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AMD XC2VP2-6FG256I
- Part No.:
- XC2VP2-6FG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2VP2-6FG256I.pdf
- Description:
- IC FPGA 140 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC2VP2-6FG256I from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (up to 2.5 Gb/s per channel), and no embedded PowerPC processor block - designed for high-speed serial interconnect in telecom and datacom line cards requiring deterministic I/O timing and SRAM-based reconfigurability.
For engineers reviewing the XC2VP2-6FG256I datasheet, pinout, applications, or equivalent options, this device serves as a fixed-function, non-processor FPGA with wire-bond BGA packaging, DCI-enabled I/O, and DCM-based clock management - critical for legacy 10/100/1000BASE-T PHY bridging, optical module control, and protocol-agnostic SERDES interface consolidation.
Technical Context
The XC2VP2-6FG256I implements a 0.13 µm nine-layer copper FPGA fabric with Active Interconnect routing, SelectIO-Ultra I/O banks supporting LVDS, SSTL, HSTL, and PCI-X, and Digitally Controlled Impedance (DCI) for on-die termination across 22 single-ended and 10 differential standards. Its 4 RocketIO transceivers operate at up to 2.5 Gb/s in wire-bond FG256 packages and support 8B/10B encoding, channel bonding, and internal loopback modes.
It contains 1,408 CLB slices (each with dual 4-LUTs and flip-flops), 44 18×18-bit signed multipliers, 12 Block SelectRAM+ modules (18 Kb each), and 4 Digital Clock Managers (DCMs) enabling precise phase shifting (1/256 period resolution), frequency synthesis, and deskew - all powered by 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and programmable 1.5–3.3 V I/O (VCCO) supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,168 - defines maximum combinational + sequential logic capacity for gate-equivalent RTL implementation |
| RocketIO Transceivers | 4 × full-duplex SERDES - enables four independent 600 Mb/s to 2.5 Gb/s serial links without external PHYs |
| Block RAM | 216 Kb (12 × 18 Kb SelectRAM+) - supports true dual-port, synchronous memory for packet buffering or FIFOs |
| Digital Clock Managers | 4 DCMs - provide jitter-tolerant clock multiplication/division, 90°/180°/270° phase shifts, and deskew for I/O timing closure |
| I/O Standards | 22 single-ended + 10 differential - includes LVDS (840 Mb/s), SSTL-2, HSTL Class I–IV, and PCI-X 133 MHz compliance |
| DCI Support | On-chip digitally controlled termination - eliminates external resistors for impedance-matched single-ended I/O traces |
| Configuration | SRAM-based, IEEE 1532-compliant - allows fast SelectMAP™ loading, partial reconfiguration, and bitstream encryption |
Pinout & Package
XC2VP2-6FG256I uses the FG256 wire-bond fine-pitch BGA package (17 mm × 17 mm, 1.0 mm pitch, 256 balls). Pin definitions are documented in DS083 Module 4 (Pinout Information), with dedicated banks for VCCO, VCCAUX, configuration (M0/M1/M2, CCLK, DONE, PROG_B), JTAG (TCK/TDI/TDO/TMS), and RocketIO transceiver pairs (TXP/TXN, RXP/RXN).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration clock input | Drives internal configuration state machine during master/slave serial or SelectMAP mode |
| DONE | Configuration status output | Open-drain signal indicating successful bitstream load and initialization completion |
| M0/M1/M2 | Mode select inputs | Set configuration mode (slave-serial, master-serial, slave SelectMAP, etc.) at power-up |
| TCK/TDI/TDO/TMS | JTAG boundary-scan interface | Enable IEEE 1149.1-compliant testing, programming, and debug access to IOBs and CLBs |
| TXP/TXN (per MGT) | Differential transmit pair | LVDS-compatible outputs driving serial data at up to 2.5 Gb/s with programmable swing (200–1600 mVpp) |
| RXP/RXN (per MGT) | Differential receive pair | High-sensitivity inputs with programmable equalization and on-chip 50 Ω termination |
Key Features
| Feature | Design Value |
|---|---|
| Active Interconnect routing | Predictable, fanout-independent delay via fourth-generation segmented matrix - essential for timing-critical high-speed designs |
| SelectIO-Ultra I/O architecture | Programmable drive strength (2–24 mA), slew rate control, and bank-specific VCCO - enables mixed-voltage board interfacing |
| Digitally Controlled Impedance (DCI) | Real-time on-die series/parallel termination matching trace Z₀ - reduces PCB layer count and improves signal integrity |
| 18 × 18-bit hardware multipliers | Dedicated DSP blocks supporting read-multiply-accumulate in one cycle - accelerates FIR filters and FFT kernels |
| Configurable Block SelectRAM+ | 18 Kb true dual-port RAM blocks configurable from 16K×1 to 512×36 - enables flexible buffer depth/width trade-offs |
Applications
| Optical Line Card Interface | Backplane Serial Link Aggregation |
|---|---|
Use Scenario: Aggregating multiple SFP+ or XFP optical modules into a unified 10 GbE or SONET OC-192 interface on carrier-grade line cards. IC Role / Device Role / Timing Role: FPGA fabric handles protocol mapping (e.g., GFP-F to HDLC), while RocketIO transceivers serialize/deserialize data at 2.488 Gb/s (STM-64) with 8B/10B encoding. Use Value: Eliminates discrete serializer ICs and reduces latency vs. software-based framing - meets ITU-T G.709 OTN timing budgets. |
Use Scenario: Replacing parallel bus backplanes (e.g., VME, CompactPCI) with low-pin-count serial lanes between processing and I/O blades. IC Role / Device Role / Timing Role: XC2VP2-6FG256I acts as a transparent SERDES bridge, converting parallel 32-bit/66 MHz PCI-X signals to four 2.5 Gb/s RocketIO lanes. Use Value: Reduces connector count by >70% and avoids skew-induced setup/hold violations inherent in wide parallel buses. |
| Industrial Protocol Gateway | Legacy Test Equipment Controller |
