AMD XC2VP2-6FG456I

Overview

XC2VP2-6FG456I from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, four RocketIO multi-gigabit transceivers (up to 2.5 Gb/s per channel), and no embedded PowerPC processor block. It uses a 0.13 µm nine-layer copper process, supports 1.5 V core voltage (VCCINT), and is packaged in a 456-pin wire-bond fine-pitch BGA (FG456) with 156 user I/Os and industrial temperature rating (–40°C to +100°C). It targets high-speed serial interconnect applications in telecom and datacom systems.

For engineers reviewing the XC2VP2-6FG456I datasheet, pinout, applications, or equivalent options, key selection considerations include its -6 speed grade timing performance, FG456 package I/O count and ball map, RocketIO transceiver compliance with Fibre Channel and Gigabit Ethernet, and absence of PowerPC blocks - distinguishing it from higher-density Virtex-II Pro variants.

Technical Context

The XC2VP2-6FG456I implements a SRAM-based, in-system reprogrammable FPGA architecture with Configurable Logic Blocks (CLBs), 18 × 18-bit dedicated multipliers, 12 Block SelectRAM+ modules (each 18 Kb), and twelve Digital Clock Manager (DCM) units for precise clock synthesis, de-skew, and phase shifting. Its IOBs support SelectIO-Ultra technology including LVDS, SSTL, HSTL, and digitally controlled impedance (DCI) for on-chip termination.

RocketIO transceivers operate at up to 2.5 Gb/s in wire-bond packages (FG456), use monolithic CDR, support 8B/10B encoding, channel bonding (2–20 channels), and programmable pre-emphasis. The device lacks PowerPC 405 cores and RocketIO X transceivers - features reserved for XC2VP2 and above with "X" suffix or higher logic density.

Key Specifications

Pinout & Package

XC2VP2-6FG456I is housed in a 456-ball fine-pitch wire-bond BGA (FG456 package), 23 mm × 23 mm, 1.0 mm pitch, RoHS-compliant. Ball grid includes dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B), JTAG TAP signals (TCK/TDI/TDO/TMS), 156 user-configurable I/Os grouped into 16 banks, four RocketIO transceiver pairs (TXP/TXN/RXP/RXN), and power/ground balls distributed for signal integrity and thermal management.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based serial interconnect applications.

Compared with XC2VP2-6FG456I, XC2VP4-6FG456I adds an embedded PowerPC core for firmware-driven control but increases power and complexity; XC3S1000-4FG456C offers more I/Os and lower cost but lacks transceivers entirely - making it unsuitable for native 2.5 Gb/s serial applications.

Availability

XC2VP2-6FG456I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video encoding, and high-speed test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP2-6FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-II Pro family was designed for high-performance system integration - combining FPGA fabric, multi-gigabit transceivers, and embedded processors to replace ASICs in telecom, networking, and DSP applications.

FAQ

What is the maximum data rate supported by the RocketIO transceivers in XC2VP2-6FG456I?

The XC2VP2-6FG456I supports RocketIO transceivers rated up to 2.5 Gb/s in wire-bond packages like FG456. This applies to both transmit and receive paths under -6 speed grade conditions at industrial temperature. The transceivers comply with Fibre Channel, Gigabit Ethernet, and XAUI protocols at this rate, and require proper AC coupling and differential termination per channel.

Does XC2VP2-6FG456I include an embedded PowerPC processor core?

No, XC2VP2-6FG456I does not contain a PowerPC 405 processor block. According to Table 1 in DS083, only devices starting from XC2VP4 and above integrate PowerPC cores. XC2VP2 is the smallest Virtex-II Pro member with RocketIO transceivers but zero processor blocks - making it suitable for pure hardware-accelerated serial interface applications.

What package type and pin count does XC2VP2-6FG456I use?

XC2VP2-6FG456I uses the FG456 wire-bond fine-pitch BGA package: 456 balls, 23 mm × 23 mm, 1.0 mm pitch. It provides 156 user I/O pins, four RocketIO transceiver pairs (8 differential pins), and dedicated configuration and JTAG pins. The "FG" prefix confirms wire-bond construction, distinct from flip-chip "FF" packages used in higher-density variants.

Can XC2VP2-6FG456I be configured via JTAG boundary scan?

Yes, XC2VP2-6FG456I fully supports IEEE 1149.1 JTAG boundary-scan through TCK, TDI, TDO, and TMS pins. It implements BYPASS, SAMPLE, PRELOAD, EXTEST, INTEST, and HIGHZ instructions, enabling in-system programming, I/O pin testing, and configuration verification without requiring dedicated configuration mode pins.

Is XC2VP2-6FG456I recommended for new designs?

No - XC2VP2-6FG456I is marked "Product Not Recommended For New Designs" in Xilinx DS083 (v5.0, June 2011). It remains available for legacy support and obsolescence management, but Xilinx recommends Virtex-4, Virtex-5, or newer families for new development due to improved performance, power efficiency, and toolchain support.