AMD XC2VP2-6FG456C

Overview

XC2VP2-6FG456C from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (2.5 Gb/s max), and no embedded PowerPC processor block. It uses a 0.13 µm copper process with 1.5 V core voltage and supports SelectIO-Ultra I/O standards including LVDS, SSTL, and HSTL. It targets high-speed serial interconnect in telecom backplanes and industrial protocol bridging.

For engineers reviewing the XC2VP2-6FG456C datasheet, pinout, applications, or equivalent options, key selection considerations include its FG456 wire-bond BGA package (204 user I/Os), -6 speed grade timing (DCM jitter < 200 ps), RocketIO transceiver compliance with Fibre Channel and Gigabit Ethernet, and absence of PowerPC cores - distinguishing it from higher-density Virtex-II Pro variants.

Technical Context

The XC2VP2-6FG456C implements a SRAM-based configurable logic fabric with Configurable Logic Blocks (CLBs), 18 Kb Block SelectRAM+ memory blocks, and dedicated 18×18-bit multipliers. Its 4 RocketIO transceivers operate at up to 2.5 Gb/s in wire-bond packages and integrate monolithic clock recovery (CDR), 8B/10B encoding, and programmable pre-emphasis.

Digital Clock Manager (DCM) modules provide precise clock deskew, integer/fractional frequency synthesis, and ±1/256-cycle phase shifting. I/O architecture includes Digitally Controlled Impedance (DCI) for on-die termination and support for 22 single-ended and 10 differential standards - all controlled via configuration bitstream loaded through Slave SelectMAP or JTAG.

Key Specifications

Pinout & Package

XC2VP2-6FG456C uses the FG456 wire-bond fine-pitch BGA package (23 mm × 23 mm, 1.0 mm pitch) with 456 balls and 204 user I/Os. Pin definitions follow Xilinx DS083 Module 4, where ball positions map to dedicated I/O banks, clock inputs, configuration pins (M0–M2, CCLK, DONE), and RocketIO transceiver pairs (TXP/TXN, RXP/RXN).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based serial interface applications.

Compared with XC2VP2-6FG456C, XC2VP4-6FG456C adds embedded processing without changing PCB layout, while XC3S1000-4FG456C trades transceiver capability for gate density and unit cost - making it viable only when serial I/O is handled by companion chips.

Availability

XC2VP2-6FG456C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, broadcast video, and test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP2-6FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and platform devices with integrated hard IP. The company focuses on adaptive computing solutions for aerospace, communications, and data center markets.

The Virtex-II Pro family was designed to unify high-speed serial connectivity, programmable logic, and memory resources in a single chip - specifically targeting systems needing multi-gigabit transceivers without embedded processors, such as protocol mappers and signal synchronizers.

FAQ

What is the maximum data rate supported by the RocketIO transceivers in XC2VP2-6FG456C?

The XC2VP2-6FG456C supports RocketIO transceivers rated for up to 2.5 Gb/s in wire-bond packages like FG456. This rate complies with Fibre Channel (1.0625 Gb/s), Gigabit Ethernet (1.25 Gb/s), and XAUI (3.125 Gb/s) when used in multi-lane configurations. The -6 speed grade ensures timing closure at this rate under commercial temperature conditions. XC2VP2-6FG456C does not support RocketIO X (6.25 Gb/s) - that feature is exclusive to Virtex-II Pro X devices.

Does XC2VP2-6FG456C include an embedded PowerPC processor core?

No, XC2VP2-6FG456C contains zero PowerPC 405 processor blocks. Per Table 1 in DS083, only Virtex-II Pro devices starting from XC2VP4 and above integrate PowerPC cores. XC2VP2-6FG456C provides pure FPGA fabric with 3,168 logic cells, 4 RocketIO transceivers, and 204 user I/Os - optimized for logic-intensive serial interface applications without embedded software requirements. XC2VP2-6FG456C relies entirely on external microcontrollers or host processors for system-level control.

Which package and pin count does XC2VP2-6FG456C use?

XC2VP2-6FG456C uses the FG456 wire-bond fine-pitch BGA package with 456 balls and 204 user I/O pads. It is not offered in flip-chip (FF) variants. The package measures 23 mm × 23 mm with 1.0 mm ball pitch and supports standard reflow soldering. Pinout information is documented in DS083 Module 4, including dedicated configuration pins (CCLK, DONE, M0–M2), global clocks (GCLK0–GCLK3), and RocketIO differential pairs (MGTCLK0_P/N, TXP/TXN, RXP/RXN). XC2VP2-6FG456C shares footprint compatibility with other FG456 Virtex-II Pro devices but differs in I/O bank allocation due to resource count.

Can XC2VP2-6FG456C be configured via JTAG, and what modes are supported?

Yes, XC2VP2-6FG456C supports IEEE 1149.1 JTAG boundary-scan configuration in Boundary-Scan mode (IEEE 1532), enabling in-system programming and verification. It also supports Slave-Serial, Master-Serial, Slave SelectMAP, and Master SelectMAP modes using dedicated configuration pins. JTAG access allows readback of configuration memory, flip-flop states, and Block RAM contents for debugging. XC2VP2-6FG456C includes on-chip DES decryption for secure bitstream loading when encrypted bitstreams are used - a feature confirmed in DS083 Module 1.

What I/O standards are supported by XC2VP2-6FG456C's SelectIO-Ultra technology?

XC2VP2-6FG456C supports 22 single-ended I/O standards (including LVTTL, LVCMOS 3.3V/2.5V/1.8V/1.5V, PCI, PCI-X, GTL, HSTL Class I–IV, SSTL Class I/II) and 10 differential standards (LVDS, BLVDS, ULVDS, LDT, LVPECL). Digitally Controlled Impedance (DCI) provides on-die series or parallel termination for single-ended standards, eliminating external resistors. On-chip differential termination is available for LVDS, ULVDS, and LDT. XC2VP2-6FG456C does not support DDR2 or QDR interfaces - those require later Virtex families.