Use Scenario: Bridging Modbus TCP over Ethernet to PROFIBUS DP or CANopen in factory automation controllers. IC Role / Device Role / Timing Role: Configurable logic implements protocol state machines and packet translation; RocketIO links connect to external PHYs or optical isolators. Use Value: Enables field-upgradable protocol stacks without hardware redesign - leverages SRAM configuration and partial reconfiguration capability. |
Use Scenario: Controlling high-precision analog stimulus/response instruments (e.g., arbitrary waveform generators, spectrum analyzers) requiring deterministic trigger timing. IC Role / Device Role / Timing Role: DCMs generate sub-nanosecond-aligned clocks for DAC/ADC sampling; CLBs implement real-time pattern generation and response analysis logic. Use Value: Achieves <100 ps jitter on 100 MHz sampling clocks - exceeds IEEE 1149.4 mixed-signal test standard requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based serial interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP4-6FG256I | 6,768 logic cells, 1 PowerPC 405 core, same 4-RocketIO count - higher density and embedded processor capability | Required when firmware-driven control (e.g., Linux BSP, TCP/IP stack) must coexist with hardware-accelerated packet processing | Select if system requires soft-core CPU integration alongside SERDES; otherwise, XC2VP2-6FG256I offers lower cost and power |
| XC3S1000-4FG256C | No RocketIO transceivers; Spartan-3 architecture; 1000 logic cells; 1.2 V core; max I/O speed 622 Mb/s LVDS | Suitable only for lower-speed parallel-to-serial bridging (e.g., PCIe Gen1 x1, SATA 1.5 Gb/s with external PHY) | Choose only when serial bandwidth ≤ 622 Mb/s suffices and transceiver integration is unnecessary - avoids XC2VP2's obsolescence risk |
Compared with XC2VP2-6FG256I, XC2VP4-6FG256I adds processor capability at higher logic density and cost, while XC3S1000-4FG256C sacrifices integrated transceivers for lower price and simpler toolchain - making XC2VP2-6FG256I the optimal balance of embedded SERDES, I/O flexibility, and legacy design continuity.
Availability
XC2VP2-6FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, and legacy test equipment requiring stable component supply and long-term lifecycle support for maintenance and repair programs.
Supply support for XC2VP2-6FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-performance FPGAs for demanding communications and computing applications.
The Virtex-II Pro product line was engineered to integrate multi-gigabit transceivers and processor subsystems into a single SRAM-based FPGA fabric - targeting systems needing both hardware acceleration and serial connectivity without discrete PHYs or microcontrollers.
FAQ
Is XC2VP2-6FG256I still recommended for new designs?
No. XC2VP2-6FG256I is marked "Product Not Recommended For New Designs" in Xilinx DS083 (v5.0, June 2011). It remains available for legacy support, repair, and maintenance of deployed systems but lacks modern process node advantages, updated toolchain support, or extended lifecycle guarantees beyond current inventory.
What is the maximum RocketIO transceiver speed supported by XC2VP2-6FG256I?
XC2VP2-6FG256I supports RocketIO transceivers operating at up to 2.5 Gb/s in the -6 speed grade when used in the FG256 wire-bond package. This is confirmed in Table 4 of DS083, which specifies 2.5 Gb/s for wire-bond devices at -6 grade - not the higher 3.125 Gb/s achievable in flip-chip packages.
Does XC2VP2-6FG256I include an embedded PowerPC processor?
No. According to Table 1 in DS083, XC2VP2 has zero PowerPC processor blocks. Only XC2VP4 and higher-density Virtex-II Pro devices integrate the PowerPC 405 core. XC2VP2-6FG256I is a pure FPGA with transceivers - ideal for applications requiring SERDES offload without embedded software execution.
Which configuration modes does XC2VP2-6FG256I support?
XC2VP2-6FG256I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is initiated via M0/M1/M2 pins at power-up, and bitstreams may be encrypted using on-chip DES/3DES decryptors per DS083 Module 1.
Can XC2VP2-6FG256I operate in industrial temperature range?
Yes. The "I" suffix in XC2VP2-6FG256I denotes Industrial grade (-40°C to +100°C junction temperature). However, note that -7 speed grade devices are not available in Industrial grade per DS083 footnote - the -6 grade used here is qualified across the full industrial range.
XC2VP2-6FG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 352
- Number of Logic Elements/Cells:
- 3168
- Total RAM Bits:
- 221184
- Number of I/O:
- 140
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2VP2-6FG256I FAQ
1.How can I place an order for XC2VP2-6FG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP2-6FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP2-6FG256I reliable?
The price and inventory of XC2VP2-6FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP2-6FG256I is usually 5 days.
3.What payment methods are accepted for XC2VP2-6FG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP2-6FG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP2-6FG256I?
XC2VP2-6FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP2-6FG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP2-6FG256I?
For technical support, including XC2VP2-6FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP2-6FG256I requirements.
6.How does Aetrix verify that XC2VP2-6FG256I is sourced from the original manufacturer or authorized distributors?
All XC2VP2-6FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP2-6FG256I meets industry standards.
7.What is the process for return or replacement of XC2VP2-6FG256I?
All XC2VP2-6FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP2-6FG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP2-6FG256I part is unused and in its original packaging.
Return procedure for XC2VP2-6FG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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