond fine-pitch BGA package with 256 balls arranged in a 1.0 mm pitch grid. It provides 140 user I/O pins, plus dedicated configuration, JTAG, and power/ground terminals. The FG256 package is distinct from flip-chip variants (e.g., FF672) and Pb-free FGG256 variants, all of which share identical pinout but differ in interconnect construction and RoHS compliance.

Can XC2VP2-6FG256C be configured via JTAG, and what modes are supported?

Yes, XC2VP2-6FG256C supports IEEE 1149.1 JTAG boundary-scan configuration through TCK, TMS, TDI, and TDO pins. It also supports slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan programming modes. JTAG enables in-system programming, debug access via ChipScope ILA, and readback of configuration memory and flip-flop states-critical for validation and field updates of XC2VP2-6FG256C-based systems.

What is the role of the Digital Clock Manager (DCM) in XC2VP2-6FG256C, and how many are available?

XC2VP2-6FG256C integrates four Digital Clock Manager (DCM) modules. Each DCM provides fully digital clock deskewing, frequency synthesis (integer/fractional multiplication/division), and fine-grained phase shifting (1/256 period resolution). These DCMs stabilize clock domains for source-synchronous interfaces like DDR SDRAM or RocketIO reference clocks, ensuring setup/hold timing margins. The presence of four DCMs allows independent clock domain management across multiple high-speed peripherals in XC2VP2-6FG256C designs.